Recent #Microchip news in the semiconductor industry

5 months ago
➀ A research team from Daegu Gyeongbuk Institute of Science & Technology has developed a new technique to regulate doping during the nucleus phase, enhancing the performance of semiconductor nanocrystals; ➁ The study highlights the influence of the choice of doping element on the process and location; ➂ The technology is expected to have wide applications in advanced electronic devices.
3D ICEDAHPCMicrochipsemiconductor
5 months ago
➀ The design is optimized to extract maximum power from solar panels under various conditions; ➁ It supports various panels, chemistries, and power ranges for outdoor applications; ➂ The design includes features like battery and output load current/voltage/power metering, temperature monitoring, and automatic cooling fan control.
Microchip
6 months ago
➀ Compute Express Link (CXL) technology is expected to move from a niche to mainstream use in 2025; ➁ CXL's support for memory expansion is a significant driver, with various server and memory solutions now available; ➂ CXL 2.0 and future generations of PCIe/CXL will enable more advanced use cases like switching and dynamic memory allocation.
2nm3D IC3nmAIAI ChipAI PCAMDArmAsusCXLChipletCoolingDDR4DRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonIntelLaptopLinuxMicrochipNPUNVIDIAPCIePrivacyRaspberry PiSSDSoftwareSwitchTIXeonautomotivecpucybersecurityddr5iosmemorymonitorsemiconductorserver
6 months ago
➀ Crypto Quantique has upgraded its QuarkLink IoT platform with a hybrid post-quantum cryptographic algorithm; ➁ The platform reduces the time and expense of implementing security functions in embedded devices by up to 10X; ➂ The hybrid key encapsulation mechanism combines X25519 with Kyber (ML-KEM) for both current and future security.
EncryptionIoTMicrochipPrivacySoftwarecybersecuritypost-quantum cryptographysecuritytechnology
6 months ago
➀ Scientists and engineers from UKAEA and the University of Bristol have created the world's first carbon-14 diamond battery; ➁ The battery leverages the radioactive isotope carbon-14 to produce a diamond battery with a potential lifespan of thousands of years; ➂ The technology could be used in medical devices and extreme environments, providing continuous power for decades.
AIAI ChipCoolingHPCLaptopMicrochipPrivacySoftwareautomotivecybersecuritygamingmemorysemiconductor
6 months ago
➀ Researchers from City University of Hong Kong have observed a new vortex electric field with potential applications in enhancing future electronic, magnetic, and optical devices; ➁ The research, published in Science, could lead to improved memory stability and computing speed, as well as impact quantum computing, spintronics, and nanotechnology fields; ➂ The team developed an innovative ice-assisted transfer technique to create twisted bilayers with a wide range of twist angles, leading to the discovery of a 2D quasicrystal that may enhance various device capabilities.
3D ICAI ChipEDAGaNHPCMicrochipNanotechnologySoftware
6 months ago
➀ Asahi Kasei Microdevices (AKM) has launched the HQ0A11 InAs Hall element, which is its smallest and thinnest package yet at 0.8 x 0.4 x 0.23 mm. It is 85% smaller than the previous model, HQ0811, and offers a 16% better S/N ratio. This advancement is expected to improve performance in smartphone camera modules and small robots. ➁ The HQ0A11 features a GaAs Hall element with over 3.5 times higher position detection accuracy than its predecessor, the HG0C11. ➂ The element's compact size and high sensitivity make it suitable for applications requiring precise position detection, such as camera lens control.
Camera TechnologyMicrochipsensors
6 months ago
➀ Microchip is shutting down a factory in Arizona due to high inventory levels and ample capacity; ➁ The closure is expected to be completed in Q3 2025, resulting in the loss of 500 jobs; ➂ The company anticipates annual savings of $90 million from the closure, following a challenging few quarters in the automotive sector.
Microchip
6 months ago

➀ Microchip Technology is planning to close a factory in Tempe, Arizona, impacting approximately 500 employees;

➁ The closure is due to high inventory levels and the company's ability to expand capacity in other factories;

➂ The company's CEO has retired, with the board chair stepping in as interim CEO and President.

Factory ClosureMicrochip
6 months ago
➀ Melexis introduces a family of angle-sensing absolute magnetic encoder ICs for electric motors that operate at high speeds and offer 1° accuracy or better. ➁ The MLX90382 can track absolute angle position and speeds up to 200,000rpm by detecting the three components of magnetic flux density. ➂ The ICs come in various versions and packages, and offer on-axis and off-axis sensing capabilities.
MelexisMicrochipautomotivesensor
7 months ago
➀ This reference design introduces a compact BLDC motor controller optimized for high performance and efficiency in micro-mobility applications. ➁ The controller, designed by Microchip, supports up to 3kW power levels and features advanced control algorithms for precise torque and speed control. ➂ The design includes a robust three-phase inverter stage and various safety protections, making it suitable for e-scooters and e-bikes.
BLDC MotorDIYMicrochipMotor ControlReference Designelectronics
7 months ago
➀ Tanaka claims to have developed the world's first bulk platinum with controlled crystal grain size in the nano scale; ➁ This new technology enables the development of pure platinum with 99.9% or higher purity, offering 10 times the hardness and 4 times the strength of typical platinum materials; ➂ The developed platinum has unique properties due to its high density of small-angle grain boundaries, large-angle grain boundaries, dislocations, and other lattice defects, which may lead to its application in various industries.
3D ICEDAMicrochipsemiconductor
7 months ago
➀ Hynix plans to start sampling HBM3e 16hi memory with 48 GB capacity per cube in H1 2025; ➁ HBM3e 16hi offers a high-capacity alternative before the production of HBM4 16hi; ➂ HBM3e 16hi can deliver a maximum capacity of 384 GB per system, surpassing NVIDIA’s Rubin at 288 GB; ➃ Transitioning from HBM3e to HBM4 will double the I/O count and increase die size, but the per-die capacity remains at 24 GB; ➄ HBM3e 16hi will adopt the Advanced MR-MUF stacking process for higher stack counts and computational bandwidth.
HynixChipletDRAMHBMMicrochipTSMC