➀ The transition of AI servers from HBM to CXL technologies; ➁ The importance of high-speed memory bandwidth in AI servers; ➂ The rise of HBM technology to overcome 'memory wall' issues; ➃ Market dominance of HBM suppliers like SK Hynix, Samsung, and Micron; ➄ The impact of new interconnect technologies like CXL and MCR/MDIMM on AI server performance; ➅ Micron's product roadmap and Rambus' interconnect solutions; ➆ The significance of SPD EEPROMs in DDR5 memory systems.