➀ Texas Instruments' TIDA-00757 reference design tackles smart locks' battery drain using BLE and low-power motor drivers;
➁ Integrates ultra-low-power MCU, efficient DC/DC converter, and motor current limiting for extended battery life up to 5+ years;
➂ Supports wireless control and battery monitoring, applicable in building automation, security systems, and HVAC actuators.
➀ The Microtest Group introduced Quasar200 and Pulsar600 testing systems for efficient semiconductor device validation;
➁ Quasar200 provides precise DC/AC measurements for Si, GaN, and SiC devices, while Pulsar600 supports high-current automotive and industrial applications up to 1,000 A DC;
➂ Both systems feature plug-and-play setups, safety protections, and ±0.1% measurement accuracy to streamline testing processes.
➀ Upbeat Technology and SiFive collaborate on a dual-core RISC-V MCU family (UP201/UP301) featuring AI accelerators for ultra-low-power edge AI applications.
➀ Delivers 16.8 μW/MHz/DMIPS energy efficiency, 400 MHz clock speed, and advanced error correction for resilient near-threshold operation in wearables, drones, and IoT systems.
➂ Live demos at RISC-V Summit highlight performance, with engineering samples and SDKs available to enable next-gen battery-optimized AI designs.
➀ Samsung purchased two high-NA EUV machines (Twinscan EXE:5200B) for $773 million to boost 2nm chip production, with deliveries planned for 2025 and early 2026;
➁ The machines, installed at Hwaseong R&D facility, will support 2nm foundry processes for Exynos processors and Tesla's ADAS chips, achieving transistor sizes down to 8nm;
➂ TSMC has delayed high-NA EUV adoption until 1.4nm processes, while Qualcomm and MediaTek consider shifting 2nm orders to Samsung due to TSMC's higher wafer costs ($30k per wafer).