➀ A recent study introduces a Janus membrane for water purification and energy generation, aiming to address water scarcity and energy needs;

➁ The membrane uses cellulose nanofibers (CNF) and a modified MXene to improve performance over longer periods;

➂ The Janus membrane demonstrates better performance than traditional membranes, achieving a high evaporation rate and photothermal conversion efficiency, and effectively preventing salt buildup.

➀ Microsoft has announced that several Windows 11 Copilot+ AI features are graduating from Snapdragon X exclusivity to AMD Ryzen AI 300 series and Intel Core Ultra 200V PCs.

➁ Features such as Live Captions, Cocreator, Restyle Image, and Image Creator are now available on modern AMD and Intel systems, as well as PCs with Qualcomm Snapdragon X (SDX) series processors.

➂ The Live Captions feature can translate from 27 languages into Simplified Chinese and is expected to be available for Ryzen AI 300 and Ultra 200V PC users soon.

➀ This article introduces a reference design for a programmable 100V high-current regulator by Texas Instruments (TI), named TIDA-01371. The design supports output voltages ranging from ±2.5V to ±100V and is suitable for specialized imaging applications such as shear wave imaging and elastography.

➁ The design incorporates a floating and tracking regulator with low-noise LDO regulators and a current-sharing scheme using low RDS(ON) power MOSFETs. It also supports programmable output voltages via DAC-generated control signals.

➂ The reference design can be applied to medical ultrasound scanners, sonar imaging equipment, and non-destructive evaluation systems. TI provides comprehensive documentation including BOM, schematics, and PCB layouts for this design.

➀ SPAIA is founded to address the decline in insect populations and their critical role in biodiversity and ecosystem health.

➁ The team is working on a scalable global insect data network, combining low-cost hardware and AI software.

➂ SPAIA's technology aims to provide real-time insights into insect activity and biomass intelligence for sustainable environmental management.

➀ Canon has developed the world's first 410-megapixel CMOS sensor with 24K resolution, suitable for surveillance, medical imaging, and industrial applications.

➁ The sensor features a back-illuminated stacked structure that enables ultra-fast data readout at 3,280 megapixels per second, supporting 8 frames per second video capture.

➂ It includes a 'four-pixel binning' function that enhances low-light performance, allowing 100-megapixel video recording at 24 frames per second.

➀ Yole Group reports that defense demand has driven the infrared image sensor market to exceed $1 billion in 2024, with a CAGR of over 5% from 2024 to 2030.

➁ By 2030, the SWIR market is expected to reach nearly $102 million, while cooled MWIR and LWIR are targeting $1,179 million and $249 million, respectively.

➂ The market is responsive to lower-cost technologies like Quantum Dots sensors and T2SL architectures.

➀ The webinar discusses the impact of generative AI on technology evolution and the rise in compute power demand.

➁ It covers the trends in larger compute chips, multi-die systems, advanced packaging, and memory architectures.

➂ Key technologies like die-to-die communication, custom HBMs, and 3D stacking are explored in detail.

➀ Micron confirms plans to raise memory prices due to strong demand for DRAM and NAND flash.

➁ The price hike is expected to continue through 2025 and 2026.

➂ Factors include supply constraints and growing demand from AI, data centers, and consumer electronics.

➀ Wi-Fi Sensing利用现有无线信号（如Wi-Fi）进行室内活动和位置跟踪，无需安装摄像头或可穿戴设备，解决了隐私问题。

➁ 通过分析通道状态信息(CSI)，该技术能够检测运动、识别活动并实现定位，其性能依赖于深度学习模型，但模型参数量大导致部署困难。

➂ 文章介绍了通过量化和剪枝技术压缩模型的方法，成功将模型部署到边缘设备（如Raspberry Pi 4），显著提升了推理速度。

➀ Toray Engineering Co., Ltd. has developed the UC5000, a high-precision semiconductor packaging system for panel-level packaging (PLP), which is gaining popularity, especially for AI server applications.

➁ The UC5000 achieves chip packaging accuracy of ±0.8μm using thermal compression bonding (TCB) on large panels, supporting both silicon wafers and glass substrates.

