➀ The article introduces LabVIEW as a powerful graphical programming tool for simulating analog (AM, FM) and digital modulation techniques (ASK, FSK, PSK), enabling real-time visualization of communication systems;

➁ Detailed block diagrams and mathematical expressions of AM, FM, and PM are explained alongside LabVIEW simulation implementations, showcasing parameter adjustments and waveform results;

➂ LabVIEW's interactive environment is highlighted as an effective educational tool for students and engineers to understand modulation principles and applications in wireless, broadcasting, and telemetry.

➀ U.S. President Trump imposed a ban on the sale of EDA tools to China, impacting semiconductor industry relations;

➁ SCI Semiconductor secured £2.5 million funding for developing a secure microcontroller based on the 'Cheri' architecture, backed by Microsoft and Google, which enhances hardware security through metadata-bound memory pointers;

➂ iSpace EUROPE plans to deliver a UNESCO cultural heritage payload, the "Memory Disc V3," to the Moon via a lunar micro-rover, symbolizing a modern Rosetta Stone mission.

➀ EnSilica, a mixed-signal ASIC specialist, established a new engineering hub in Cambridge and recruited six engineers (including four PhD holders), expanding its global workforce to 190;

➁ The expansion strengthens its mmWave/RF IC design capabilities to meet rising customer demand in satellite and communications markets;

➂ Supported by UK Space Agency funding and contract wins, the move aims to attract talent and capitalize on growth opportunities.

➀ Siemens Digital Industries Software announces acquisition of Excellicon, a specialist in timing constraints software for chip design;

➁ The deal aims to enhance power, performance, and area (PPA) optimization in Siemens' EDA tools, accelerate design closure, and improve workflow efficiency;

➂ Excellicon's timing constraint management technology will integrate with Siemens' Questa, Tessent, and other platforms to strengthen verification and implementation processes.

➀ Fraunhofer IST introduces new simulation approaches to integrate numerical modeling into industrial practice, reducing physical tests and optimizing processes like vacuum coating and water treatment;

➁ The institute utilizes a proprietary PICMC/DSMC solver and CFD methods for plasma and gas flow simulations, aiming to democratize simulation access for non-experts;

➂ Future plans include AI integration, data-driven modeling, and talent development through academic courses to advance digital twins and sustainable industrial processes.

➀ The Elektra Awards 2025, organized by Electronics Weekly, are now open for entries, celebrating innovation in the electronics industry and recognizing excellence across sectors;

➁ New categories for 2025 include the Entrepreneurial Star (under 35) and Neurodiversity Product Design Award, focusing on young entrepreneurs and inclusive product development;

➂ Submissions are free and judged by industry professionals, with entries closing on 13 June 2025, and the awards ceremony scheduled for 9 December in London.

➀ The acatech Impuls report advocates for open-source chip design tools to reduce dependencies on proprietary systems dominated by U.S. firms, enhance Europe's digital sovereignty, and accelerate semiconductor innovation;

➀ Open-source tools are highlighted as critical for specialized applications (e.g., quantum computing) and fostering SME/startup participation, while lowering barriers for academic research and talent development;

➂ The report calls for a unified European semiconductor strategy, including platforms to integrate open-source tools into industrial workflows and adapt policies to evolving geopolitical challenges.

➀ Siemens and Intel Foundry certify Calibre nmPlatform and Solido tools for Intel 18A PDK, enabling early design work and IP development;

➁ A reference workflow for EMIB-T and EMIB technologies using Siemens' 3D IC tools is established, supporting design exploration;

➂ Siemens joins the Intel Foundry Accelerator Chiplet Alliance to advance multi-die interconnect solutions.

➀ The article introduces a frequency-dependent switch model designed for PSpice simulation, enabling accurate analysis of AC power circuits;

➁ It demonstrates the switch's operation in multiple circuit configurations (e.g., 1700Hz and 150Hz) using PSpice's Laplace-based behavioral modeling;

➂ The model supports engineers in testing and implementing frequency-sensitive switching solutions for advanced power systems.

