Recent #Simulation news in the semiconductor industry

11 months ago
➀ Siemens Digital Industries Software announced that its Solido SPICE simulation tool is now certified for Samsung Foundry's FinFET and GAA fabrication processes, including various process technologies. ➁ Solido SPICE is also qualified for Samsung Foundry's FD-SOI 18FDS process technology. ➃ Samsung Foundry's vice president Hyung-Ock Kim emphasized the importance of this certification for IC developers.
EDAIPProcess technologySiemens EDASimulationsemiconductor
12 months ago
➀ Signal Integrity (SI) issues in PCB and package design; ➁ Waveform distortions and time delays; ➂ Types of signal integrity problems like overshoot and ISI; ➃ Transmission line modeling and microstrip/stripline examples; ➄ Minimizing discontinuities and managing reflections; ➅ Mitigating crosstalk and via performance; ➆ Timing and skew considerations in high-speed digital designs.
Cross TalkDifferential PairsEDAHyperLynxISIImpedanceOvershootPCB DesignSignal IntegritySimulationTimingViaselectronics
about 1 year ago
➀ The FORSocialRobots research project, led by Prof. Dr. Jörg Franke, aims to enhance the social skills of robots for efficient human-robot interaction in various applications. ➁ The project focuses on scenarios such as logistics, production, service, elderly care, and dementia centers. ➂ Challenges include natural communication, understanding human emotions, and adapting to diverse environments.
AIAI ChipHPCHealthcareNVIDIASimulationSoftwareeducationgaminginnovationresearchroboticssensors
about 1 year ago
➀ The Fraunhofer IZM coordinates a project to develop new simulation models for microelectronics. ➁ These models aim to replace costly qualification tests with faster and more flexible simulations. ➂ The project, named mikroVAL, uses advanced modeling principles and protects intellectual property while enabling reusability of models.
Fraunhofer IZMMicroelectronicsReliabilityResearch projectsSimulation
about 1 year ago
➀ The Fraunhofer IZM leads a project to develop new simulation models for microelectronics reliability testing; ➁ The project aims to reduce the time and cost of qualification tests through advanced simulation techniques; ➂ The models will be reusable and adaptable to more complex systems, enhancing reliability without compromising accuracy.
EDAHPCMicrochipMicroelectronicsReliability TestingSimulation
about 1 year ago
➀ The REAL-M project, set to launch on September 25th, aims to revolutionize manufacturing with a flexible production cell. It showcases the potential of multi-robot solutions for medium-sized enterprises. The key concept is teamwork, where robots will collaborate with humans and each other directly rather than through fixed transfer stations. ➁ The REAL-M facility, located in the Chemnitz research factory of Fraunhofer IWU, features a modern, multi-layered control architecture and a digital twin of the multi-robot cell for virtual commissioning. ➂ The REAL-M enables simulations with multiple interacting robots, allowing for realistic testing of production processes and reducing the time from order to production (Time-to-Manufacturing).
AutomationFlexible ManufacturingHardware-in-the-LoopIndustrial RoboticsManufacturingMatrix ProductionSimulationSoftware-in-the-Loopdigital twinrobotics
about 1 year ago
➀ A new research project led by Professor Matthias Jung aims to address the bottleneck caused by memory in computer applications, particularly in AI. ➁ The project involves developing the DRAMSys simulation tool to make it ready for the latest DRAM semiconductor memory standards like HBM4, DDR6, and CXL. ➂ The tool will help developers simulate new applications early in the development stage, identifying potential bottlenecks and optimizing memory usage.
DRAMSimulationresearch
about 1 year ago
➀ Modern electronic design trends necessitate SI-PI cosimulation to minimize power consumption and voltage levels while increasing speed. ➁ The PDN should be meticulously modeled to minimize input impedance seen by I/O drivers, and combined with channel models to accurately predict output eye diagrams. ➂ The article details the complete modeling process of SI-PI cosimulation based on HBM, highlighting considerations for high-frequency PDN design at the chip and package levels.
HBMSimulationelectronics
about 1 year ago
➀ Stress models in semiconductor device simulation account for mechanical stress effects on material electronic properties. ➁ Stress influences device performance by altering band structures, effective masses, and carrier mobilities. ➂ In Sdevice, stress models use deformation potential theory and k·p method to simulate these effects, considering band edge shifts and curvature changes. ➃ Stress also affects scattering mechanisms, which are reflected in the mobility models. ➄ NMOS and PMOS devices use embedded materials to induce stress, enhancing carrier mobilities and device performance.
SimulationStress Modelssemiconductor
over 1 year ago
1. Keysight introduces a smart workflow automation in PCIe Designer, including IBIS-AMI model generation and simulation-driven virtual compliance. 2. The new workflow replaces tedious setups and hard debugging with automation, speeding up design cycles and reducing risk. 3. PCIe Designer offers a unified approach to simulation and compliance testing, allowing for early-stage design validation before hardware commitment.
KeysightPCIeSimulation