1. Genesem, a semiconductor packaging firm, has provided next-generation hybrid bonding equipment to SK Hynix. 2. The equipment is intended for use in the production of high-bandwidth memory (HBM). 3. Two units of the equipment have been installed at SK Hynix’s pilot fab for testing purposes.

1. KCTech's supercritical fluid cleaner is being evaluated by SK Hynix for use in its DRAM production line. 2. SK Hynix currently procures this equipment from Tokyo Electron. 3. If KCTech passes the evaluation, it will become a secondary supplier.

1. SK hynix has completed the development of its high-end PCB01 PCIe Gen5 SSD for OEMs. 2. The PCB01 is based on the Alistar platform and is designed for AI PCs, featuring a PCIe Gen5 x4 interface and 238-layer TLC NAND. 3. The SSD is expected to offer peak read speeds of up to 14GB/second and write speeds of up to 12GB/second, with plans to release in capacities of 512 GB, 1 TB, and 2 TB.

1. Samsung and SK Hynix, South Korean memory chipmakers, are planning to adopt hybrid bonding technology for their upcoming 3D DRAM products. 2. SK Hynix announced its intention to use wafer bonding, a form of hybrid bonding, in the production of 3D DRAM during the International Memory Workshop 2024 in Seoul.

1. SK hynix announced plans to start mass production of GDDR7 memory chips in Q1 2025, positioning itself as the last among major memory vendors to do so. 2. Samsung and Micron are ahead in the race, with Samsung already sampling and Micron aiming for early mass production this year. 3. SK hynix showcased GDDR7 chips at Computex 2024, highlighting their roadmap which includes 16Gbit and 24Gbit chips with data transfer rates up to 40 GT/s.

1、SK海力士计划在10nm Gen 6（1c）DRAM生产中使用Inpria的金属氧化物阻抗（MOR）。 2、MOR将被用于绘制1cDRAM的最细线路。 3、Inpria是日本化学公司JSR的子公司，自2022年以来一直与SK海力士合作开发MOR。

SK Hynix is planning to use TSMC’s base die technology for its next-generation high bandwidth memory (HBM).