➀ A consortium of 12 European partners, coordinated by imec, launches the EU Chips Design Platform under the EU Chips Act to support fabless semiconductor startups and SMEs with cloud-based design resources, training, and funding;

➁ The platform offers access to EDA tools, IP libraries, fabrication pilot lines, and mentorship programs, aiming to reduce costs and accelerate time-to-market for chip innovations;

➂ Integrated with Europe’s broader semiconductor strategy, the initiative complements national competence centers and pilot lines like APECS and WBG, strengthening the continent’s industrial competitiveness through 2028.

➀ The article emphasizes optimizing the RTL-to-GDSII flow to address increasing chip complexity and design challenges;

➁ Key strategies include improving RTL quality, leveraging AI-driven automation, streamlined synthesis, and early congestion analysis;

➂ Benefits include reduced turnaround time, enhanced power-performance-area metrics, and scalability for advanced semiconductor development.

➀ Atum Works claims its nanoscale 3D printing method can replace current production flows and reduce chip fabrication costs by 90%;

➁ The method uses a nanoscale 3D printer to fabricate multi-material 3D structures with a 100 nm resolution at wafer scale;

➂ While not suitable for high-performance processors, the technology may be beneficial for packaging, photonics, sensors, and non-logic elements.

➀ Ethan Wilkinson, a UKESF Scholar at the University of Birmingham, is highlighted for his exceptional technical skills and commitment to excellence at EDA Solutions.

➁ His significant achievements include contributing to the development of the first electro-optical co-simulator and his role in training and supporting customers.

➂ Wilkinson is also recognized for his community engagement, particularly in inspiring young students to pursue careers in electronics and semiconductor technologies.

➀ Etimol DFX 82 RAN and Etimol DFX 83 RSN are two innovative flux removers introduced by Emil Otto, which have been tested and approved by leading electronics manufacturers.

➁ Both cleaners are non-hazardous, with high flash points, making them suitable for use in both automated and manual systems while ensuring occupational safety.

➂ Etimol DFX 82 RAN is solvent- and water-based, whereas Etimol DFX 83 RSN is solvent-only based, both formulated to effectively clean flux and paste residues.

➀ Crypto Quantique, a provider of quantum-driven silicon IP, has launched a new lightweight RoT IP block named QRoot Lite.

➁ The block complies with the MARS specification for secure device health and trustworthiness attestation.

➂ It is designed for integration into small systems and offers functions for device identity, measurement, and attestation.

➀ Analog Bits, a mixed-signal IP specialist, is demonstrating its latest LDO, power supply droop detectors, and embedded clock LC PLLs on the TSMC N3P process.

➁ The company is also showcasing clocking PVT and droop detectors on the TSMC N2P process at the TSMC 2025 North America Technology Symposium.

➂ CEO Mahesh Tirupattur emphasizes the importance of power management in architectural design, especially for advanced datacenters, AI/ML applications, and automotive SoC's.

➀ The transition from silicon-based components to GaN technology is reshaping the electronics industry;

➁ GaN HEMTs provide superior efficiency and improved thermal management over traditional semiconductors;

➂ This guide is tailored for engineers and enthusiasts in modern electronics.

➀ In the fast-evolving field of electronic design, ensuring the correct operation of complex mixed-signal designs is more critical than ever.

➁ Mixed-signal verification, or AMS verification, is at the core of this challenge, bridging the gap between analog and digital designs in a more digital world.

➂ As these technologies become more complex, understanding AMS verification becomes increasingly important.

➀ TSMC has chosen a 310x310mm substrate for its initial panel-level packaging (PLP) production, instead of the 510x515mm substrate initially tested.

➁ A source told Nikkei that the decision was made to start with a slightly smaller square shape rather than a larger one used in earlier trials, due to the difficulty of evenly coating the entire substrate with chemicals.

➂ The first production will take place on a pilot line in Taoyuan City in 2017.

➀ The 45th Symposium on VLSI Technology & Circuits will be held in Kyoto, Japan from June 8-12, 2025;

➁ Topics include DRAM technology innovation, VLSI for AI growth, and challenges in semiconductor design technologies;

➂ The program features joint focus sessions, short courses, and panel discussions on sustainability and education.