➀ Introduction to Siemens' next-generation EDA tools; ➁ Overview of new features like unified GUI, AI integration, and cloud connectivity; ➂ Benefits for engineers in productivity and collaboration; ➃ Integration with other Siemens products and PLM systems

➀ Signal Integrity (SI) issues in PCB and package design; ➁ Waveform distortions and time delays; ➂ Types of signal integrity problems like overshoot and ISI; ➃ Transmission line modeling and microstrip/stripline examples; ➄ Minimizing discontinuities and managing reflections; ➅ Mitigating crosstalk and via performance; ➆ Timing and skew considerations in high-speed digital designs.