➀ Samsung has started mass production of its new V9 QLC V-NAND; ➁ The technology enables larger SSDs with features like channel hole etching for higher layer counts; ➂ Improved data retention performance and reduced power consumption are noted.

➀ Samsung has begun mass production of a 286-layer QLC NAND; ➁ The new NAND is aimed at the server market with a density of 28.5 Gb/mm²; ➂ It offers improved performance compared to the previous generation.

➀ Renders of the unreleased Samsung S25 Ultra have appeared online; ➁ Revealing a look at what Samsung is developing for its next generation; ➂ Join the news discussion below!

➀ The NAND ASP increased by 15% in Q2, leading to total revenue of $16.796 billion, a 14.2% increase q-o-q. ➁ All NAND Flash suppliers returned to profitability and are expanding capacity. ➂ Samsung's NAND ASP rose by 20%, while Hynix, Kioxia, Micron, and WDC also saw significant increases in ASP and revenue.

➀ Intel faces a delay in receiving the CHIPS Act funds promised by the White House in March 2024; ➁ The U.S. government requires Intel to meet certain expectations and pass due diligence checks before releasing the funds; ➂ Intel's recent struggles include a $1.6 billion loss and plans to lay off 15% of its workforce.

➀ Samsung has announced the mass production of the thinnest LPDDR5X modules in the industry, with a thickness of approximately 0.65 millimeters; ➁ The new packaging is 0.06 millimeters thinner than the standard LPDDR5X, improving thermal resistance by 21.2%; ➂ The thinner LPDDR5X封装 enhances internal airflow in smartphones, improving thermal management and battery life.

➀ Samsung has expressed preliminary interest in acquiring parts of Nokia's assets to expand its wireless access network capabilities. ➁ The potential acquisition is still in early stages, with the total value of the assets estimated at around $10 billion. ➂ Nokia remains committed to its mobile network business, which is strategically important for the company.

➀ Samsung has started supplying its LPDDR4X automotive chip to Qualcomm after completing performance verification. ➁ This marks Samsung's first collaboration with Qualcomm in the automotive chip segment. ➂ Samsung is also developing the next-generation LPDDR5 automotive chip, with samples expected in Q4 2024. ➃ The LPDDR4X chip meets the AEC-Q100 standard and guarantees stable performance in extreme temperatures. ➄ Samsung expects to strengthen its presence in the auto chip market by adding Qualcomm to its client list.

➀ Samsung Electronics disbanded its Advanced Packaging Business Team, which was led by Lin Juncheng, a former TSMC executive. ➁ Lin Juncheng, known as a 'semiconductor packaging expert', has a rich background including nearly 19 years at TSMC and leadership roles at Skytech. ➂ There are rumors that Chinese mainland semiconductor factories are trying to recruit Lin Juncheng, although he is expected to prioritize opportunities in Taiwan.

➀ Samsung Electronics plans to reduce its procurement of ASML's next-generation EUV lithography equipment. ➁ The company initially planned to purchase multiple units of EXE:5200, EXE:5400, and EXE:5600, but now will only introduce the EXE:5200. ➂ The decision follows a review by the new head of the DS division, Jun Young-hyun, and impacts the joint R&D center plans with ASML.

➀ Intel announces plans to cut 15% of its workforce, aiming to save US$10 billion by 2025 due to underwhelming financial results. ➁ CEO Pat Gelsinger cites high-cost, low-margin structure and inability to capitalize on AI trends as reasons for restructuring. ➂ Samsung's semiconductor division faces ongoing labor strikes despite similar revenue declines, highlighting the rigidity of South Korea's labor market.

➀ Samsung is expected to tape-out its next-generation HBM4 memory in Q4 2024. ➁ Mass production of HBM4 is scheduled for Q4 2025, targeting NVIDIA's next-gen Rubin R100 AI GPU. ➂ The AI industry's demand is driving the growth of HBM memory, with SK hynix and Samsung investing heavily in production capabilities.

➀ Samsung plans to introduce its first High-NA EUV equipment, ASML’s EXE:5000, by the end of 2024 or early 2025, primarily for foundry operations. ➁ The company aims for full commercialization of High-NA EUV technology by 2027, collaborating with EDA companies to develop new mask designs. ➂ SK hynix is set to bring in ASML’s next-generation High-NA EUV machine, the EXE:5200, in 2026, with plans to apply it to advanced DRAM production.

➀ Samsung announces the expansion of its Circle To Search feature to Galaxy A55, A54, A35, and A34 devices, surprising users with AI tech on mid-range phones. ➁ The feature, originally exclusive to higher-end models, now aims to enhance AI interaction on a broader scale. ➂ This move is part of Samsung's strategy to integrate more AI functionalities across its device lineup, potentially preparing for future monetization of Galaxy AI services.

➀ The Samsung 990 EVO 1TB SSD is currently on sale for $69 at Amazon, its lowest price ever. ➁ This SSD, while not the fastest, offers sufficient performance for gaming needs. ➂ Features include an M.2 2280 form factor, PCIe 4.0 x4 and PCIe 5.0 x2 compatibility, and read/write speeds up to 5000/4200 MBps.

➀ The Chips Act investments aimed at boosting semiconductor manufacturing are experiencing delays, as reported by major news outlets. ➁ TSMC's Arizona fab projects have seen significant postponements, with the 4nm production delayed to 2025 and the 2nm production to 2028. ➂ Intel and Samsung have also faced construction and production delays in their respective fab projects.

➀ Q2 DRAM revenues surged 24.8% q-o-q to $22.9 billion; ➁ Samsung's revenue grew 22% to $9.82 billion with a 17%-19% ASP increase; ➂ SK hynix's revenue increased 38.7% to $7.91 billion driven by HBM3e products.

➀ Samsung plans to install its first High-NA EUV lithography tool in late 2024 for R&D purposes. ➁ The tool, an ASML Twinscan EXE:5000, will be used to develop next-generation process technologies at Samsung's Hwaseong campus. ➂ Samsung aims to build a robust ecosystem around High-NA EUV technology, collaborating with several companies to prepare for commercial implementation by 2027.

➀ Samsung showcased the BM1743, a 122.88TB enterprise QLC SSD, claiming it as one of the largest in the industry. ➁ The BM1743 offers significant performance improvements over its predecessors, with a 4.1x increase in I/O performance and a 45% enhancement in sequential write power efficiency. ➂ It boasts a sequential read speed of 7.5 GB/s and a write speed of 3 GB/s, with random read and write speeds reaching 1.6 million IOPS and 45,000 IOPS respectively. ➃ Samsung also demonstrated the PM9D3a Gen 5 SSD, targeting mainstream data center markets with up to 12 GB/s read and 6.8 GB/s write speeds, and the PM1753, a flagship enterprise SSD with 16-channel NAND, supporting up to 32 TB capacity.

➀ Samsung has initiated mass production of 12-nanometer-class LPDDR5X DRAM packages, which are thinner and offer better heat resistance, suitable for mobile, gaming, and AI devices. ➁ These new DRAM packages are designed to enhance space efficiency and thermal management, crucial for on-device AI applications. ➂ Samsung is also developing even thinner 24GB and 32GB modules to meet future demands for compact and high-performance memory solutions.