<p>➀ Micron is sampling HBM4 memory stacks based on its 1ß DRAM process and 12-high packaging, aiming for volume production in 2026;</p><p>➁ The HBM4 offers 2.0 TB/s bandwidth per stack, 60% faster performance than HBM3E, and 20% improved power efficiency;</p><p>➂ SK Hynix plans HBM4 mass production on 3nm in H2 2025, while Samsung develops 4nm-based HBM4, both collaborating with TSMC for base dies and COWOS packaging.</p>