➀ Samsung has announced the mass production of the thinnest LPDDR5X modules in the industry, with a thickness of approximately 0.65 millimeters; ➁ The new packaging is 0.06 millimeters thinner than the standard LPDDR5X, improving thermal resistance by 21.2%; ➂ The thinner LPDDR5X封装 enhances internal airflow in smartphones, improving thermal management and battery life.
Related Articles
- LPDDR5 Speed Boost: A Massive Leap!9 months ago
- Samsung officially teases its first tri-fold Galaxy smartphone10 months ago
- Samsung sets up robotics unit10 months ago
- China-made DDR5 memory chips use less advanced chipmaking technology — chips are nearly 40% larger than Samsung's DDR510 months ago
- Samsung gearing up for 1c DRAM mass production, its competitive edge in HBM4 memory11 months ago
- Samsung finishes development on next-gen 400-layer NAND, 1Tb 400-layer TLC NAND in early 202511 months ago
- Samsung to change packaging method of low-power DRAM used in iPhones11 months ago
- Samsung prepares to unveil 10th generation V-NAND with 400+ layers — ready to power future PCIe 5.0 and 6.0 SSDs11 months ago
- Samsung year-end reshuffle focuses on chip division amid 'crisis'11 months ago
- Samsung in mass production of 286-layer V9 QLC NANDabout 1 year ago