➀ Auras showcased its AMD SP7 liquid cooling cold plate for 600W CPUs at Computex 2025, targeting next-gen high-performance server processors;

➁ The compact cold plate measures 120.1×100.6×22.3mm and supports dual-socket designs with six mounting points, outperforming Intel's upcoming Oak Stream counterpart in size;

➂ AMD's SP7 platform, though not yet detailed publicly, is expected to power next-generation servers with 16-channel memory and higher core counts for advanced computing workloads.

➀ An international research team led by Prof. Qing-Tai Zhao proposes that operating computer chips at cryogenic temperatures could reduce energy consumption by up to 80%, addressing the high energy demands of data centers and AI infrastructure;

➁ Cryogenic computing leverages the improved efficiency of transistors at low temperatures but faces challenges like material defects and quantum tunneling, requiring novel materials and architectures (e.g., gate-all-around nanowires, high-k dielectrics) to optimize CMOS technology;

➂ Applications span quantum computing, space exploration, and high-performance data centers, with TSMC actively developing chips tailored for cryogenic environments to enhance energy efficiency and integrate with quantum processors.

➀ MO Valve Company shifts focus to industrial solid-state devices up to 6000 Mc/s, prioritizing communication bandwidth over high-power applications;

➁ An export division is established, with microwave equipment attracting attention in Paris, aiming for a 40% export share including indirect quotas;

➂ The company abandons domestic market products (e.g., color TVs) and concentrates on industrial valves, thyratrons, and cathode ray tubes, affirming valves' continued relevance.

➀ The Institute of Radiology at HDZ NRW employs deep learning and AI to enhance cardiac imaging diagnostics, focusing on coronary artery disease;

➁ Dr. Tamino Huxohl leads a study using AI to replace CT-based artifact correction in SPECT imaging, aiming to reduce radiation exposure and improve accuracy;

➂ A multicenter trial demonstrates AI-generated corrections achieve CT-equivalent image quality, indicating potential for broader clinical use and improved patient outcomes.

➀ TU Chemnitz introduces a new English-taught Bachelor's program "Foundations in Data Science" starting in Winter 2025/26, focusing on mathematical foundations and interdisciplinary skills;

➁ The program combines mathematics with electrical and information engineering, preparing graduates for careers in data analysis, AI, automotive, and more;

➂ International students gain German language skills, while native speakers enhance English proficiency; applications open until July 15 (international) and September 19 (German).

➀ Fraunhofer IAPT showcases collaborative robots ("Cobots") at automatica 2025, focusing on automating additive manufacturing and reducing labor demands;

➁ Cobots integrate additively manufactured tools and grippers, enabling flexible automation with complex geometries;

➂ Digital production solutions enhance process stability and scalability across conventional and additive manufacturing workflows.

➀ Karlsruhe Institute of Technology (KIT) secured two Excellence Cluster grants for battery research (POLiS) and 3D materials (3DMM2O), each funded up to €70 million over seven years;

➁ POLiS focuses on developing lithium-free batteries for sustainable energy storage, emphasizing ion tracking and cell component interactions;

➂ 3DMM2O pioneers molecular-scale 3D printing, targeting organoid formation, biohybrid systems, and energy-efficient optical switches.

➀ Leibniz Universität Hannover (LUH) secured funding for three Excellence Clusters (PhoenixD, QuantumFrontiers, Hearing4all.connects), enabling its bid for "Excellence University" status by 2026;

➁ PhoenixD advances photonics for medical and quantum applications, QuantumFrontiers pioneers quantum metrology and next-gen sensors, and Hearing4all.connects integrates AI and genetics to enhance hearing health solutions;

➂ The clusters emphasize interdisciplinary collaboration with academic and industry partners, reinforcing LUH's leadership in cutting-edge research.

➀ The Martin Luther University Halle-Wittenberg (MLU) secured funding for the Cluster of Excellence 'Center for Chiral Electronics' (CCE), focusing on chiral materials for energy-efficient, high-performance electronic components;

➁ The initiative involves collaboration with Freie Universität Berlin, the University of Regensburg, and Max Planck Institute in Halle, combining expertise in chiral materials, spin dynamics, and coherent control;

➂ The research aims to advance semiconductor technology, aligning with the European Chips Act, while promoting STEM education and addressing future electronics challenges.

➀ The Martin-Luther-Universität Halle-Wittenberg (MLU) secures €64.5 million in funding for the "Center for Chiral Electronics" excellence cluster, collaborating with three institutions to develop energy-efficient electronic materials and technologies;

➁ Research focuses on leveraging chirality in materials to create stable, high-performance electronics, addressing future semiconductor and storage technology needs;

➂ The initiative aligns with the European Chips Act, aiming to bolster Germany’s semiconductor production and inspire youth through science education programs.

