➀ GlobalFoundries receives $9.5 million in federal funding; ➁ The funding is for GaN on silicon semiconductor manufacturing; ➂ The goal is to move closer to large-scale production of GaN chips.
Recent #GaN news in the semiconductor industry
➀ The article discusses a three-phase ANPC based on GaN technology; ➁ The design details, including GaN power devices, modular construction, and voltage sensing, are outlined; ➂ The design's efficiency, flexibility, and potential applications in solar inverters and power conversion systems are highlighted.
➀ Navitas Semiconductor introduces the world's first 8.5kW AI power supply with GaN and SiC technologies; ➁ The PSU achieves 98% efficiency and meets OCP and ORv3 standards; ➂ The PSU is suitable for AI and hyperscale data centers and EV charging.
➀ GaN adaptors offer up to 95% efficiency, significantly higher than silicon's 80-85%; ➁ They are smaller and more powerful, enabling faster charging and multi-device charging with one compact adapter; ➂ Challenges include PCB design and thermal management, but GaN is set to transform charger markets.
➀ Infineon introduces an isolated power supply IC for gate drivers of high-power devices; ➁ The 2EP1xxR family offers various output voltage configurations; ➂ The devices are suitable for applications like solar power, electric vehicle charging, and energy storage.
➀ The article discusses the promise of GaN switches for higher efficiency and power density in switch-mode power supplies (SMPS); ➁ It covers the readiness of this technology and its challenges; ➂ It provides an outlook on GaN switches potentially replacing silicon in SMPS.
➀ This reference design from Texas Instruments introduces a compact power solution for various charging applications using GaN technology; ➁ It improves efficiency and power density with reduced losses and higher switching frequencies; ➂ The design allows for smaller inductors, reduced core sizes, and fewer primary windings, making it suitable for mobile wall chargers and USB wall power outlets.
➀ The University of Siegen will host two major international conferences, CARV and MCPC 2025, focusing on future industrial challenges such as handling global disruptions in production and supply chains and developing intelligent systems for customized product manufacturing. ➁ The conferences will take place from September 9 to 12, 2025, with experts from around the world expected to discuss current developments and future challenges under the theme 'New Paradigms for Anticipated Uncertainty'. ➂ The two conferences, CARV and MCPC, will address complementary topics: CARV on agile and reconfigurable production systems and sustainable manufacturing processes, and MCPC on the use of digital technologies and product personalization through individual mass production.
➀ Cambridge GaN Devices and Qorvo have collaborated on a new evaluation kit combining their motor control and power efficiency technologies; ➁ The kit features Qorvo's high-performance motor controller/driver and CGD's ICeGaN ICs, achieving up to 800W peak performance; ➂ The technology is aimed at markets requiring compact, high-efficiency motor control systems.
➀ MACOM has acquired ENGIN-IC, a fabless semiconductor company specializing in GaN MMICs and integrated microwave assemblies. ➁ The company, founded in 2014, has focused on serving the U.S. defense industry and has a product portfolio that includes over 60 standard MMICs and many custom MMICs. ➂ The acquisition is expected to strengthen MACOM's capabilities in its target markets.
➀ Introducing the Elegoo Neptune 4 Pro 3D printer at an affordable price; ➁ Review highlights fast print speeds and excellent quality; ➂ Special discount available on Elegoo's website
➀ Power Integrations introduces the InnoMux-2 IC, a breakthrough in GaN technology, capable of 1700 V operation and high efficiency. ➁ The IC leverages PowiGaN technology and offers a cost-effective alternative to SiC solutions. ➂ The IC is suitable for automotive chargers, solar inverters, and industrial systems, providing precision multi-output regulation and low loss operation.
➀ Researchers from Queen Mary University of London have developed new nanocomposite films from starch, offering a sustainable alternative to petroleum-based materials; ➁ The films are made from abundant natural polymer starch and highly conductive MXene, with potential applications in electronics and sensing; ➂ The nanocomposites can be tailored for various uses, including wearable technology and healthcare, and are biodegradable.
➀ Texas Instruments (TI) has started production of GaN-based power semiconductors at its Aizu factory in Japan; ➁ The expansion is in addition to TI's existing GaN manufacturing in Dallas, Texas; ➂ The capacity for GaN-based power semiconductors will be quadrupled.
➀ Raspberry Pi introduces the new AI HAT+ with two variants, 13 and 26 TOPS; ➁ The HAT+ is based on Hailo-8 neural network inference accelerators; ➂ The 26 TOPS variant is designed for larger networks and can run multiple networks simultaneously.
➀ Imec spin-off Brailsports is developing a platform for optimizing athlete training volumes and schedules based on data analysis; ➁ The platform uses AI models to estimate individual athlete fitness and fatigue, improving performance and reducing injury risk; ➂ The platform is currently operational at cycling team Lotto Dstny, with positive results.
➀ Japanese companies are ramping up mass production of GaN power semiconductor devices for electric vehicles to increase range, although high costs remain a barrier.
➁ GaN is competing with SiC for applications in electric vehicle power semiconductor devices.
➂ GaN has very low power loss, which could reduce the charging time for electric vehicles from 90 minutes to 5 minutes.
➃ Companies like Sumitomo Chemical and Mitsubishi Chemical are investing in large diameter substrates to lower production costs.
➄ Toyota Synchro Corporation is working on integrated development from seeds to substrates and devices.
➅ Shin-Etsu Chemical is developing 300mm substrates for horizontal devices and 200mm substrates for vertical devices.
➆ GaN devices have a market size of over $2.3 billion in 2030, expected to grow from $220 million in 2023.
➀ Cambridge GaN Devices will demonstrate its ICeGaN products at the IEEE Energy Conversion Congress and Expo in Phoenix. The demos include a 3 kW PFC reference design, a QORVO motor drive evaluation kit, and a slim 100W adapter among others.➁ The company's ICeGaN products are monolithic GaN ICs with power HEMT and support circuitry.➂ The demo also features a comparison of ICeGaN versus discrete GaN circuits.
➀ The research investigates the effects of adding TiC nanoparticles to aluminum alloy 7075, aiming to enhance casting performance and improve fluidity and surface quality; ➁ TiC nanoparticles were introduced in two concentrations, and their impact on fluidity and microstructure was analyzed; ➂ The results showed a significant improvement in fluidity and surface quality, with finer grain sizes and smoother surfaces.
➀ Nexperia announced a $200 million investment in Germany to develop next-generation wide bandgap semiconductors; ➁ SiC and GaN semiconductors are driving the next generation of electronic devices due to their high performance; ➂ The demand for SiC is growing exponentially with the global promotion of new energy vehicles; ➃ Nexperia is focusing on SiC MOSFETs for the transition from 400V to 800V battery systems in electric vehicles; ➄ Nexperia offers a comprehensive range of GaN devices for industrial and renewable energy applications; ➅ Nexperia is investing in 8-inch wafer production to capture market opportunities.