Recent #AI PC news in the semiconductor industry

6 months ago
➀ 35ELEMENTS致力于通过开发立方氮化镓半导体材料来帮助实现碳中和;➁ 公司计划在两年内在兼容CMOS的Si(100)衬底上扩大其材料规模,并寻求与代工厂的合作;➂ 35ELEMENTS拥有立方氮化镓材料的独家专利,并计划制造高效的光发射器,如创新型绿色发光二极管。
2nm3D IC3nmAIAI PCAI chipAMDASUSArmCPUChipletDRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonLinuxNPUNVIDIAPCIePrivacyRaspberry PiSEMICONDUCTORSK hynixSSDSwitchTIautomotivecoolingcybersecuritygamingiOSlaptopmemorymicrochipmonitorsoftware
7 months ago
➀ Intel's shift to a more transparent strategy in technology announcements; ➁ The competition between Intel's PowerVia and TSMC's Super Power Rail; ➂ Andy Grove's philosophy of maintaining a 'healthy amount of paranoia'.
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7 months ago
➀ A class-action lawsuit alleges that UnitedHealthcare uses a faulty algorithm to deny patient coverage, filed by two now-deceased individuals. ➁ UnitedHealthcare CEO Brain Thompson was killed in Midtown Manhattan earlier this week, and the suspect is currently on the run. ➂ The lawsuit claims UnitedHealthcare pushed employees to use an algorithm with a 90% error rate to deny coverage.
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8 months ago
➀ The rise of RISC-V cores and the challenges of certification; ➁ The role of Breker Verification Systems in the certification process; ➂ The complexity of certifying RISC-V ISA implementations and the efforts of RISC-V International.
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9 months ago
➀ Google is rumored to switch to TSMC's N3E process for Tensor G5; ➁ The report also clarifies that Google has chosen not to use 2nm technology for Tensor G6; ➂ The move could impact the competition in the AI and smartphone chip markets.
2nm3D IC3nmAIAI PCAI chipAMDASUSArmCPUChipletDRAMDellEDAGDDRGPUGaNHBMHPCInfineonLinuxNPUNVIDIAPCIePrivacyRaspberry PiSEMICONDUCTORSK hynixSSDSwitchTITSMCautomotivecoolingcybersecuritygamingiOSlaptopmemorymicrochipmonitorsoftware
9 months ago
➀ Arm is exploring the feasibility of running LLMs on mobile devices; ➁ Arm's optimization techniques for LLMs on mobile; ➂ The importance of practical use cases for LLMs in mobile devices
2nm3D IC3nmAIAI PCAI chipAMDASUSArmCPUChipletDRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonLinuxMobileNPUNVIDIAPCIePrivacyRaspberry PiSEMICONDUCTORSK hynixSSDSwitchTIautomotivecoolingcybersecuritygamingiOSlaptopmemorymicrochipmonitorsoftware
about 1 year ago
1. AMD unveiled the Zen 5 CPU microarchitecture at Computex 2024, introducing two new client platforms: Ryzen AI 300 series for laptops and Ryzen 9000 series for desktops. 2. The Ryzen AI 300 series, code-named Strix Point, features a new XDNA 2 NPU promising 50 TOPS of performance and upgraded RDNA 3.5 integrated graphics. 3. Zen 5 architecture shows significant improvements over Zen 4, with higher instructions per cycle and advancements in both graphics and AI performance.
AI PCAMDZen 5
4 months ago

➀ Alphawave Semi推出了针对高速互连半导体市场的最新光电子解决方案,预计到2028年市场规模将超过40亿美元。

➁ 新产品包括支持PAM4和Coherent-lite调制的数字信号处理器(DSP),以实现AI驱动的高速数据中心数据传输。

➂ 该解决方案利用了Alphawave的WidEye DSP架构和EyeQ高级诊断技术,并提供800G和1.6T的互连能力。

AIAI ChipAI PCChipletEDAHPCsemiconductor
4 months ago

➀ A student at the University of Applied Sciences in Hagen, Melanie Welp, has developed a contactless timing system for Paralympic swimming to prevent injury from head impacts.

➁ The prototype uses an ultrasonic sensor to measure the time at six meters and 50 centimeters before the edge of the pool.

➂ The system has been tested and shown to be possible without causing injury to swimmers.

