➀ ETH Zürich students created a rotating multi-metal 3D printer that processes multiple metals simultaneously, drastically reducing production time;

➀ The machine, designed for aerospace and industrial applications (e.g., rocket nozzles, turbines), uses a rotating platform for continuous printing and precise gas flow control;

➂ ETH filed a patent for this innovation, which aims to scale for larger components and broader use in fields like e-mobility and aviation.

➀ Chiplet-based SoCs offer increased yield, design flexibility, and simplified assembly compared to traditional monolithic SoCs；

➁ UK patent enforcement becomes complex for chiplet-based designs, as individual chiplets may not directly infringe all patent claims；

➂ Drafting patents to cover individual chiplets rather than entire systems is advised for stronger IP protection.

➀ The 75th ECTC highlighted three key packaging themes: Co-Packaged Optics (CPO) integration, Hybrid Bonding (HB) advancements, and thermal management for Backside Power Delivery (BPD).;

➁ CPO discussions emphasized materials innovation (e.g., glass substrates) to address thermal and optical challenges in AI chiplets, while HB sessions focused on scaling density, reducing defects, and integrating metrology for memory/3D IC applications;

➂ BPD thermal solutions explored interlayer cooling, multi-level modeling, and novel structures like microchannels to tackle heat dissipation in 3D architectures.

➀ Fraunhofer IZM-ASSID celebrated 15 years as a pioneer in 3D system integration and wafer-level packaging, driving innovations like TSV processing and chiplet architectures;

➁ Flagship projects CEASAX (300mm microelectronics R&D) and APECS (EU Chips Act pilot line) strengthen Europe's competitiveness in semiconductor advanced packaging and edge AI;

➂ Strategic collaborations with GlobalFoundries, Infineon, Siemens, and academia solidify its role in global high-tech ecosystems and technological resilience.

➀ Fraunhofer IZM-ASSID celebrated its 15th anniversary as a global innovation leader in 3D system integration and wafer-level packaging, driving advancements in hybrid bonding and chiplet architectures;

➁ Key projects like CEASAX and the APECS pilot line under the EU Chips Act strengthen Europe's semiconductor ecosystem, enabling modular chip design and industrial collaboration;

➂ The institute fosters partnerships with industry giants (e.g., Infineon, GlobalFoundries) and academia, supporting critical research in edge AI, quantum computing, and automotive electronics.

➀ TrendForce releases the 2024 ranking of the top ten OSAT (Outsourced Semiconductor Assembly and Testing) companies;

➁ The article references related rankings of semiconductor companies and market trends;

➂ Highlights the critical role of OSAT providers in the semiconductor supply chain.

➀ Researchers at Science Tokyo developed BBCube - a 3D chip stacking architecture enabling direct DRAM-xPU integration with 10μm chip gaps and 10ms/chip bonding;

➁ Innovations include inkjet-based COW bonding, heat-resistant DPAS300 adhesive, and embedded capacitors for power delivery;

➂ Reduces data transmission energy by 80-95% compared to traditional 2D systems, promising breakthroughs for AI accelerators and edge devices.

➀ MIT researchers developed a low-cost method to integrate gallium nitride (GaN) transistors onto standard silicon chips using copper bonding, enabling higher performance and efficient scaling;

➁ The process eliminates wafer-level bonding, reduces GaN material waste by 95%, and operates at temperatures below 400°C to prevent thermal damage;

➂ Demonstrated power amplifiers showed superior bandwidth and signal gain, with potential applications in consumer electronics, AI infrastructure, and quantum computing.

➀ A non-destructive X-ray imaging method with a 12-nm beam analyzed structural deformations in nanosheets used in Gate-All-Around Field Effect Transistors (GAAFETs);

➁ Two deformation mechanisms were identified: long-range (lattice mismatch and edge relaxation) and short-range (linked to nanosheet layering);

➂ IBM and Brookhaven's NSLS-II collaboration provides insights to enhance reliability and performance prediction for nanoscale electronics.

➀ Soitec collaborates with PSMC to supply TLT-ready wafers for advanced 3D chip stacking, marking the first public reveal of its TLT technology；

➁ The technology enables ultra-thin transistor layer transfers (5nm-1µm), enhancing chip power efficiency and supporting vertical architectures like backside power delivery；

➂ Utilizes Smart Cut and IR laser processing to lift layers without thermal stress, advancing applications in AI, autonomous driving, and mobile devices.

➀ Qorvo launched the QPF4557 integrated front-end module for Wi-Fi 7, optimizing power efficiency and performance through a 5V supply and digital pre-distortion technology.

