➀ Brian Huang, a high school senior, completed a fully open-source laptop project in six months.

➁ The laptop features a 4K AMOLED display, Cherry MX mechanical keyboard, and approximately 7 hours of battery life.

➂ Huang faced challenges with signal integrity when driving the 4K display but eventually solved the issue by shortening the cable length.

➀ Philip Heptonstall, a UKESF Scholar and Co-Op Intern at AMD, contributed to a systems-level understanding of Forward Error Correction (FEC) in high-speed interconnects.

➁ He developed a modeling tool to predict FEC performance, enabling rapid iteration of solutions. He also helped AMD upskill its employees and new graduates by organizing a course on modern ASIC design flows.

➂ Philip has been involved in STEM and community outreach work, including leading the Controls Systems sub-team for Edinburgh University Formula Student and promoting the UK Electronics Skills Foundation.

➀ The Fraunhofer Institute for Microstructure of Materials and Systems IMWS is working on a project called FA2IR with partners to develop solutions for using digital tools for fault analysis.

➁ The project aims to automate AI-assisted analysis to reduce subjectivity, shorten development times, and improve product quality.

➂ The initiative seeks to create comprehensive and fully integrated environments for processing and managing digital data, algorithms, methods, and models for machine learning that are globally applicable and can be dynamically expanded.

➀ TDK has developed a range of surface-mount high-current common-mode chokes for reflow soldering.

➁ These components can filter common-mode noise for currents ranging from 24A to 36A at +70°C and can achieve even higher currents with additional cooling.

➂ The new chokes are branded as 'SurfIND' and are available in various inductance values from 120 to 820µH, meeting IEC/EN 60938-2 standards.

➀ ITSA reported that Q4 orders in 2024 were the highest since Q2 2022, despite a -4% decrease in revenues year-on-year.

➁ Market segments showed varied performance, with Broadcast up 83%, Medical +48%, Communication +29%, and Mil/Aero +4%.

➂ The UK connector market remained stable in 2024, but 2025 is expected to be cautious with flat revenues and minimal growth.

➀ SemiQ Inc.推出了一款新的1700V SiC MOSFET系列，旨在增强中压高功率转换应用。

➁ 这些MOSFET具有优化系统尺寸、功率密度和成本效益的特点，并通过了AEC-Q101认证。

➂ 新系列还推出了简化系统集成的电源模块。

➀ STMicroelectronics has introduced a new microcontroller series with embedded AI capabilities, boosting AI at the edge.

➁ The STM32N6 series features a Neural-ART Accelerator, providing up to 600 times the ML performance compared to existing STM32 MCUs.

➂ The series is designed for various applications including computer vision, audio processing, and sound analysis, and is supported by ST's Edge AI Suite.

➀ The MSI Codex Z2 gaming PC is currently available for $899 at Best Buy, a $300 discount from its original price of $1199.

➁ It features an AMD Ryzen 5 8400F processor, Nvidia RTX 4060 Ti graphics card, 16GB DDR5 RAM, and a 1TB NVMe SSD.

➂ This budget gaming PC is suitable for 1080p and even some 1440p gaming with its hardware configuration.

➀ ADIY has unveiled a new microcontroller board named ADIY UNO R3, which is an affordable alternative to the popular Arduino UNO R3.

➁ The board features a versatile design suitable for applications like robotics, automation, control systems, and IoT projects.

➂ Key specifications include digital I/O pins, analog input pins, a microcontroller, and communication options such as UART, I2C, and SPI.

➀ Chemi-Con has introduced nanocrystalline core AC and DC common-mode inductors called the FW series, which reduce core volume and the number of copper wire turns.

➁ Compared to the FL-V series, the magnetic permeability of the FW series has improved by approximately 150% at 10kHz.

➂ TTI sees these inductors being used in medical equipment, communication base stations, and industrial equipment.

➀ The ST-Globalfoundries plan to construct a joint FD-SOI 12-inch wafer fab at Crolles has reportedly been put on hold.

➁ The project, which received €2.9 billion in EU subsidies, has seen no significant progress over the past 18 months, raising concerns about its feasibility.

➂ Market conditions in the global semiconductor industry have worsened, and both ST and GloFo are shifting focus towards opportunities in the Chinese market.

➀ Micross Components, Inc. has completed the acquisition of Integra Technologies.

➁ This acquisition makes Micross the leading U.S.-based Outsourced Semiconductor Assembly and Test (OSAT) provider.

➂ The acquisition strengthens Micross's capabilities in providing high-reliability microelectronic products and services for various applications including aerospace, defense, space, medical, and industrial sectors.

➀ The Fraunhofer IPMS has developed high-precision area light modulators that are crucial for semiconductor and other industries due to increasing miniaturization and complexity.

➁ These modulators use micro-mirror arrays that can be individually tilted or lowered to control and manipulate light direction, intensity, or phase with nanometer precision and high programming speeds.

➂ Applications include structured illumination, pattern generation, laser ablation, and holographic 3D imaging, with evaluation kits available for customers and users.

➀ The Fraunhofer IPMS has developed spatial light modulators that can project light, process materials, and send optical signals with high precision in the nanometer range.

➁ These modulators consist of millions of mirrors on a single semiconductor chip, enabling applications in semiconductor technology, material processing, and 3D holographic display technology.

➂ Fraunhofer IPMS will showcase their latest research and development at SPIE Photonics West, including customer evaluation kits and a novel actuator concept for wavefront control.

➀ Microchip Technology has developed a reference design for a Bluetooth Low Energy (BLE) gateway for thermostats, utilizing BLE 5.2 and Wi-Fi technologies.

➁ This design includes a PIC32CZ CA microcontroller-based gateway and RNBD451 BLE modules, supporting multi-node BLE connectivity and cloud-enabled monitoring.

➂ The design facilitates rapid prototyping and development, reducing costs and development time while supporting various use cases like smart home automation, healthcare monitoring, and industrial IoT applications.

➀ Chip Scale Packaging (CSP) is an advanced packaging technology that allows for smaller, more efficient electronic components.

➁ CSP is transforming device design and manufacturing processes across various industries.

➂ The technology optimizes space usage and enhances performance in microelectronics.

➀ Microchip Technology recently introduced the PCI100x family of PCIe Gen 4.0 switches designed for automotive, industrial, and data center environments.

➁ These switches offer robust scalability, reliability, and low-latency connectivity for modern High-Performance Computing (HPC) systems.

➂ They feature advanced error reporting, containment, and synthesis functions, supporting various temperature ratings and are suitable for diverse applications.

➀ Tom's Hardware reviewed the RayNeo Air 2s, a pair of augmented reality glasses from TCL's RayNeo subsidiary.

➁ The Air 2s offers attractive design and wide compatibility but lacks advanced features and has mediocre audio quality.

➂ Despite its drawbacks, the Air 2s is priced competitively, making it a good value for those seeking AR glasses.

➀ Microchip Technology is expanding its presence in the AI chip market with new developments in EDA tools.

➁ Silicon Motion is collaborating with Analog Bits on advanced memory solutions for next-generation devices.

➂ DeepCool and Noctua are partnering to improve cooling solutions for high-performance computing applications.