2nm3D IC3nmAIAI ChipAI PCAMDArmAsusChipletCoolingDRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonLaptopLinuxMicrochipNPUNVIDIAPCIePrivacyRaspberry PiSK HynixSSDSoftwareSwitchTIautomotivecpucybersecuritygamingiosmemorymonitorsemiconductor
4 months ago

➀ A trawler caught 7 1/2 times as much fish as with conventional driftnet methods using new electronic fish-finding equipment developed by Kelvin and Hughes (Marine) limited;

➁ The story dates back to 65 years ago, when CERES (Combined Echo Ranging Echo Sounding) equipment was introduced;

➂ CERES combined echo-ranging and echo-sounding to improve fishing efficiency.

2nm3D IC3nmAIAI ChipAI PCAMDArmAsusChipletCoolingDRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonLaptopLinuxMicrochipNPUNVIDIAPCIePrivacyRaspberry PiSK HynixSSDSoftwareSwitchTIautomotivecpucybersecuritygamingiosmemorymonitorsemiconductor
4 months ago

➀ e-con Systems has launched a new embedded camera designed for integration with the NVIDIA Holoscan platform, enabling real-time AI-based object detection and recognition.

➁ The camera is ideal for industrial automation, robotics, and medical imaging applications, featuring high-speed and low-latency imaging with e-con's proprietary TintE Image Signal Processor (ISP).

➂ It leverages the NVIDIA Holoscan Sensor Bridge powered FPGA board to simplify setup and offload image processing tasks, optimizing GPU resources for AI inference.

AIAI PCCameraGPUHPCMedicalNVIDIAembeddedindustrial
4 months ago

➀ Ed向他的日记透露,执政不到一年的工党政府正在削减福利预算;

➁ 总理认为Ed是一个多面手,经常找他解决问题,Ed成了他的跑腿;

➂ 总理希望Ed帮助解决长期病假人员的问题,以减少福利预算开支,并避免政府形象受损。

2nm3D IC3nmAIAI ChipAI PCAMDArmAsusChipletCoolingDRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonLaptopLinuxMicrochipNPUNVIDIAPCIePrivacyRaspberry PiSK HynixSSDSoftwareSwitchTIautomotivecpucybersecuritygamingiosmemorymonitorsemiconductor
4 months ago

➀ The article discusses how 3D NAND flash memory is becoming essential for meeting the increasing data storage needs driven by AI. It highlights the shift from 2D to 3D NAND structures, which allow higher storage density through vertical stacking.

➁ Key players like Samsung, Western Digital, and SK Hynix are mentioned as leaders in 3D NAND technology. The article also explores innovations in cryogenic etching technology, which enhances etching capabilities and addresses scaling challenges.

➂ The global NAND flash memory market is expected to grow significantly, reaching $83 billion by 2036. Lam Research is noted as a market leader in 3D NAND dielectric etching, with advancements like the Lam Cryo™ 3.0 enabling more efficient and precise etching processes.

3D ICAIAI PCDRAMEDAHPCSK Hynixmemorysemiconductor
4 months ago

➀ ASUS introduced the ASUS Ascent GX10, a petaflop-scale AI supercomputer powered by the NVIDIA Grace Blackwell Superchip. It provides unprecedented computing power, high-speed memory integration, and easy scalability for enterprise-level AI capabilities.

➁ The device delivers 1,000 TOPS of AI processing power, supporting AI models with up to 200 billion parameters. It includes Blackwell GPU with fifth-generation Tensor Cores and Grace 20-core Arm CPU for efficient data orchestration and real-time inferencing.

➂ The supercomputer integrates NVIDIA NVLink-C2C connectivity, offering 5x the bandwidth of PCIe 5.0. It supports seamless transitions between local development and scalable deployment, aiding developers in AI model prototyping and fine-tuning.

AIAI ChipAI PCChipletEDAGPUHPCMicrochipNVIDIAcpu
4 months ago

➀ Texas Instruments (TI) has released new power-management chips aimed at meeting the rising power demands of modern data centers, particularly for high-performance computing and AI applications.

➁ These chips, including the TPS1685 and integrated GaN power stages, offer enhanced protection, higher density, and improved efficiency, with a focus on reducing size by 50% compared to traditional hot-swap controllers.

➂ TI's innovations are designed to support data center engineers, power system architects, and hardware developers in creating more sustainable and energy-efficient data center infrastructures.

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