➀ MZ Technologies is addressing complex challenges in 2.5D and 3D IC design with advanced EDA software, GENIO; ➁ The company has announced a roadmap for GENIO with enhancements for 2025, focusing on thermal and mechanical stress issues; ➂ GENIO is designed to facilitate the design and optimization of complex IC systems.
Recent #3D IC news in the semiconductor industry
➀ Samsung has significantly reduced the amount of photoresist (PR) used in the photolithography process for its 3D NAND flash production. ➁ The company plans to use only half the amount of PR in future NAND production. ➂ The move is part of Samsung's effort to enhance its manufacturing efficiency and reduce costs.
➀ The Substrate Vision Summit in Santa Clara is expected to attract a large crowd, focusing on semiconductor substrates and their impact on 3D IC performance. ➁ AI's role in transforming the semiconductor value chain will be discussed, highlighting its impact on scaling, complexity, and high-performance chip demands. ➂ Keynote speakers and panel discussions will explore advancements in semiconductor materials, AI computing, and the role of universities in technology development.
➀ Alchip presents at TSMC OIP Ecosystem Forum; ➁ Challenges in 3D IC design overcome; ➂ Collaboration with Synopsys and TSMC for 3D design innovation
➀ The rise of 2.5D and 3D multi-die designs driven by high-performance computing and AI; ➁ Challenges in architecture and early prototyping, including thermal management and mechanical reliability; ➂ The importance of early verification to prevent costly delays and suboptimal performance; ➃ The role of AI in optimizing design processes and outcomes; ➄ The significance of sign-off tools for ensuring reliability and longevity of multi-die designs.
➀ Google is rumored to switch to TSMC's N3E process for Tensor G5; ➁ The report also clarifies that Google has chosen not to use 2nm technology for Tensor G6; ➂ The move could impact the competition in the AI and smartphone chip markets.
➀ Arm is exploring the feasibility of running LLMs on mobile devices; ➁ Arm's optimization techniques for LLMs on mobile; ➂ The importance of practical use cases for LLMs in mobile devices
➀ TSMC's 3DBlox framework addresses complexities in 3DIC design; ➁ Innovations in 2024 focus on simplifying 3D design challenges; ➂ TSMC's strategies for managing electrical and physical constraints in 3DIC systems.
➀ Kioxia showcased its BiCS 8 3D NAND technology at FMS 2024, featuring 218 layers and a new CMOS Bonded Array (CBA) process. ➁ The CBA process allows independent parallel processing of CMOS wafer and cell array wafer, improving reliability and performance. ➂ Despite fewer layers compared to competitors, Kioxia's lateral scaling enables competitive bit density and operating speeds.
➀ The panel discussed the challenges of power efficiency in AI and data centers, highlighting the need for 3D hybrid bonding for denser and more power-efficient interconnects. ➁ Intel Foundry emphasized a systems approach to integrating 3D IC products, aiming for CAD agnostic tool flows and System Technology Co-Optimization (STCO). ➂ Qualcomm focused on co-optimization and shift-left strategies, staying EDA vendor-agnostic to tackle multi-physics challenges.
1. Jusung Engineering is developing ALD technology to reduce the number of steps in the EUV process. 2. The chairman of Jusung Engineering, Chul Joo Hwang, believes that stacking transistors will be the future of semiconductor development. 3. This approach is seen as necessary due to the limitations in scaling DRAM and logic chips, similar to how NAND stacks transistors.
1. Siemens has introduced Innovator3D IC, a comprehensive solution for 3D IC design, focusing on early feasibility planning and analysis. 2. The solution includes a unified cockpit for design planning, prototyping, and predictive multi-physics analysis, leveraging digital twin technology. 3. Innovator3D IC supports industry standards and integrates AI for co-optimization, ensuring efficient and reliable 3D IC system designs.
➀ Researchers at Columbia University have successfully used DNA to create 3D electronic devices with nanoscale precision, which could significantly enhance computing power by transitioning from 2D to 3D architectures.
➁ This bottom-up approach, based on DNA origami, allows for self-assembly of DNA strands into precise nanostructures, offering a more efficient alternative to traditional top-down etching methods.
➂ The integration of electrodes and semiconductor materials like silicon oxide and tin oxide onto DNA-assembled structures demonstrates their potential application in future microchips, potentially revolutionizing semiconductor manufacturing.
➀ A student at the University of Applied Sciences in Hagen, Melanie Welp, has developed a contactless timing system for Paralympic swimming to prevent injury from head impacts.
➁ The prototype uses an ultrasonic sensor to measure the time at six meters and 50 centimeters before the edge of the pool.
➂ The system has been tested and shown to be possible without causing injury to swimmers.
➀ The P-562.6CD 6-axis Nanopositioning Stage from PI (Physik Instrumente) offers nanometer-level accuracy, repeatability, and high dynamic performance with millisecond responsiveness across six degrees of freedom.
➁ It uses PICMA® piezo actuators and play-free flexure-guided mechanics for frictionless motion and long-term stability.
➂ The stage is designed for photonics, semiconductor metrology, super-resolution microscopy, and nanomanufacturing.
➀ A trawler caught 7 1/2 times as much fish as with conventional driftnet methods using new electronic fish-finding equipment developed by Kelvin and Hughes (Marine) limited;
➁ The story dates back to 65 years ago, when CERES (Combined Echo Ranging Echo Sounding) equipment was introduced;
➂ CERES combined echo-ranging and echo-sounding to improve fishing efficiency.
➀ Ed向他的日记透露，执政不到一年的工党政府正在削减福利预算；
➁ 总理认为Ed是一个多面手，经常找他解决问题，Ed成了他的跑腿；
➂ 总理希望Ed帮助解决长期病假人员的问题，以减少福利预算开支，并避免政府形象受损。
➀ Nvidia's GTC 2025 unveiled a roadmap with powerful new AI GPUs and systems, including Rubin GPUs for 2026 and Rubin Ultra in 2027.
➁ Intel's restructuring began with new CEO Lip-Bu Tan and a reorganization of Intel Foundry operations.
➂ Storage solutions for AI use cases were showcased, including Kioxia's 122.88TB SSD and Seagate's NVMe HDDs.
➀ The KYY X90D offers a sleek aluminum design and dual 15.6-inch displays at an affordable price.
➁ It supports multiple operating modes and has a robust kickstand for adjustable viewing angles.
➂ However, it lacks HDMI connectivity and has a below-average brightness.
➀ The article discusses how 3D NAND flash memory is becoming essential for meeting the increasing data storage needs driven by AI. It highlights the shift from 2D to 3D NAND structures, which allow higher storage density through vertical stacking.
➁ Key players like Samsung, Western Digital, and SK Hynix are mentioned as leaders in 3D NAND technology. The article also explores innovations in cryogenic etching technology, which enhances etching capabilities and addresses scaling challenges.
➂ The global NAND flash memory market is expected to grow significantly, reaching $83 billion by 2036. Lam Research is noted as a market leader in 3D NAND dielectric etching, with advancements like the Lam Cryo™ 3.0 enabling more efficient and precise etching processes.