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October 21
- Inside Samsung Electronics' Crisis: Expert Analysis on the HBM Dilemma
➀ Samsung Electronics faces a crisis due to its organizational culture and lack of bold innovation;
➁ The company's focus on financial and legal aspects over technology has hindered its progress;
➂ Samsung's decision to withdraw from HBM (High Bandwidth Memory) was criticized for not being financially beneficial;
➃ The article highlights the challenges Samsung faces in packaging technology and its falling behind competitors like TSMC;
➅ The internal reporting process is lengthy and prone to distortion, affecting decision-making;
➆ Employees are leaving for better opportunities, especially in China;
➇ The article suggests that Samsung needs to revamp its management and focus on fostering a culture of innovation and open discussion.
October 17
- Limited HBM Production Increase and Tightening Supply in 2025
➀ The increase in HBM production in 2025 is expected to be limited, leading to a tighter supply.
➁ The reasons include adjustments in HBM production capacity, customization trends with a 40% die size penalty, and low yield of HBM3E 12hi and HBM4 from Samsung and Micron.
➂ The supply-demand ratio is expected to tighten further to -5% compared to the previous -1%, with SK Hynix expected to be a major beneficiary.