<p>➀ SK Hynix has been granted a government subsidy of up to 3.3 billion USD by the US Department of Commerce.</p><p>➁ The subsidy is intended to help establish an advanced chip packaging factory and AI product development facilities in Indiana.</p><p>➂ The factory will also build an assembly line for mass production of next-generation high-bandwidth memory (HBM) chips, which will be equipped in graphics processing units (GPUs) for training AI systems.</p>