➀ The EU-funded OPeraTIC project developed an ultrafast pulsed laser system integrating AI and real-time monitoring for efficient 3D surface treatment in industrial applications, tested across household appliances, lighting, aviation, and automotive sectors;

➁ Key advancements include 3D motion integration via robotics, versatile material structuring (stainless steel, aluminum, composites), real-time quality control, AI-driven process optimization, and Industry 4.0 compatibility;

➂ The platform aims to reduce errors, enhance efficiency, and enable sustainable high-performance manufacturing through scalable, intelligent laser technology.

➀ Researchers at the University of Würzburg developed a topological insulator functioning at higher temperatures (−213°C), overcoming previous limitations requiring near-absolute-zero conditions;

➁ The material features a three-layer quantum well (InAs/GaInSb/InAs), enhancing bandgap energy and structural symmetry for robust, low-loss electron transport;

➂ This breakthrough paves the way for energy-efficient topological electronics compatible with silicon chip technology, enabling scalable and reliable applications.

➀ ASML unveils the industry's first lithography scanner designed specifically for 3D packaging, with quadrupled productivity versus competitors;

➁ The Twinscan XT:260 supports 400nm resolution, handles warped wafers up to 1.7mm thick, and enables 4X reticle-sized interposers without stitching;

➂ This tool bridges the gap between front/back-end processes and accelerates adoption of advanced packaging technologies for AI/HPC applications.

➀ The 2026 IEEE/JSAP Symposium in Honolulu calls for papers on VLSI innovations to advance AI, covering CMOS platforms, advanced packaging, AI accelerators, and memory technologies;

➁ Key deadlines include paper submissions by January 2026 and Late News submissions by March 2026, with technical sessions, workshops, and student awards featured;

➂ Outstanding papers may be published in IEEE journals, emphasizing the event’s role in bridging VLSI technology and AI applications.

➀ Imec's CMOS 2.0 leverages wafer-to-wafer hybrid bonding (250nm pitch) and backside power delivery networks (BSPDNs) to enable heterogeneous stacking of logic/memory tiers;

➁ Backside connectivity with 120nm-pitch TDVs and extreme wafer thinning optimizes power distribution, reducing IR drops by 122mV in 2nm mobile SoCs;

➂ System-technology co-optimization (STCO) allows specialized functional layers, offering 22% area savings while boosting performance density beyond traditional Moore’s Law scaling.

➀ LightMatter unveiled its Passage M1000 3D photonic superchip targeting AI applications, emphasizing advancements in photonic computing;

➁ The chip incorporates a 16-wavelength dense wavelength division multiplexing (DWDM) optical link to achieve higher bandwidth density for hyperscalers;

➂ The company highlights its ability to leverage standard single-mode fiber for improved performance in AI infrastructure.

➀ The Hydro4U project, funded by the EU, develops climate-resilient small hydropower solutions in Central Asia, emphasizing affordability, ease of deployment, and adherence to ecological standards;

➁ Two demonstration plants—Francis Container Power Solution (FCPS) in Uzbekistan and Hydroshaft Power Solution (HSPS) in Kyrgyzstan—are implemented using modular and ecocompatible technologies;

➂ Advanced planning tools (GIS, BIM), community engagement, and partnerships aim to enhance energy security and economic opportunities while aligning with sustainability goals.

➀ Fraunhofer ILT showcases innovations in additive manufacturing at Formnext 2025, including high-strength tungsten components for fusion reactors and the SCaRB process for simultaneous coating and surface optimization;

➁ Development of multi-material coatings using EHLA and PEEK polymers offers PFAS-free alternatives, enhancing corrosion and wear resistance;

➂ Integrated printed sensors in metal components enable real-time monitoring, improving maintenance and operational reliability in industries like aerospace and energy

➀ Teradyne荣获2025年台积电开放创新平台（OIP）3DFabric测试领域年度合作伙伴，表彰其在多芯片测试方法和CoWoS先进封装技术上的突破；

➁ 双方合作聚焦于UCIe互连和流式扫描测试技术，显著提升3D IC在AI和云计算场景下的测试效率与良率；

➂ 通过TSMC OIP生态系统强化的协同创新模式，加速了异构集成技术在A16/N2工艺节点的商业化进程。

➀ Traditional 2D chips face performance and power limitations in AI/data center applications due to communication bottlenecks and Moore's Law constraints;

➁ Alphawave Semi's 3D UCIe IP on TSMC's SoIC-X (3DFabric platform) achieves 10x better power efficiency and 5x higher density than 2.5D solutions;

➂ The vertical stacking architecture enables disaggregated chiplet designs, overcoming memory bandwidth limitations for next-gen AI/HPC systems.

