➀ Renders of the unreleased Samsung S25 Ultra have appeared online; ➁ Revealing a look at what Samsung is developing for its next generation; ➂ Join the news discussion below!

➀ Samsung is expected to tape-out its next-generation HBM4 memory in Q4 2024. ➁ Mass production of HBM4 is scheduled for Q4 2025, targeting NVIDIA's next-gen Rubin R100 AI GPU. ➂ The AI industry's demand is driving the growth of HBM memory, with SK hynix and Samsung investing heavily in production capabilities.

➀ Samsung has started mass production of 12 GB and 16 GB LPDDR5X modules in the industry's thinnest package, measuring 0.65 mm in thickness. ➁ The ultra-thin design was achieved through new packaging methods and an optimized back-lapping process, offering a 21.2% improvement in heat resistance. ➂ Thinner LPDDR5X packaging enhances airflow within smartphones, significantly improving thermal management and potentially extending device lifespan.

1. Samsung has received approval for its HBM3 memory to be used in NVIDIA's AI GPUs. 2. The approval for Samsung's next-gen HBM3E memory is expected in the next 2-4 months. 3. The HBM market is projected to grow significantly, reaching $71 billion by 2027.

1. Samsung has filed a patent for a revolutionary foldable display. 2. The display can be expanded horizontally and resized based on usage. 3. The technology could change how we interact with devices.

1. SK hynix reported a 125% annual increase in revenue for Q2 2024, driven by high demand for HBM memory in AI applications. 2. The company plans to mass-produce 12-layer HBM3e products and launch 32 Gb DDR5 DRAM for servers. 3. SK hynix is expanding its production capacity with new fabs and aims to solidify its position in the AI memory market.

1. The Galaxy Watch FE is an entry-level smartwatch model by Samsung Electronics Japan, set to be released on July 31st for 34,760 yen; 2. It offers over 100 workout measurements, body composition analysis, and insights into sleep habits and health to support lifestyle improvements; 3. The watch features an Exynos W920 processor, 1.5GB of memory, 16GB of storage, a 1.2-inch Super AMOLED display, and runs on Wear OS powered by Samsung with One UI 5 Watch interface.

1. Namhae Chemical's subsidiary, NES Materials, has provided a prototype of high-purity sulfuric acid to Samsung for chip production. 2. The sulfuric acid, used for cleaning wafers, is undergoing performance testing by Samsung. 3. NES Materials is a joint venture established in 2021.

1. TSMC's Trusted Foundry strategy has limited Samsung's market share to non-TSMC customers. 2. Intel's IDM 2.0 has shown impressive progress and could potentially take market share from Samsung. 3. TSMC's Foundry 2.0 strategy focuses on expanding products and services, with N2 and N2P technologies expected to lead in performance and power efficiency.

1. Samsung has validated its LPDDR5X-10700 memory with MediaTek's upcoming Dimensity 9400 SoC, achieving a speed of 10.7 GT/s. 2. The 16 GB LPDDR5X package provides a memory bandwidth of 85.6 GB/second, enhancing AI and graphics performance. 3. This collaboration aims to improve power efficiency by over 25% and enhance on-device AI capabilities.

1. Samsung announces the Galaxy Tab S6 Lite (2024) with an S Pen for under $500; 2. The tablet features a 10.4-inch display, Exynos 1280 processor, 4GB of RAM, and 64GB of storage; 3. It runs on Android 14 and includes a 7,040mAh battery.

1. Samsung has introduced a 61.44 TB SSD, the BM1743, using 7th generation V-NAND QLC memory. 2. The company plans to offer the drive in U.2 and E3.S form factors for PCIe 4.0 and 5.0 respectively. 3. Samsung envisions future drives reaching up to 120 TB capacity based on the same technology.

1. Neosem has become the first company to supply inspection equipment for CXL 2.0 memory production. 2. The equipment is used to determine the operability of CXL 2.0 memory modules. 3. The customer for this new equipment is Samsung.

1. Samsung is developing a new chip package technology to address overheating issues in application processors (AP). 2. The technology involves attaching a heat path block (HPB) on top of the SoC. 3. It is expected to be implemented in future Exynos chips.

1. Samsung is using molybdenum in the metalization process of its 9th generation V-NAND. 2. The company has acquired five molybdenum deposition machines from Lam Research. 3. Samsung plans to introduce twenty more units next year.

1. Samsung and SK Hynix, South Korean memory chipmakers, are planning to adopt hybrid bonding technology for their upcoming 3D DRAM products. 2. SK Hynix announced its intention to use wafer bonding, a form of hybrid bonding, in the production of 3D DRAM during the International Memory Workshop 2024 in Seoul.

1. Samsung has unveiled its updated roadmap at the Samsung Foundry Forum U.S., detailing the evolution of its 2nm-class nodes through 2027. 2. The roadmap includes the introduction of BSPDN technology and the development of a 1.4nm-class node by 2027. 3. Samsung also rebranded its SF3P node to SF2, aiming at high-performance devices with improved PPA benefits.

1. Samsung has emphasized the necessity of hybrid bonding for the production of a 16-stack High Bandwidth Memory (HBM) in a recent paper. 2. The paper was presented at the 2024 IEEE 74th Electronic Components and Technology Conference in Colorado, discussing D2W (die to wafer) copper bonding.

Samsung is taking a two-track approach to its development of high-bandwidth memory (HBM).The company’s newly formed HBM development team, which was turned into a permanent office from a task force in March, is focusing on the development of HBM4, sources said. HBM4 is the sixth-generation iteration

Samsung’s chip division has returned to profitability in the first quarter on the back of the recovery of the memory chip market.The South Korean electronics maker said on Tuesday that it recorded 71.92 trillion won in revenue and 6.61 trillion won in operating profit, an increase of 13% and 932%, r