➀ Cadence has introduced a new system chiplet based on Arm; ➁ The article delves into the motivations behind this move; ➂ The Briefing series provides further insights.

➀ DigiKey has added MediaTek to its linecard with a global distribution agreement; ➁ MediaTek's products available include development boards, kits, programmers, ICs, and RF and wireless products; ➂ MediaTek's portfolio includes SoCs for various applications such as IoT, embedded systems, and home entertainment.

➀ SoC design is prevalent in our daily lives; ➁ It powers a wide range of electronic devices from smartphones to automobiles; ➂ The demand for sophisticated and interconnected devices drives the growth of the semiconductor industry; ➃ SoC design is found in consumer electronics such as smartphones and tablets.

➀ Asus shares official die shots of the Core Ultra 9 285K; ➁ Intel's Arrow Lake architecture and 3D Foveros packaging technology; ➂ Detailed breakdown of each tile's layout and functionality

➀ Korea’s September semiconductor exports reached a record high of $13.63 billion, up 36.3% year-on-year. Memory exports grew 60.7% year-on-year and 20% month-on-month to $8.72 billion. SoC exports rose 5.2% year-on-year to $4.37 billion. ➁ The overall Information and Communication Technology exports in September 2024 increased by 24% year-on-year to $22.36 billion. ➂ HBM had a significant impact on DRAM export values, and TrendForce forecasts that memory price growth will slow in Q4.

➀ Efabless and SensiML collaborate to offer chipIgnite ML, a new SoC platform that promises developers the ability to create custom silicon ten times more efficient than MCUs, expanding the potential for edge ML; ➁ The platform offers dedicated functionality accessible via SensiML's development tools, reducing development time and enhancing ML capabilities for edge applications; ➂ SensiML's AutoML platform allows embedded developers to create ultra-efficient sensor inference algorithms, while Efabless provides open-source tools for designing custom SoCs.

➀ Huawei's next flagship SoC is expected to use a 5nm Kirin chip, potentially closing the gap with Apple and Qualcomm's 3nm process nodes; ➁ The Chinese government and SMIC are reportedly fully supporting the development of this new chip; ➂ Huawei's past success with the 5nm Kirin 9000 5G AP shows that the company can compete with the industry's leading manufacturers.

➀ The article introduces the Pluto radar sensor reference design by NXP, a 28nm single-chip radar SoC; ➁ It highlights the high RF performance and flexibility of the design for various radar applications; ➂ The design is targeted for vehicle safety features like automatic cruise control and obstacle detection.

➀ VeriSilicon selects Arteris FlexNoC 5 interconnect IP for high-performance SoC design; ➁ The interconnect IP provides enhanced cost and design efficiency; ➂ The IP is physically aware and offers scalability.

➀ Intel presented four technical papers at Hot Chips 2024, detailing the Xeon 6 SoC, Lunar Lake client processor, Gaudi 3 AI accelerator, and OCI chiplet. ➁ The Xeon 6 SoC (Granite Rapids-D) is set to launch in the first half of 2025, featuring improved performance and efficiency. ➂ Intel highlighted advancements in AI applications across data centers, cloud, and edge computing, showcasing the industry's first fully integrated optical compute interconnect chiplet.