➀ Samsung and SK Hynix are expanding their DRAM business due to the rapid growth of AI, which is expected to make the global DRAM market surpass the foundry sector. ➁ Samsung plans to build a new production line for DRAM and HBM chips in Pyeongtaek, while SK Hynix is set to triple its investment in DRAM chips. ➂ The global memory chip market, including DRAM and NAND flash, is forecast to nearly double to $175 billion this year, driven by investments in AI data centers.

➀ The spot price for consumer memory fell by 30% in Q2, creating a dislocation with contract prices. ➁ Module makers experienced a 40% year-over-year decline in consumer NAND shipments through retail channels, suggesting weak demand. ➂ Next year, DRAM prices are expected to rise gradually each quarter, driven by the increasing adoption of HBM3e.

➀ SK Hynix has developed the industry's first 6th generation 10nm-class DRAM chip, named 1c 16Gb DDR5, featuring lower power consumption and higher efficiency. ➁ The new DDR5 chip operates at 8Gbps, a 11% increase in speed and over 9% improvement in energy efficiency compared to its predecessor. ➂ SK Hynix plans to start mass production of the 1c DDR5 DRAM by the end of this year and begin supplying it next year, aiming to reduce data center power costs by up to 30%.

➀ SK Hynix has announced the development of a Gen 6 10-nanometer (nm) 16Gb DDR5 DRAM, marking the first in the industry. ➁ This development positions SK Hynix ahead of its domestic competitor, Samsung, which began manufacturing Gen 5 DRAM in May. ➂ The competition between SK Hynix and Samsung continues to drive advancements in DRAM technology.

➀ SK Hynix has developed the world's first sixth-generation 10nm-class DDR5 DRAM, featuring a 16Gb module. ➁ The new 1c process is reported to be 11% faster and 9% more energy-efficient than its predecessor. ➂ SK Hynix claims this technology can reduce data center electricity bills by up to 30% due to its enhanced power efficiency.

➀ Infineon has settled outstanding claims with Qimonda's insolvency administrator by paying $800 million, 15 years after Qimonda's bankruptcy. ➁ The administrator had previously sued Infineon for $3.35 billion, alleging inflated transfer prices. ➂ The settlement will impact Infineon's earnings and cash flow negatively, utilizing the provisions set aside for the legal dispute.

➀ A company once dominated the worldwide DRAM market with an 85% share; ➁ It was acquired for $345 million in 1979 but sold for only $71 million in 1985; ➂ The moral of the story is that circumstances can change rapidly in the chip industry.

➀ No significant rebound in demand in the DRAM spot market; ➁ DDR4 spot prices could weaken further due to passive buyer behavior; ➂ Ample supply of reball DDR4 chips prevents price hikes; ➃ NAND flash spot prices drop as traders anticipate demand revival in Q3 2024.

➀ Samsung has formed a new HBM development team and is targeting to tape-out HBM4 by the end of the year. ➁ The HBM4 will use Samsung's 4nm foundry process for the logic die and 10nm 6th-generation (1c) DRAM for the memory chip. ➂ Samsung's HBM4 test products are expected to be released next year, with mass production slated for the end of 2025.

➀ DRAM market is expected to recover faster than previously predicted, with revenues projected to surge in 2024 and 2025. ➁ Major players like Samsung, SK Hynix, and Micron are competing fiercely, focusing on advanced technologies such as EUV lithography and HBM. ➂ The introduction of EUV technology is crucial for achieving smaller node sizes and higher efficiency in DRAM production.

➀ SK Hynix is planning to increase DRAM prices by up to 20% in the coming quarters. ➁ The price hike is due to a shift in manufacturing resources from DRAM to high-bandwidth memory (HBM) for AI accelerators. ➂ This move follows an industry-wide trend of reducing DRAM production to focus on HBM, leading to a supply shortage and potential price increases for DDR5.

➀ Q2 DRAM revenues surged 24.8% q-o-q to $22.9 billion; ➁ Samsung's revenue grew 22% to $9.82 billion with a 17%-19% ASP increase; ➂ SK hynix's revenue increased 38.7% to $7.91 billion driven by HBM3e products.

➀ HBM addresses bandwidth limitations in traditional 2D packaging by using stacked memory chips and TSV technology. ➁ Key technologies in HBM include advanced packaging, microbump interconnects, and TSV. ➂ HBM offers higher bandwidth and lower power consumption compared to GDDR, making it suitable for high-performance computing and graphics processing.

➀ SK Hynix announces plans to develop a 4F2 DRAM similar to Samsung; ➁ The cost of EUV processes has been rapidly increasing since the commercialization of 1c DRAM; ➂ Seo Jae Wook, an SK Hynix researcher, highlighted this during an industry conference in Seoul.

➀ Samsung has initiated mass production of 12-nanometer-class LPDDR5X DRAM packages, which are thinner and offer better heat resistance, suitable for mobile, gaming, and AI devices. ➁ These new DRAM packages are designed to enhance space efficiency and thermal management, crucial for on-device AI applications. ➂ Samsung is also developing even thinner 24GB and 32GB modules to meet future demands for compact and high-performance memory solutions.

➀ SK hynix has secured up to $450 million in direct funding and access to $500 million in loans to build an advanced memory packaging facility in Indiana. ➁ The facility is expected to start operations in 2028, producing HBM4 or HBM4E memory. ➂ The project aims to strengthen the U.S. semiconductor industry and create up to 1,000 jobs.

➀ Samsung has started mass production of 12 GB and 16 GB LPDDR5X modules in the industry's thinnest package, measuring 0.65 mm in thickness. ➁ The ultra-thin design was achieved through new packaging methods and an optimized back-lapping process, offering a 21.2% improvement in heat resistance. ➂ Thinner LPDDR5X packaging enhances airflow within smartphones, significantly improving thermal management and potentially extending device lifespan.

1. DRAM and NAND Flash revenue expected to increase significantly in 2024 due to AI. 2. DRAM revenue projected to reach $90.7 billion in 2024, with a further increase to $136.5 billion in 2025. 3. NAND Flash revenue expected to reach $67.4 billion in 2024, driven by QLC enterprise SSDs.

1. SK Hynix achieved its highest operating profit in six years during the second quarter of 2023. 2. The company reported revenue of 16.42 trillion won and operating profit of 5.46 trillion won. 3. Net income for the quarter was 4.12 trillion won.

1. JEDEC has announced plans for advanced memory modules including DDR5 Multiplexed Rank Dual Inline Memory Modules (MRDIMM) and a next-generation Compression-Attached Memory Module (CAMM) for LPDDR6 to support high-performance computing and AI applications. 2. The MRDIMM standard aims to double the bandwidth to 12.8 Gbps and increase the pin speed, supporting more than two ranks and ensuring compatibility with conventional RDIMM systems. 3. The next-generation CAMM module for LPDDR6 targets a maximum speed greater than 14.4 GT/s, offering a 24-bit subchannel, a 48-bit channel, and a connector array.