➀ Intel is exploring the sale or partnership of its Network and Edge Group (NEX) to refocus on PC and datacenter strategies, following previous divestments like Altera and Fab 34;

➁ NEX revenue fell to $5.8B in 2023 (from $8.4B in 2022) amid strong Broadcom competition, signaling a shift away from non-core businesses;

➂ Intel holds $50B debt and $21B cash, with CEO Lip-Bu Tan prioritizing core products under ongoing financial restructuring.

➀ AMD unveils Zen 5-based Threadripper Pro 9000 WX and non-Pro CPUs, featuring up to 96 cores and 192 threads in flagship models;

➁ Zen 5 architecture delivers 22% performance gains, DDR5-6400 memory support, with up to 2.2X rendering speed over Intel Xeon-W;

➂ sTR5 socket compatibility maintained, estimated July 2025 availability starting at $1,400 for HEDT models.

➀ Gartner highlights eight key supply chain trends, including ambient invisible intelligence using smart sensors for real-time tracking and environmental compliance;

➁ Adoption of polyfunctional robots and autonomous data collection (e.g., drones) to optimize warehouse efficiency and reduce labor costs;

➂ AI-driven decision intelligence and intelligent simulation integrate analytics and machine learning to enhance decision-making and operational adaptability in logistics.

➀ Asus launches a 3000W PSU with four 12V-2x6 ports, targeting AI workstations with multi-GPU demands;

➁ Features include 80 PLUS Platinum efficiency, 50°C cooler cables to prevent melting issues, and PCIe 5.1/ATX 3.1 compatibility;

➂ Requires dedicated 240V circuitry, making it unsuitable for average gamers but ideal for high-end AI development.

➀ InWin introduces the ChronoMancy, a 1.1m-tall futuristic PC case that opens via wand gesture, celebrating its 40th anniversary;

➁ Showcases mainstream models like VIEW, COVALENT, and TACTIX tailored for gaming, AI development, and high-performance computing;

➂ ChronoMancy features engraved RGB-lit historical case designs and supports top-tier components like NVIDIA RTX50 GPUs.

➀ NVIDIA introduces NVLink Fusion, enabling external chipmakers to integrate custom CPUs and AI accelerators with its ecosystem, breaking past proprietary limitations;

➀ Key partners include Qualcomm, Fujitsu, Marvell, and Mediatek, with chiplet-based design and software support from Synopsys and Cadence;

➂ NVIDIA's move aims to counter the open-standard UALink consortium led by AMD, Intel, and Broadcom, consolidating its dominance in AI infrastructure.

➀ The Climate bOWL project developed an intelligent carbon footprint tracking system to assist industries in identifying and reducing greenhouse gas emissions across production chains;

➁ The €3.16 million initiative involved universities and companies like NTT Data and Miele, focusing on automated data analysis to enhance transparency and energy efficiency;

➂ The system provides actionable insights for emission reduction, prioritizing real mitigation over compensation to achieve climate neutrality.

➀ Technical University of Applied Sciences Augsburg (THA) launches a Bachelor's program in Rescue Engineering for the 2025/2026 winter semester, focusing on practical training in fire protection, disaster control, and civil safety technologies.

➁ The interdisciplinary program, developed with regional fire departments and aid organizations, equips graduates for roles in emergency services, safety technology development, and industrial security, emphasizing technical expertise and crisis management skills.

➂ Admission qualifications include vocational experience, with flexible pathways for applicants without traditional academic credentials, and applications open for full-time or part-time study starting July 15, 2025.

➀ The 8th UKP Workshop in Aachen focused on ultrashort pulse laser technology advancements, addressing beam sources, system innovations, and scaling strategies to enhance precision and productivity in industrial applications;

➀ Key developments included high-power UV/DUV lasers, MEMS/LCoS modulators for beam shaping, GHz burst systems, and multi-scanner setups to optimize throughput and process control;

➂ Applications spanned medical device manufacturing (e.g., adhesive-free glass welding), semiconductor chip separation, and consumer electronics, with live demos showcasing laser-induced etching and neural network-guided beam shaping.

➀ The European Space Agency's Proba-3 mission achieved millimeter-precision formation flying between two spacecraft, the Coronagraph and Occulter, maintaining a 150-meter separation autonomously for hours;

➁ The mission aims to study the Sun's corona by aligning the Occulter's 1.4m disc to cast a shadow onto the Coronagraph's instrument, enabled by laser metrology, optical sensors, and AI-driven algorithms;

➂ Key contributions came from ESA, MDA Space, Airbus Defence and Space, and Belgian institutions, with advanced technologies like the Fine Lateral and Longitudinal Sensor (FLLS) ensuring millimeter accuracy.

