Recent #3nm news in the semiconductor industry

9 months ago
➀ The rise of RISC-V cores and the challenges of certification; ➁ The role of Breker Verification Systems in the certification process; ➂ The complexity of certifying RISC-V ISA implementations and the efforts of RISC-V International.
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11 months ago
➀ ASML, the Dutch chip equipment manufacturer, has announced a reduction in its 2025 order forecast, causing a significant drop in its share price. ➁ The CEO of ASML suggests that despite U.S. export restrictions, China may still be capable of producing 5nm and 3nm chips. ➂ The situation reflects the ongoing competition and technological advancements in the semiconductor industry.
3nm5nmASMLChinaChip productionEUVSEMICONDUCTORexport restrictionstechnology
11 months ago
➀ Google is rumored to switch to TSMC's N3E process for Tensor G5; ➁ The report also clarifies that Google has chosen not to use 2nm technology for Tensor G6; ➂ The move could impact the competition in the AI and smartphone chip markets.
2nm3D IC3nmAIAI PCAI chipAMDASUSArmCPUChipletDRAMDellEDAGDDRGPUGaNHBMHPCInfineonLinuxNPUNVIDIAPCIePrivacyRaspberry PiSEMICONDUCTORSK hynixSSDSwitchTITSMCautomotivecoolingcybersecuritygamingiOSlaptopmemorymicrochipmonitorsoftware
11 months ago
➀ Arm is exploring the feasibility of running LLMs on mobile devices; ➁ Arm's optimization techniques for LLMs on mobile; ➂ The importance of practical use cases for LLMs in mobile devices
2nm3D IC3nmAIAI PCAI chipAMDASUSArmCPUChipletDRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonLinuxMobileNPUNVIDIAPCIePrivacyRaspberry PiSEMICONDUCTORSK hynixSSDSwitchTIautomotivecoolingcybersecuritygamingiOSlaptopmemorymicrochipmonitorsoftware
11 months ago
➀ Electron Beam Probing (EBP) has become a powerful method for security analyzing of sub-7nm ICs. ➁ It offers better spatial resolution than optical probing and is suitable for sub-7nm flip-chips and advanced 3D architectures. ➂ The research focuses on the importance of EBP in failure analysis and hardware assurance.
2nm3nmAI chipAMDASUSDellEDAEUVGDDRGaNHPCICInfineonLinuxPCIePrivacyRaspberry PiSEMICONDUCTORSecuritySwitchautomotivecoolingcybersecuritygamingiOSlaptopmemorymicrochipmonitorsoftwaretechnology
10 months ago

➀ TSMC is considering raising prices for its in-demand 3nm process and CoWoS advanced packaging technology to meet the huge demand.

➁ TSMC plays a crucial role in the manufacturing of high-performance computing and cloud AI chips, with a significant demand for its advanced processes and packaging technologies.

➂ Reportedly, TSMC plans to implement the price increase in 2025 with NVIDIA's approval, affecting the entire supply chain.

3nmCoWoSTSMC
10 months ago
➀ Researchers from Queen Mary University of London have developed new nanocomposite films from starch, offering a sustainable alternative to petroleum-based materials; ➁ The films are made from abundant natural polymer starch and highly conductive MXene, with potential applications in electronics and sensing; ➂ The nanocomposites can be tailored for various uses, including wearable technology and healthcare, and are biodegradable.
2nm3D IC3nmAIAI ChipAI PCAMDArmAsusChipletCoolingDRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonLaptopLinuxMicrochipNPUNVIDIAPCIePrivacyRaspberry PiSSDSoftwareSwitchTIautomotivecpucybersecuritygamingiosmemorymonitorsemiconductor
11 months ago

➀ TSMC reports a strong demand for 2nm nodes over 3nm, with A16 attracting AI server clients.

➁ TSMC's 3nm shipments accounted for 20% of total wafer revenue in Q3 2024.

➃ TSMC's 2nm is expected to enter volume production in 2025.

➄ TSMC plans to expand its 2nm capacity to meet strong demand.

➅ TSMC's A16 process is highly attractive for AI server applications.

2nm3nmA16AI ServerHigh-Performance ComputingTSMC
11 months ago
➀ Imec spin-off Brailsports is developing a platform for optimizing athlete training volumes and schedules based on data analysis; ➁ The platform uses AI models to estimate individual athlete fitness and fatigue, improving performance and reducing injury risk; ➂ The platform is currently operational at cycling team Lotto Dstny, with positive results.
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11 months ago
➀ The research investigates the effects of adding TiC nanoparticles to aluminum alloy 7075, aiming to enhance casting performance and improve fluidity and surface quality; ➁ TiC nanoparticles were introduced in two concentrations, and their impact on fluidity and microstructure was analyzed; ➂ The results showed a significant improvement in fluidity and surface quality, with finer grain sizes and smoother surfaces.
2nm3D IC3nmAIAI ChipAMDArmAsusChipletCoolingDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonLaptopLinuxMicrochipNPUNVIDIAPCIePrivacyRaspberry PiSSDSoftwareSwitchTIautomotivecpucybersecurityiosmemorymonitorsemiconductor