➀ Synopsys and TSMC enhance collaboration to develop AI-driven multi-die systems using advanced EDA tools and TSMC's N2P/A16制程 and 3D stacking technologies;

➁ Synopsys' 3DIC Compiler platform enables automated 3D IC design for TSMC's SoIC-X and CoWoS封装技术, achieving multiple customer tape-outs;

➂ Integrated IP solutions (HBM4、UCIe) and photonic engines optimize performance for AI data centers and automotive applications, breaking Moore's Law limitations.

➀ Synopsys certifies Ansys tools for TSMC's N3C/N3P/N2P/A16 processes, enabling precise design validation for AI and HPC applications;

➁ The collaboration introduces AI-driven photonic design flow for TSMC's COUPE™ platform, reducing design cycles by 50%;

➂ Joint development of multiphysics analysis tools enhances thermal and signal integrity in 3DIC systems for 5G/6G infrastructure.

➀ TSMC addresses AI's growing power demands by advancing logic scaling (N2, A16 nodes) and 3D packaging (3D Fabric, SoIC) to achieve 4.2x efficiency gains from N7 to A14.

➁ Innovations like backside power delivery (A16), Compute-In-Memory (4.5x efficiency gain), and AI-driven design tools (Synopsys DSO.AI) optimize power and performance.

➂ 3D packaging technologies (CoWoS, HBM4) and ecosystem collaborations enable 6.7x energy efficiency improvements, positioning TSMC to support sustainable AI growth.

➀ Researchers at TU Wien, JKU Linz, and Bergakademie Freiberg developed a groundbreaking Silicon-Germanium (SiGe) transistor using modulation-acceptor doping (MAD), which replaces traditional semiconductor doping with a doped oxide layer, eliminating material impurities;

➁ The technology enables 4000x higher conductivity, improved low-temperature performance (critical for quantum chips), reduced energy consumption, and mitigates variability issues in nanoscale transistors;

➂ This advancement addresses challenges in quantum computing integration, where traditional doping fails under extreme cold, and paves the way for faster, energy-efficient nanoelectronics and quantum systems.

➀ Researchers achieved 98% accuracy in quantum gate operations using 3D-printed ion traps, enabling stable qubit performance with reduced fabrication time;

➁ The traps, produced via two-photon polymerization, shorten production time to hours and allow rapid testing of new hybrid planar-3D designs;

➂ The breakthrough supports applications in quantum computing, atomic clocks, and sensors, with findings published in Nature.

➀ The QSolid project, led by Forschungszentrum Jülich and Fraunhofer IZM-ASSID, aims to develop a German quantum computer with superconducting quantum chips and reduced error rates, utilizing an interposer to optimize qubit-electronics connections;

➁ A mid-term prototype with 10 qubits and integrated software was launched in 2025, with plans to scale performance by 2026 through advanced processor designs;

➂ The interposer supports over 10,000 high-density connections, thermal decoupling of components, and ongoing scalability tests, backed by €76.3 million in government funding to strengthen Germany’s quantum research sovereignty.

➀ The Fraunhofer IZM-ASSID, part of the QSolid project with 24 German institutions, is developing a quantum computer using superconducting qubits to reduce error rates, employing an interposer to optimize connections between qubits and control electronics;

➁ The 20x15mm interposer enables over 10,000 ultra-thin wirings and thermally decouples the quantum chip, with ongoing tests to scale its size for higher wiring densities;

➂ Funded by €76.3 million from the German government, QSolid aims to strengthen Germany’s quantum computing competitiveness, targeting industrial applications in chemistry, materials science, and healthcare by 2026.

➀ Anthony Paul Bellezza developed two solderless interconnect processes for advanced ICs, addressing challenges with traditional soldering;

➁ The fusion-based method uses low-temperature bonding (200-400°C) and martensitic substrates to create durable, ultra-low-resistance interconnects with environmental benefits;

➂ A secondary 2D graphene deposition process offers CMOS compatibility but is less durable, making it suitable for consumer electronics requiring frequent upgrades.

➀ Siemens' Tessent MemoryBIST now supports NVRAM testing with configurable controllers and hierarchical BIST architecture;

➁ The solution addresses emerging challenges in 3D IC designs and advanced process nodes through automated trimming/calibration workflows;

➂ Enables field-repairable memory systems with integrated ECC and multi-level test capabilities for AI-driven applications.

➀ Fraunhofer IZM and Akhetonics collaborate on the SPOC project to develop an all-optical quantum processor using advanced packaging technologies like thin-glass interposers and photonic wire bonding;

➁ Optical processors leverage photons for higher bandwidth, energy efficiency (up to 60x improvement), and scalability compared to traditional electronic systems;

➂ The SPOC project, funded by Investitionsbank Berlin, aims to deliver the first fully optical quantum processor by 2026 through iterative testing and hybrid material integration.