➀ UK startup Space Forge secures $30M Series A funding to develop manufacturing satellites for semiconductors and quantum computing materials in space;

➁ Their reusable ForgeStar-1 satellite launching in 2025 will utilize microgravity to create advanced materials, potentially cutting data center emissions by 75%;

➂ The U.S. subsidiary aligns with CHIPS Act to rebuild semiconductor supply chains amid geopolitical risks of Taiwan's chip dominance.

➀ A study by Constructor University found no evidence of cellular damage from 5G frequencies, even at exposure levels ten times higher than legal limits;

➀ Experiments on human skin cells (fibroblasts and keratinocytes) showed no significant changes in gene expression or DNA methylation;

➂ Researchers emphasized rigorous methodology and addressed public concerns, reinforcing 5G's safety under tested conditions.

➀ The top 10 OSAT companies' 2024 revenue reached $41.56 billion, a 3% YoY increase, with ASE leading at $18.54 billion (45% market share);

➁ HT-Tech achieved the highest growth (+26% YoY), while Hana Micron (+23.7%) and JCET (+19.3%) also saw strong performance driven by memory and automotive/OLED demand;

➂ The industry faces evolving demands for advanced packaging (e.g., heterogeneous integration, WLP) and AI/edge computing-driven high-frequency, high-density solutions.

➀ The 8th UKP Workshop in Aachen gathered 120 experts to discuss advancements in ultrafast laser technology, focusing on scaling processes for higher productivity and precision in material processing;

➁ Innovations included high-power UV/DUV lasers, beam shaping with LCoS/MEMS modulators, and multi-scanner systems to manage large data volumes, alongside applications in semiconductor manufacturing and medical technology;

➂ Key demonstrations highlighted selective laser-induced etching (SLE) and inline process control, emphasizing improved accuracy (±1 µm) and the transition of ultrafast lasers from research to industrial adoption.

➀ TU Chemnitz introduces Germany's first master's program in hydrogen technologies in Winter 2025/2026, focusing on fuel cell/electrolyzer engineering and system integration to address industry talent demands;

➀ The curriculum combines theoretical knowledge with hands-on experiments using open-source research platforms and covers sustainable energy generation, storage, and innovation;

➀ Graduates gain access to career opportunities via the HZwo innovation cluster, linking them to 150+ global companies and research institutions, with Chemnitz serving as a national hydrogen research hub.

➀ Fugaku supercomputer defeated humans 442 septillion to 13 in 10-second addition challenge at Nico Nico conference;

➁ The contest highlighted Fugaku's 442 PFlop/s computing power and 158,976-node A64FX processor architecture;

➂ RIKEN and Fujitsu plan to develop zettascale supercomputers by 2030, expanding applications in disaster simulation and scientific research.

➀ TSMC's April 2025 revenue reached $11.6 billion, marking a 48% year-on-year and 22.2% month-on-month increase;

➁ Cumulative revenue from January to April 2025 totaled $62 billion, up 43.5% compared to the same period in 2024;

➂ The growth reflects TSMC's continued strong performance in semiconductor manufacturing amid global chip demand.

➀ Alice & Bob is building a $50 million quantum computing laboratory in Paris, partnering with Quantum Machines and Bluefors;

➁ The lab will develop next-gen quantum chips (Lithium, Beryllium, Graphene) and aims to launch a 100-logical-qubit quantum computer by 2030;

➂ Funded by $103 million Series B, the facility includes a cleanroom and cryogenic systems, leveraging cat qubit technology to reduce errors and resource demands.

➀ Panmesia secures $30 million to develop modular AI accelerators using chiplet technology, targeting LLMs and large-scale AI workloads with optimized resource utilization;

➁ Its flexible chiplet architecture integrates in-memory processing and CXL to reduce data movement, power consumption, and infrastructure costs while enabling scalability;

➂ The accelerator combines manycore and vector processor chiplets, leveraging advanced nodes to deliver high parallelism and tailored performance for diverse AI tasks.

➀ ASML accelerates its Brainport Industries Campus expansion in the Netherlands, targeting operational readiness by 2028 instead of 2030.

➁ The new campus spans 357,000 sqm (≈50 football fields) near Eindhoven, with infrastructure upgrades and €1.7B government support.

➂ Expansion aims to meet global demand for EUV machines, though challenges like power grid limits and land acquisition remain.