➀ The transition from 6-inch to 8-inch SiC wafers is discussed, with experts expressing concerns about the readiness of the SiC industry for this shift.

➁ The importance of cost reduction and maintaining quality is emphasized, with a focus on the challenges and opportunities in the domestic SiC supply chain.

➂ The need for industry collaboration and the role of research institutions in advancing 8-inch SiC technology are highlighted.

➀ European chip giants Infineon, STMicroelectronics, and NXP have recently expressed the importance of the Chinese market and plan to produce chips in China to better serve Chinese customers;

➁ Infineon is localizing the production of some products in China to meet the needs of Chinese customers and address their concerns about supply security;

➂ NXP aims to establish a Chinese chip supply chain for its customers and has established a business relationship with SMIC and is exploring partnerships with TSMC Nanjing and Hua Hong Semiconductor;

➃ STMicroelectronics has announced a partnership with Hua Hong Hongli to produce 40nm MCUs in China by the end of 2025, meeting market demand and optimizing the supply chain;

➄ STMicroelectronics has been increasing its cooperation with Chinese companies, establishing a joint wafer manufacturing plant in Chongqing for 8-inch silicon carbide chips and setting up a packaging and testing factory in Shenzhen;

➅ China is the world's largest automotive market and the demand for automotive chips is leading globally, accounting for 23.56% of the global automotive chip market in 2023.

➀ NXP and World Advanced are constructing a 12-inch wafer factory in Singapore with an investment of 7.8 billion USD, aiming to start mass production in 2027 and reach a monthly capacity of 55,000 12-inch wafers by 2029.

➁ NXP is actively seeking to establish a supply chain in China to serve customers needing Chinese production capacity.

➂ NXP plans to move some chip front-end manufacturing to China and establish a complete Chinese supply chain.

➀ Cisco has issued a notice to suppliers to strictly enforce the provision of chip origin certificates, requiring products to be free of China-made chips;

➁ The standard for COO certification has been upgraded from the final packaging location to the production site of the chips and masks, to ensure no 'origin washing';

➂ Cisco's network communication equipment involves national security considerations, necessitating strict tracing of chip origin;

➃ Dell, another PC manufacturer, has also planned to stop using China-made chips by 2024;

➄ HP, another PC manufacturer, is transferring some production capacity out of China, with the exclusion of China-made chips in the supply chain still under evaluation;

➅ The exclusion of China-made chips by US manufacturers could have a severe negative impact on local supply chain vendors in China;

➆ If US manufacturers want to retain the Chinese market, they may not require the exclusion of China-made components in products sold in China.

➀ TSMC stopped supplying chips to SOPHGO, a Chinese tech company, amidst an investigation by the US商务部;

➁ SOPHGO released a statement denying the reports and providing evidence of its innocence;

➂ SOPHGO is a RISC-V and TPU processor developer with a strong R&D team and ties to Bitmain.

➀ Huawei Mate70 is rumored to feature a side capacitive fingerprint button instead of under-screen fingerprint technology;

➁ The change is expected to impact suppliers like Goodix Technology and OFILM, which supply fingerprint modules;

➂ The Kirin chip for Mate70 is said to be close to 7nm performance and includes features for eye tracking and gesture recognition;

➃ The new phone's cost is estimated to be about 30% higher than Apple's iPhone, but with a lower price tag;

➄ Suppliers such as BOE and TCL Huaxing are likely to supply displays, while Xinwangda is expected to provide batteries;

➅ The phone may go on sale as early as the end of this month.

➀ The increase in HBM production in 2025 is expected to be limited, leading to a tighter supply.

➁ The reasons include adjustments in HBM production capacity, customization trends with a 40% die size penalty, and low yield of HBM3E 12hi and HBM4 from Samsung and Micron.

➂ The supply-demand ratio is expected to tighten further to -5% compared to the previous -1%, with SK Hynix expected to be a major beneficiary.