➀ Modern electronic design trends necessitate SI-PI cosimulation to minimize power consumption and voltage levels while increasing speed. ➁ The PDN should be meticulously modeled to minimize input impedance seen by I/O drivers, and combined with channel models to accurately predict output eye diagrams. ➂ The article details the complete modeling process of SI-PI cosimulation based on HBM, highlighting considerations for high-frequency PDN design at the chip and package levels.

➀ Q2 IC sales increased by 27% YoY and are expected to grow by 29% in Q3 2024. ➁ Q2 installed fab capacity reached 40.5 million wafers per quarter, projected to rise by 1.6% in Q3. ➂ Memory capacity increased by 0.7% in Q2 and is forecast to grow by 1.1% in Q3, supported by demand for HBM and improving memory pricing.

➀ HBM market is rapidly expanding due to its critical role in AI computing, with SK Hynix leading in supply and innovation. ➁ SK Hynix is collaborating with TSMC to maintain its lead in the next-generation HBM products, which are expected to see a 40% increase in transmission speed. ➂ Samsung is increasing its investment in HBM to catch up, with plans to quadruple its supply in 2024 and double it again in 2025.

➀ HBM is crucial for AI but expensive, with prices up to 5 times that of DDR5. ➁ Jim Keller, a prominent chip architect, criticizes the high cost of AI chips and advocates for alternatives to HBM. ➂ Tenstorrent, a company led by Keller, aims to provide cost-effective AI solutions without using HBM, focusing on efficiency and affordability.

➀ HBM addresses bandwidth limitations in traditional 2D packaging by using stacked memory chips and TSV technology. ➁ Key technologies in HBM include advanced packaging, microbump interconnects, and TSV. ➂ HBM offers higher bandwidth and lower power consumption compared to GDDR, making it suitable for high-performance computing and graphics processing.

➀ SK hynix has secured up to $450 million in direct funding and access to $500 million in loans to build an advanced memory packaging facility in Indiana. ➁ The facility is expected to start operations in 2028, producing HBM4 or HBM4E memory. ➂ The project aims to strengthen the U.S. semiconductor industry and create up to 1,000 jobs.

➀ SK Hynix is set to receive $450 million from the US Chips Act to build a $3.87 billion HBM packaging plant in Indiana. ➁ The facility, located at Purdue University Research Park, will mass-produce next-generation HBM chips, crucial for AI system training. ➂ The investment will establish a research hub in Indiana in partnership with Purdue University, enhancing the U.S. semiconductor ecosystem and technological leadership.

1. Introduction to High Bandwidth Memory (HBM); 2. Key features of HBM: high memory bandwidth, low power consumption, large memory capacity, and fast transfer rates; 3. Importance of understanding HBM characteristics for appreciating its impact on technology.

1. Samsung is set to introduce a revolutionary technology that allows stacking High Bandwidth Memory (HBM) on CPUs or GPUs this year. 2. The SAINT-D HBM, a key component of this technology, is scheduled for a 2024 rollout. 3. This development paves the way for the integration of HBM4 with Samsung's SAINT-D interconnection and packaging technology.