<p>➀ Huawei introduced its UB-Mesh interconnect technology at Hot Chips 2025, targeting large-scale AI SuperNodes with up to a million chips; </p><p>➁ The architecture employs a unified protocol and hybrid topology to reduce costs, improve scalability, and ensure reliability for data center-scale deployments; </p><p>➂ Key innovations include resilient optical links and hierarchical redundancy to address high error rates and node failures in gigaWatt AI data centers.</p>