➀ The ViTFOX project, led by Fraunhofer IPMS and European-Korean partners, develops a Vision-Transformer (ViT) architecture using ferroelectric oxides to achieve AI energy efficiency exceeding 50 TOPS/W for edge applications;

➁ The project integrates computing-in-memory technology to reduce latency and energy consumption, leveraging ferroelectric materials like HZO compatible with silicon-based devices;

➂ Cross-border collaboration aims to advance semiconductor innovation, combining European expertise in epitaxial ferroelectric junctions with Korean 3D FeRAM development to enhance hardware-software co-optimization.

➀ Phison launched the E28 PCIe 5.0 SSD controller, the first with integrated AI processing, built on TSMC's 6nm process, achieving 2.6M/3M IOPS and 15% lower power consumption;

➁ It includes AI acceleration to reduce AI training time by 50% and targets AI servers and workstations, not consumer devices;

➂ Future iterations may improve random performance for general PCs, offering up to 240% faster speeds than current gaming SSDs.

➀ Creonic launches a new oFEC codec IP core for next-gen optical and high-speed communication systems;

➁ The IP core supports both ASIC and FPGA configurations, offering flexibility and scalability;

➂ Enhances Creonic's portfolio for advanced networking solutions in telecommunications and HPC applications.

➀ Fraunhofer IST introduces new simulation approaches to integrate numerical modeling into industrial practice, reducing physical tests and optimizing processes like vacuum coating and water treatment;

➁ The institute utilizes a proprietary PICMC/DSMC solver and CFD methods for plasma and gas flow simulations, aiming to democratize simulation access for non-experts;

➂ Future plans include AI integration, data-driven modeling, and talent development through academic courses to advance digital twins and sustainable industrial processes.

➀ The Fraunhofer IST is advancing simulation tools to bridge the gap between theoretical models and industrial applications, aiming to reduce physical experiments and enhance efficiency in processes like vacuum coating and water treatment;

➁ The institute plans to integrate AI, machine learning, and digital twins to make simulations accessible to non-experts, expanding beyond its established PICMC/DSMC and CFD modeling techniques;

➂ Fraunhofer IST emphasizes workforce training through partnerships with universities like TU Braunschweig, fostering a new generation skilled in simulation-based decision-making for sustainable industrial practices.

➀ AMD announced the Ryzen Threadripper 9000 family at Computex 2025, featuring Zen 5 architecture with up to 96 cores, 384MB L3 cache, and support for DDR5-6400 memory and PCIe 5.0 lanes;

➁ The Threadripper Pro 9000 series targets professional workstations with 12-96 cores and 128 PCIe 5 lanes, while the non-Pro models (24-64 cores, 48 PCIe 5 lanes) cater to HEDT users, offering backward compatibility with existing sTR5 motherboards;

➂ Zen 5 delivers ~16% IPC gains and up to 5.4GHz boost clocks, enabling ~20% performance improvement over previous gen, with availability starting July 2025 for retail and OEM systems.

➀ Intel is exploring the sale or partnership of its Network and Edge Group (NEX) to refocus on PC and datacenter strategies, following previous divestments like Altera and Fab 34;

➁ NEX revenue fell to $5.8B in 2023 (from $8.4B in 2022) amid strong Broadcom competition, signaling a shift away from non-core businesses;

➂ Intel holds $50B debt and $21B cash, with CEO Lip-Bu Tan prioritizing core products under ongoing financial restructuring.

➀ AMD unveils Zen 5-based Threadripper Pro 9000 WX and non-Pro CPUs, featuring up to 96 cores and 192 threads in flagship models;

➁ Zen 5 architecture delivers 22% performance gains, DDR5-6400 memory support, with up to 2.2X rendering speed over Intel Xeon-W;

➂ sTR5 socket compatibility maintained, estimated July 2025 availability starting at $1,400 for HEDT models.

➀ Gartner highlights eight key supply chain trends, including ambient invisible intelligence using smart sensors for real-time tracking and environmental compliance;

➁ Adoption of polyfunctional robots and autonomous data collection (e.g., drones) to optimize warehouse efficiency and reduce labor costs;

➂ AI-driven decision intelligence and intelligent simulation integrate analytics and machine learning to enhance decision-making and operational adaptability in logistics.

➀ Asus launches a 3000W PSU with four 12V-2x6 ports, targeting AI workstations with multi-GPU demands;

➁ Features include 80 PLUS Platinum efficiency, 50°C cooler cables to prevent melting issues, and PCIe 5.1/ATX 3.1 compatibility;

➂ Requires dedicated 240V circuitry, making it unsuitable for average gamers but ideal for high-end AI development.