➀ SK hynix has secured up to $450 million in direct funding and access to $500 million in loans to build an advanced memory packaging facility in Indiana. ➁ The facility is expected to start operations in 2028, producing HBM4 or HBM4E memory. ➂ The project aims to strengthen the U.S. semiconductor industry and create up to 1,000 jobs.

➀ SK Hynix is set to receive $450 million from the US Chips Act to build a $3.87 billion HBM packaging plant in Indiana. ➁ The facility, located at Purdue University Research Park, will mass-produce next-generation HBM chips, crucial for AI system training. ➂ The investment will establish a research hub in Indiana in partnership with Purdue University, enhancing the U.S. semiconductor ecosystem and technological leadership.

❶ SK hynix has announced its GDDR7 memory with 32 Gbps speeds, 60% faster than GDDR6, and 50% improved power efficiency. ❷ The company achieved this through enhanced heat dissipation techniques. ❸ SK hynix plans to begin mass production in Q3 2024, targeting applications beyond gaming including AI and high-performance computing.

1. SK Hynix is set to launch GDDR7 memory in Q4 this year, which is designed to boost GPU performance. 2. The company has clarified that its GDDR7 memory is on schedule for mass production despite earlier contradictory statements from a booth representative.