➀ TSMC and Intel are reportedly still working on a potential joint venture to run Intel's manufacturing capacity;

➁ The joint venture would involve leading American fabless chip designers such as AMD, Broadcom, Nvidia, and Qualcomm;

➂ The initiative is in response to a request from President Trump's administration to strengthen Intel and ensure continued American control.

➀ The CHIPS and Science Act, aimed at strengthening U.S. semiconductor manufacturing, is under threat of repeal by the Trump administration.

➁ The Act has already attracted nearly $450 billion in private investment from leading companies, raising concerns about the impact of its repeal on the U.S. chip market.

➂ Political hurdles and legal obligations make the repeal process complex and challenging.

➀ TSMC is in talks with Intel, Nvidia, Broadcom, Qualcomm, and AMD about a joint venture to acquire Intel Foundry;

➁ TSMC plans to take a stake of no more than 50% in Intel Foundry to maintain US ownership, as required by the White House;

➂ The deal requires approval from the White House.

➀ A roundup of the latest electronics news from Embedded World 2024, covering automotive, military, telecoms, industrial, and consumer electronics sectors.

➁ Infineon is launching a RISC-V starter kit for automotive microcontrollers.

➂ NXP reveals MCX MCUs with Matter, Thread, Zigbee, and Bluetooth LE.

➀ President Trump criticized Intel's post-Grove CEOs over the weekend, expressing disappointment with their leadership.

➁ He praised Andy Grove, Intel's former CEO, for his significant contributions to the company's growth.

➂ Trump acknowledged the shift in the semiconductor industry, with Intel losing market share and the industry becoming more concentrated in Taiwan.

➀ Ed的英特尔CEO职位申请似乎遇到了挫折；

➁ 在与董事会会面并讨论英特尔过去五年问题后，Ed提出了对董事会和半导体行业经验的批评；

➂ 会谈结束后，Ed被要求离开，感到遗憾。

➀ The ASRock B860I Lightning is a budget-friendly Mini-ITX motherboard offering robust power delivery and a variety of features for around $220.

➁ It boasts a PCIe 5.0 M.2 socket, integrated Thunderbolt 4, and improved audio, while still offering Wi-Fi 6E.

➂ Performance was average, but gaming performance was competent with default settings.

➀ Intel's 18A process is reported to have a yield of 20-30% by analyst Ming-Chi Kuo;

➁ This low yield will delay the release of Panther Lake processors for notebooks, impacting Intel's financials and customer confidence;

➂ Notebook manufacturers may use limited qualification samples to introduce Panther Lake into products, as TSMC's 2nm process yields are higher than Intel's 18A.

➀ The article lists the world's top ten supercomputers, including their names, locations, and key specifications such as processors, GPUs, and power consumption.

➁ It highlights the use of advanced technologies like exascale systems, custom processors, and AI capabilities in these supercomputers.

➂ The article also mentions the applications of these supercomputers in various fields such as energy resource location, climate research, and astrophysics.

➀ The Intel Xeon 6700P “Granite Rapids-SP” includes SKUs with a feature that splits cores into high-priority and low-priority cores;

➁ This setup has caused some rumors, but the article clarifies that there are no E-cores on Granite Rapids-SP parts;

➂ The feature allows for higher base frequencies on some cores for improved responsiveness, especially under light loads.

➀ The investor community is in a state of uncertainty about Intel's future;

➁ TSMC's preference for building its own fabs over taking over Intel's has raised concerns;

➂ The US administration's view on Intel's capability to be a leading-edge domestic supplier is questioned.

➀ Engineered substrate technology is driving the semiconductor industry from traditional planar scaling to innovative materials and 3D integration.

➁ Companies like Soitec, Intel, and Samsung are leading the adoption of this technology.

➂ Foundries are increasingly recognizing the strategic importance of engineered substrates like Fully Depleted SOI (FD-SOI) for their benefits in cost and performance.

