➀ SK Hynix aims to develop differentiated HBM products to meet specific customer needs in the AI sector. ➁ The company's Advanced Package Development leader emphasizes the need for flexible and scalable technology in AI memory development. ➂ HBM memory has evolved rapidly, with HBM3E reaching 9.2 GT/s - 10 GT/s and HBM4 set to feature a 2048-bit interface. ➃ SK Hynix plans to offer customized or semi-customized HBM4 solutions, considering various customer preferences and technologies.
Related Articles
- Micron confirms memory price hikes as AI and data center demand surges2 months ago
- Contactless Timing for Paralympic Swimming2 months ago
- Fishing2 months ago
- Ed Tackles PIP2 months ago
- The week in chip news: Nvidia's GTC 2025 blitz, new NVMe HDDs and watercooled SSD, Intel's restructuring begins2 months ago
- Reprogramming Liver Immunity: A Lipid Nanoparticle Approach for Pancreatic Cancer Therapy3 months ago
- Ed Eyes Up €1trn3 months ago
- POSTECH-Led Collaboration Achieves Breakthrough in EV Battery Performance3 months ago
- Hannover Messe: Ultra-Thin Silicon Films Lead to Energy-Saving and Lightweight Pumps and Valves3 months ago
- The Last of Us challenged the views of Nintendo's Miyamoto and God of War's Jaffe3 months ago