SK Hynix CEO Kwak Noh-jung confirmed production plans for HBM3E 12H, indirectly denying rumors of delays, while rejecting concerns over Nvidia's AI accelerator issues.

➀ 200 Samsung semiconductor engineers apply for jobs at SK hynix; ➁ Concerns over Samsung's chip business are growing; ➂ SK hynix has expanded a program to recruit engineers with less than five years of experience, attracting many Samsung engineers.

Hundreds of Samsung engineers apply for SK Hynix job amidst Samsung's chip business crisis; Engineer exodus to other companies and government, concerns about Samsung's competitiveness.

➀ Arm is exploring the feasibility of running LLMs on mobile devices; ➁ Arm's optimization techniques for LLMs on mobile; ➂ The importance of practical use cases for LLMs in mobile devices

➀ SK Hynix has placed a significant order for thermal compression bonders from ASMPT; ➁ The equipment is for the production of HBM3E 12H, SK Hynix's newest high-bandwidth memory; ➂ The order includes over 30 units of the equipment.

➀ SK hynix has begun mass production of the world's first 12-layer HBM3E memory with a capacity of up to 36GB and a bandwidth of 9.6Gbps; ➁ The new memory is designed for AI GPUs and is set to be supplied to NVIDIA within 12 months; ➂ SK hynix aims to maintain its leadership in AI memory with the introduction of this new technology.

➀ Memory manufacturers are competing to win over server operating system developers; ➁ Samsung is collaborating with Red Hat; ➂ SK Hynix appears to be aiming to win over the entire ecosystem.

➀ SK Hynix has announced the development of a Gen 6 10-nanometer (nm) 16Gb DDR5 DRAM, marking the first in the industry. ➁ This development positions SK Hynix ahead of its domestic competitor, Samsung, which began manufacturing Gen 5 DRAM in May. ➂ The competition between SK Hynix and Samsung continues to drive advancements in DRAM technology.

➀ SK hynix plans to tape-out its HBM4 memory in October 2024; ➁ HBM4 offers a 40% increase in bandwidth and 70% reduced power consumption compared to HBM3E; ➂ NVIDIA's next-gen Rubin R100 AI GPU will use HBM4 memory, expected to be available in 2025.

➀ SK hynix and Solidigm are expanding SSD production due to high demand from AI servers. ➁ Enterprise SSD prices have increased by 80%. ➂ The companies are focusing on producing high-capacity SSDs using QLC technology.

➀ SK hynix plans to develop a new memory product with 20-30x the performance of current HBM; ➁ The company is focusing on custom HBM solutions for major tech companies; ➂ SK hynix is working on its 6th generation HBM, HBM4, expected to ship in the second half of 2025.

➀ CXL consortium showcased advancements at FMS 2024, including new specifications and product demonstrations. ➁ SK hynix introduced a 128 GB CMM-DDR5 CXL memory module and a Heterogeneous Memory Software Development Kit (HMSDK). ➂ Marvell announced a new CXL product line, Structera, featuring compute accelerators and memory expansion controllers.

➀ SK Hynix announces plans to develop a 4F2 DRAM similar to Samsung; ➁ The cost of EUV processes has been rapidly increasing since the commercialization of 1c DRAM; ➂ Seo Jae Wook, an SK Hynix researcher, highlighted this during an industry conference in Seoul.

➀ South Korea's memory chip exports to Taiwan surged 225% in the first half of 2025. ➁ The surge is due to the high demand for HBM memory in AI GPUs. ➂ Taiwan became the third-largest importer of South Korean memory chips, surpassing Vietnam and the United States.

1. Micron announces the 2650 client SSD, featuring 276-layer 3D NAND, marking its 9th generation of 3D flash. 2. The SSD offers a PCIe gen 4 interface and capacities from 256 GB to 1 TB, claiming best-in-class performance. 3. Micron's 276-layer NAND boasts the industry's fastest IO speed at 3.6 GBps, significantly outperforming competitors in read and write bandwidth.

1. SK Hynix plans to invest 9.4 trillion won to construct a new fab in response to the high demand for memory chips driven by AI. 2. The new fab will be located at the Yongin Semiconductor Cluster, a new industrial zone supported by the South Korean government. 3. Construction of the fab is set to commence soon.

1. SK Hynix achieved its highest operating profit in six years during the second quarter of 2023. 2. The company reported revenue of 16.42 trillion won and operating profit of 5.46 trillion won. 3. Net income for the quarter was 4.12 trillion won.

1. SK hynix plans to release a 60 TB SSD next quarter, entering the ultra-premium enterprise SSD market. 2. The company expects eSSD sales to quadruple compared to last year. 3. SK hynix has options to use its own or Solidigm's controllers for the new SSD.

1. SK Hynix has implemented a more environmentally friendly gas in its chip production cleaning processes. 2. The company replaced nitrogen trifluoride (NF3) with a gas that has low global warming potential. 3. This change was detailed in SK Hynix's 2024 sustainability report.

1. Genesem, a semiconductor packaging firm, has provided next-generation hybrid bonding equipment to SK Hynix. 2. The equipment is intended for use in the production of high-bandwidth memory (HBM). 3. Two units of the equipment have been installed at SK Hynix’s pilot fab for testing purposes.