➀ Samsung has started mass production of 12 GB and 16 GB LPDDR5X modules in the industry's thinnest package, measuring 0.65 mm in thickness. ➁ The ultra-thin design was achieved through new packaging methods and an optimized back-lapping process, offering a 21.2% improvement in heat resistance. ➂ Thinner LPDDR5X packaging enhances airflow within smartphones, significantly improving thermal management and potentially extending device lifespan.
Related Articles
- Q4 DRAM market grew 9.9%6 months ago
- Samsung re-engineering its HBM design8 months ago
- China-made DDR5 memory chips use less advanced chipmaking technology — chips are nearly 40% larger than Samsung's DDR58 months ago
- Samsung HBM3E memory supply to NVIDIA is 'realistically impossible' to do this year, now 20259 months ago
- Samsung gearing up for 1c DRAM mass production, its competitive edge in HBM4 memory9 months ago
- Samsung to change packaging method of low-power DRAM used in iPhones9 months ago
- [News] Samsung Reportedly Mulls to Offload Outdated NAND Equipment in China to Local Companies | TrendForce News10 months ago
- DRAM surgingabout 1 year ago
- Industry’s Thinnest DRAM Packages For On-Device AIabout 1 year ago
- Samsung Validates LPDDR5X Running at 10.7 GT/sec with MediaTek's Dimensity 9400 SoCabout 1 year ago