1. JEDEC has announced plans for advanced memory modules including DDR5 Multiplexed Rank Dual Inline Memory Modules (MRDIMM) and a next-generation Compression-Attached Memory Module (CAMM) for LPDDR6 to support high-performance computing and AI applications. 2. The MRDIMM standard aims to double the bandwidth to 12.8 Gbps and increase the pin speed, supporting more than two ranks and ensuring compatibility with conventional RDIMM systems. 3. The next-generation CAMM module for LPDDR6 targets a maximum speed greater than 14.4 GT/s, offering a 24-bit subchannel, a 48-bit channel, and a connector array.