Recent #Samsung news in the semiconductor industry

11 months ago
➀ Samsung Electronics is implementing austerity measures, reducing headcounts, and downsizing celebratory events; ➁ Bloomberg reports a potential 10% layoff of its overseas staff; ➂ Samsung has already laid off 10% in India and parts of Latin America; ➃ Samsung's workforce adjustments are viewed as routine by the company; ➄ Declining performance in core products such as memory chips and home appliances; ➅ Samsung's chip division recorded a significant operating profit loss in 2023; ➆ Global smartphone market competition impacting sales of Galaxy Z Fold 6 and Galaxy Z Flip 6; ➇ Samsung's home appliance sales are also decreasing; ➈ Samsung shares hit a new low in the past 52 weeks; ➈ Market analysts are lowering earnings prospects for Samsung.
LayoffsSamsung
11 months ago
➀ TSMC and Samsung are in preliminary discussions with the UAE to establish massive chip manufacturing facilities valued at over $100 billion; ➁ The feasibility of building advanced manufacturing complexes has been assessed by executives from both companies; ➂ The projects are expected to be funded primarily by the UAE government with support from Abu Dhabi's sovereign wealth fund, Mubadala; ➃ The factories aim to bolster global chip production capacity for AI technologies; ➄ Concerns have been raised about the potential transfer of advanced chip technology to China.
SamsungTSMCsemiconductor
12 months ago
➀ Samsung, SK hynix, and TSMC are set to overtake Intel in revenue in Q3 due to strong performance in data centers and AI. ➁ Intel's revenue projection is between $12.5 billion and $13.5 billion, lower than the expected earnings of TSMC and Nvidia. ➂ Nvidia's sales projection is around $32.5 billion, making it the likely leader in semiconductor sales.
AMDBroadcomIntelNVIDIAQualcommRevenueSK HynixSamsungTSMCsemiconductor
12 months ago
➀ Intel faces a delay in receiving the CHIPS Act funds promised by the White House in March 2024; ➁ The U.S. government requires Intel to meet certain expectations and pass due diligence checks before releasing the funds; ➂ Intel's recent struggles include a $1.6 billion loss and plans to lay off 15% of its workforce.
Chips ActGlobal Chip RaceIntelSamsungTSMCTax CreditsTechnology IndustryU.S. Semiconductor IndustryWorkforce Reductionfoundrygovernment fundinginvestmentsemiconductor
about 1 year ago
➀ Samsung has announced the mass production of the thinnest LPDDR5X modules in the industry, with a thickness of approximately 0.65 millimeters; ➁ The new packaging is 0.06 millimeters thinner than the standard LPDDR5X, improving thermal resistance by 21.2%; ➂ The thinner LPDDR5X封装 enhances internal airflow in smartphones, improving thermal management and battery life.
Memory PackagingSamsungtechnology
about 1 year ago
➀ Samsung has started supplying its LPDDR4X automotive chip to Qualcomm after completing performance verification. ➁ This marks Samsung's first collaboration with Qualcomm in the automotive chip segment. ➂ Samsung is also developing the next-generation LPDDR5 automotive chip, with samples expected in Q4 2024. ➃ The LPDDR4X chip meets the AEC-Q100 standard and guarantees stable performance in extreme temperatures. ➄ Samsung expects to strengthen its presence in the auto chip market by adding Qualcomm to its client list.
Automotive ChipsQualcommSamsung
about 1 year ago
➀ Samsung Electronics disbanded its Advanced Packaging Business Team, which was led by Lin Juncheng, a former TSMC executive. ➁ Lin Juncheng, known as a 'semiconductor packaging expert', has a rich background including nearly 19 years at TSMC and leadership roles at Skytech. ➂ There are rumors that Chinese mainland semiconductor factories are trying to recruit Lin Juncheng, although he is expected to prioritize opportunities in Taiwan.
Expert RecruitmentSamsungsemiconductor
about 1 year ago
➀ Samsung Electronics plans to reduce its procurement of ASML's next-generation EUV lithography equipment. ➁ The company initially planned to purchase multiple units of EXE:5200, EXE:5400, and EXE:5600, but now will only introduce the EXE:5200. ➂ The decision follows a review by the new head of the DS division, Jun Young-hyun, and impacts the joint R&D center plans with ASML.
EUV LithographySamsungsemiconductors
about 1 year ago
➀ Intel announces plans to cut 15% of its workforce, aiming to save US$10 billion by 2025 due to underwhelming financial results. ➁ CEO Pat Gelsinger cites high-cost, low-margin structure and inability to capitalize on AI trends as reasons for restructuring. ➂ Samsung's semiconductor division faces ongoing labor strikes despite similar revenue declines, highlighting the rigidity of South Korea's labor market.
IntelSamsungsemiconductor
about 1 year ago
➀ Samsung plans to introduce its first High-NA EUV equipment, ASML’s EXE:5000, by the end of 2024 or early 2025, primarily for foundry operations. ➁ The company aims for full commercialization of High-NA EUV technology by 2027, collaborating with EDA companies to develop new mask designs. ➂ SK hynix is set to bring in ASML’s next-generation High-NA EUV machine, the EXE:5200, in 2026, with plans to apply it to advanced DRAM production.
EUV TechnologySamsungsemiconductors
about 1 year ago
➀ Samsung announces the expansion of its Circle To Search feature to Galaxy A55, A54, A35, and A34 devices, surprising users with AI tech on mid-range phones. ➁ The feature, originally exclusive to higher-end models, now aims to enhance AI interaction on a broader scale. ➂ This move is part of Samsung's strategy to integrate more AI functionalities across its device lineup, potentially preparing for future monetization of Galaxy AI services.
Galaxy AISamsungSmartphone Technology
about 1 year ago
➀ The Chips Act investments aimed at boosting semiconductor manufacturing are experiencing delays, as reported by major news outlets. ➁ TSMC's Arizona fab projects have seen significant postponements, with the 4nm production delayed to 2025 and the 2nm production to 2028. ➂ Intel and Samsung have also faced construction and production delays in their respective fab projects.
IntelSamsungTSMCsemiconductor