➂ Key features include advanced TCB technology, high-accuracy packaging, and warp-correction transfer technology, addressing challenges such as warping and material expansion in glass panel processing.

➀ The Fraunhofer Heinrich-Hertz-Institut (HHI) and the National Institute of Information and Communications Technology (NICT) present the Optical Testbed Dataspace (OTDS) to accelerate the development and testing of AI and ML for optical communication networks.

➁ OTDS provides a secure space for international data exchange, offering new perspectives for optimizing and automating communication networks globally.

➂ The platform is based on the Eclipse Dataspace Components Connector (EDCC) and aligns with the principles of the International Data Spaces Association (IDSA), enabling secure and controlled data exchange in line with international standards.

Fraunhofer HHI and NICT launch the Optical Testbed Dataspace (OTDS) to accelerate the development and testing of AI and ML models for optical networks. The platform fosters global collaboration by securely sharing testbed data, addressing challenges in dataset availability and enhancing network optimization and automation.

OTDS uses the Eclipse Dataspace Components Connector (EDCC) and aligns with the International Data Spaces Association (IDSA) principles, ensuring data sovereignty and export control compliance.

The technology has been successfully demonstrated through a prototype for international data exchange between Berlin and Sendai, and is set to be showcased at the OFC conference.

➀ Lantronix has launched the Open-Q 8550CS System-on-Module (SOM), built on the Qualcomm Dragonwing QCS8550 processor, offering low-power on-device AI and ML capabilities.

➁ The SOM is designed for demanding AI/ML applications in extreme Edge computing environments, supporting advanced video processing, AI inference, and Edge AI gateway integration.

➂ Key features include low power consumption with a 4nm process, dual eNPU for AI acceleration, and support for high-speed connectivity and multiple display interfaces.

➀ Keysight Technologies has introduced the Interconnect Test System (ITS) and the Interconnect and Network Performance Tester 1600GE (INPT-1600GE), a hardware traffic emulator designed to run ITS. This solution validates AI infrastructure and network components from 200GE to 1600GE.

➁ The new system addresses limitations of previous manual processes, offering automation and improved data management for network interconnect performance testing.

➂ The ITS software combined with the INPT-1600GE offers key benefits including support for high-power optical receivers, various interface configurations, and reliability testing across different speeds.

➀ Many people, including the author, sold quantum computing shares after Jensen Huang's CES remark;

➁ The author believes that tech shares may be overvalued due to the emergence of DeepSeek and the rise of open-source AI programs in China;

➂ The author suggests investing in Greenland's publicly traded companies, which have seen significant growth in the past year.

➀ Introducing Warp, an AI-enabled terminal app for Windows and Linux;

➁ Learn to install and use Warp to create code and automate tasks;

➂ Explore how Warp can assist in coding, from simple commands to complex applications.

➀ A compact Wi-Fi-based camera project using IndusBoard Coin V2 and OV2640 camera module was introduced. It is capable of live video streaming and is suitable for home security, baby monitoring, and discreet surveillance applications.

➁ The project utilizes the Wi-Fi capabilities of IndusBoard Coin V2 to host a web server for streaming real-time video. The OV2640 camera captures images and transmits them in multiple pixel formats.

➂ The camera operates in AP mode, creating its own Wi-Fi network for portability and independence from existing networks. The Bill of Materials and circuit details are provided along with source code for implementation.

➀ China's AI data center expansion in 2023-2024 has led to significant underutilization of billions of dollars in infrastructure;

➁ Rushed projects resulted in poor planning and technical irrelevance;

➂ Market shift towards inference workloads has reduced demand for high-end GPUs, leading to a decrease in rental prices.

➀ Alphawave Semi推出了针对高速互连半导体市场的最新光电子解决方案，预计到2028年市场规模将超过40亿美元。

➁ 新产品包括支持PAM4和Coherent-lite调制的数字信号处理器（DSP），以实现AI驱动的高速数据中心数据传输。

➂ 该解决方案利用了Alphawave的WidEye DSP架构和EyeQ高级诊断技术，并提供800G和1.6T的互连能力。