➁ The module supports a wide bandwidth (5.125 to 5.925 GHz) and integrates components like a power amplifier, switch, coupler, and low-noise amplifier into one device.

➂ It aims to enhance throughput, reduce power consumption, and minimize layout area for advanced Wi-Fi 7 systems.

➀ The article features a 'holographic truck' claimed as the world's first 3D holographic experience truck, utilizing rotating LEDs to create immersive visual effects;

➀ The innovation was highlighted by AV Magazine, emphasizing its unique application of holographic technology in a mobile format;

➂ The truck’s debut location remains unspecified, but its blend of automotive and advanced display technology showcases experimental semiconductor-driven solutions.

➀ TSMC showcased its advanced semiconductor technologies at the 2025 Europe Symposium, highlighting N3 nodes' high-volume production with variants for CPUs, cost-effective products, and automotive applications;

➁ Unveiled next-gen N2 and A16/A14 processes with performance/efficiency improvements, and introduced CFET transistor designs achieving double density;

➂ Demonstrated 3D Fabric innovations (SoIC/CoWoS), wafer-scale AI systems (SoW-X), and specialized automotive/IoT solutions including RRAM/MRAM and N4C RF for emerging wireless standards.

➀ Analogue Insight and Tetrivis collaborate on developing Eurytion RFK1, a 12 nm RF chiplet transceiver supporting Ka/Ku-band with 2 GHz programmable bandwidth;

➁ The chiplet integrates Tetrivis' KuKa® IP and a local oscillator, leveraging UCIe standards for scalable connectivity;

➂ Targets applications in satellite communications, 5G, and aerospace due to its wideband performance and compact design.

➀ Karlsruhe Institute of Technology (KIT) secured two Excellence Cluster grants for battery research (POLiS) and 3D materials (3DMM2O), each funded up to €70 million over seven years;

➁ POLiS focuses on developing lithium-free batteries for sustainable energy storage, emphasizing ion tracking and cell component interactions;

➂ 3DMM2O pioneers molecular-scale 3D printing, targeting organoid formation, biohybrid systems, and energy-efficient optical switches.

➀ Fraunhofer IAPT presents collaborative robots (Cobots) at automatica 2025, automating production processes and reducing expertise requirements for additive manufacturing;

➁ The Cobots leverage sensors, end-to-end data formats, and customized tools like silicone grippers to enhance process stability and product quality;

➂ These solutions highlight additive design benefits for complex geometries, improving resource efficiency and productivity in low-volume, highly customized production.

➀ Researchers developed a 3D display system using circularly polarized luminescence (CPL) technology to enhance visual quality and human-computer interaction;

➁ The system employs an orthogonal-CPL-emission mechanism and self-positioning microdevices with a record glum factor of 1.0, enabling real-time depth perception;

➂ Demonstrated in rescue simulations, the technology shows potential in robotics, industrial automation, and medical applications through immersive 3D control capabilities.

➀ Kioxia is sampling enterprise SSDs with 8th-gen BiCS FLASH TLC, integrating CMOS Bonded to Array (CBA) technology to enhance power efficiency, performance, and capacity;

➁ The CM9 Series SSDs deliver up to 65% better random write, 55% random read, and 95% sequential write performance versus prior generations, alongside significant efficiency gains per watt;

➂ Key features include PCIe 5.0 compliance, dual-port support, and capacities up to 61.44TB (2.5-inch) and 30.72TB (E3.S form factor).

➀ The 8th UKP Workshop in Aachen focused on ultrashort pulse laser technology advancements, addressing beam sources, system innovations, and scaling strategies to enhance precision and productivity in industrial applications;

➀ Key developments included high-power UV/DUV lasers, MEMS/LCoS modulators for beam shaping, GHz burst systems, and multi-scanner setups to optimize throughput and process control;

➂ Applications spanned medical device manufacturing (e.g., adhesive-free glass welding), semiconductor chip separation, and consumer electronics, with live demos showcasing laser-induced etching and neural network-guided beam shaping.

➀ The 8th UKP Workshop in Aachen gathered 120 experts to discuss advancements in ultrafast laser technology, focusing on scaling processes for higher productivity and precision in material processing;

➁ Innovations included high-power UV/DUV lasers, beam shaping with LCoS/MEMS modulators, and multi-scanner systems to manage large data volumes, alongside applications in semiconductor manufacturing and medical technology;

➂ Key demonstrations highlighted selective laser-induced etching (SLE) and inline process control, emphasizing improved accuracy (±1 µm) and the transition of ultrafast lasers from research to industrial adoption.