➀ Intel has delayed its Ohio semiconductor manufacturing site, originally planned for 2025, to at least 2030.

➁ The first phase of the Ohio site (Mod 1) will now be completed in 2030, with production starting between 2030 and 2031.

➂ Intel's $28 billion Ohio chipmaking factories are located in New Albany, with the delay made to align factory operations with market demand.

➀ Intel has launched new network adapters, the E830 series for 25GbE to 200GbE and the E610 series for 10GbE and 2.5GbE, with PCIe Gen4 support.

➁ The E830 series offers up to 200GbE throughput, while the E610 series supports multi-gigabit speeds with up to 50% lower power consumption.

➂ These new adapters are expected to be available in 2025, focusing on server applications with OCP NIC 3.0 slots.

➀ This article provides a comprehensive hierarchy of GPU performance, ranking nearly every GPU released in the past seven years based on benchmarks.

➁ The article discusses the performance of GPUs across different resolutions and the impact of technologies like ray tracing and DLSS.

➂ It highlights the latest GPUs from Nvidia's Ada Lovelace and AMD's RDNA 3 architectures, as well as Intel's Arc GPUs.

➀ Intel has begun production with the first two of ASML's advanced lithography machines in its factory, showing early data indicating increased reliability over earlier models.

➁ Intel, which became the first chip manufacturer to receive these machines last year, plans to use them to develop 18A manufacturing technology for mass production later this year.

➂ Imec has demonstrated the first electrical yield results from 20nm spacing metal lines patterned using High NA EUV single patterning technology, showing good electrical yield and fewer random defects.

➀ The Intel Xeon 6700P and 6500P Granite Rapids-SP processors are introduced, with the 6700P R1S being highlighted for its single-socket capabilities with 136 PCIe Gen5 lanes.

➁ The processors offer 8-channel DDR5 support and access to onboard accelerators like QAT.

➂ The review compares the Intel offering with AMD's EPYC 9000 series, noting Intel's advantage in PCIe Gen5 lanes and memory bandwidth.

➀ The new Intel Xeon 6 SoC, codenamed Granite Rapids-D, is expected to have up to 72 cores by late 2025;

➁ The initial batch will have up to 42 cores, with networking speeds of up to 200Gbps;

➂ The new series includes vRAN Boost and various built-in accelerators, targeting embedded markets.

➀ Intel has launched a new 'Value Pack' CPU option in South Korea, offering savings for PC DIYers and gamers.

➁ The 'Value Pack' features no-frills packaging, reducing costs while maintaining the same quality and warranty service.

➂ The price difference is approximately $7, making the Value Pack an attractive option for cost-conscious consumers.

➀ Intel has announced that its Intel 18A process, the final and most important in its 'four years, five nodes' plan, is ready for tape-out in the first half of this year;

➁ The 18A process represents a significant breakthrough for Intel's IDM 2.0 strategy and is seen as a key signal for the revitalization of Intel Foundry Services (IFS);

➂ The 18A process will introduce several advanced semiconductor technologies, with a 30% increase in chip density and a 15% improvement in performance per watt compared to Intel's 3nm process;

➃ Intel plans to apply the 18A process to the upcoming Panther Lake laptop processors and Clearwater Forest server CPUs;

➄ The ribbonFET full-gate transistor and PowerVia backside power supply technology are the two major breakthroughs of the 18A process;

➅ The ribbonFET transistor achieves a full-gate (GAA) architecture, providing finer control of current flow and reducing power consumption and leakage;

➆ PowerVia backside power supply technology changes the logic of chip wiring, making the power supply path for transistors more direct and improving power supply efficiency;

➇ Intel's next-generation mobile processor Panther Lake and desktop processor Nova Lake will be based on the Intel 18A process, with the server CPU Clearwater Forest also planned for release in the first half of 2026;

➈ Intel will also cooperate with external chip design companies to customize chips, such as Amazon and Microsoft.