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January 16
- CAST to Enter the Post-Quantum Cryptography Era with New KiviPQC-KEM IP Core➀ CAST is releasing a new IP core, KiviPQC™-KEM, implementing the ML-KEM as per NIST FIPS; ➁ The company invites early adopters for product evaluations; ➂ The announcement highlights the importance of post-quantum cryptography in semiconductor IP core development.
 - SkyWater Announces ThermaView Solutions to Strengthen Domestic Support for High Performance Thermal Imaging➀ SkyWater Technology announces the launch of ThermaView℠ Solutions; ➁ The solutions are designed to meet the needs of thermal imaging system designers; ➂ They aim to support the development and production of advanced, large-format focal plane arrays.
 
January 15
- YorChip and ChipCraft announce low-cost, high-speed 200Ms/s ADC Chiplet➀ YorChip and Chipcraft have developed a low-cost, low-power 8-bit 200Ms/s ADC Chiplet; ➁ This is the first ultra-low power device in the open market as a Chiplet; ➂ Designers can integrate this Chiplet into a custom SOC without spending millions of dollars.
 
January 13
- NASA Awards Alphacore Four Contracts for Radiation Hardened Microelectronics Innovation➀ NASA has awarded four contracts to Alphacore in 2024; ➁ The contracts aim to advance the development of cutting-edge microelectronics systems; ➂ Alphacore specializes in analog, mixed-signal, and RF integrated circuit design intellectual property.
 - Introduction to The OpenRoad Project➀ OpenROAD is an Open Road Automated Design project; ➁ Its mission is to streamline the traditional RTL-to-GDSII flow; ➂ It aims to improve accessibility, collaboration, and utilizes machine learning; ➃ Offers a comprehensive suite of tools and methodologies for hardware design.
 
January 12
- IP Verification: Ultimate Guide➀ The importance of IP verification in semiconductor design; ➁ Challenges of verifying complex IP cores; ➂ Best practices for effective IP verification
 
January 11
- OSAT Location➀ OSAT,即外包半导体封装和测试,在半导体行业中扮演着至关重要的角色;➁ 这些公司专注于为集成器件制造商(IDMs)和无晶圆厂公司(fabless companies)设计的半导体设备进行组装和测试;➂ OSAT提供的服务包括将原始硅封装成可用的芯片,并进行严格的测试以确保其功能性和可靠性。
 
January 10
- What is a Wafer Fab➀ Wafer fabrication, or wafer fab, is the process of transforming raw materials into intricate microchips; ➁ It involves sophisticated techniques and technologies for precision and efficiency; ➂ It is crucial for various applications such as smartphones and electric vehicles.
 
January 9
- Qualitas Semiconductor and Verisilicon signed a licensing agreement for 4nm PCIe 6.0 PHY IP➀ Qualitas Semiconductor and Verisilicon have signed a licensing agreement for a 4nm PCIe 6.0 PHY IP; ➁ The agreement is part of an 'Early Access Program'; ➂ Qualitas is a leading provider of high-speed interconnect solutions.
 
January 8
- Radiation Hardening ASICs➀ In an increasingly tech-dependent world, radiation poses a significant threat to sensitive electronics in aerospace missions and military operations; ➁ Radiation-hardened ASICs offer innovative solutions to protect vital components from radiation; ➂ This focus on radiation-hardened ASICs is crucial for deep-space explorations and other high-stakes applications.
 - ASIC vs Sensor vs FPGA➀ Introduction to ASICs, sensors, and FPGAs; ➁ Comparison of their features, applications, and performance; ➂ Discussion on the advantages and disadvantages of each technology; ➃ Conclusion on the importance of choosing the right hardware component for specific applications
 - Global Semiconductor Sales Increase 20.7% Year-to-Year in November➀ The Semiconductor Industry Association (SIA) reported global semiconductor sales reached $57.8 billion in November 2024; ➁ This represents a 20.7% increase year-over-year compared to November 2023; ➂ Sales were also 1.6% higher than the October 2024 total of $56.9 billion.
 - Eighteen New Semiconductor Fabs to Start Construction in 2025, SEMI Reports➀ The semiconductor industry is expected to initiate 18 new fab construction projects in 2025; ➁ The projects include three 200mm and fifteen 300mm facilities; ➂ The majority of the new fabs are expected to begin operations from 2026 to 2027.
 - VLSI Learning Courses➀ Introduction to VLSI; ➁ Basic principles of integrated circuit design; ➂ Advanced topics in VLSI technology
 - How to Select SERDES IP➀ Understand the requirements for high-speed data transfer in the system; ➁ Evaluate the system's parallel data to serial data conversion needs; ➂ Consider the number of channels required for the SerDes IP; ➃ Assess the need for advanced signaling techniques like PAM4; ➄ Evaluate the compatibility of the SerDes IP with the system architecture; ➅ Review the vendor's reputation and support for the SerDes IP.
 - Ansys and Synopsys Announce Agreement with Keysight Technologies for Sale of Ansys PowerArtist➀ Ansys and Synopsys announce the sale of Ansys PowerArtist business to Keysight Technologies; ➁ The transaction involves the sale of semiconductor design and simulation software; ➂ The deal is subject to regulatory approvals.
 
January 7
- TSMC’s Rising Costs Squeeze Apple’s A-Series Chip Profits➀ TSMC's chip manufacturing costs have surged; ➁ The transition from the A7's 28nm to A18 Pro's 3nm node has led to a significant increase in wafer prices; ➂ Third-party suppliers have confirmed the dramatic rise in costs.
 - Silicon Photonics: Ultimate Guide➀ In a world driven by rapid advancements in technology, the quest for speed and efficiency has never been more vital. Silicon photonics emerges as a beacon of innovation, blending the realms of light and electronics to revolutionize data processing and communication. ➁ At its core, silicon photonics harnesses optical phenomena to transmit data at unprecedented speeds.
 
January 6
- How to Ship a Wafer➀ The process of shipping wafers requires specialized knowledge and handling techniques; ➁ Proper packaging solutions, logistics, and environmental controls are crucial; ➂ Innovations like eLX™ and ePRO™ are redefining shipping standards.
 
January 5
- Cadence Virtuoso: Ultimate Guide➀ Introduction to Cadence Virtuoso; ➁ Key features and capabilities; ➂ Importance for engineers and designers
 - Integrated Circuit Design: A Guide➀ ICs are the core of modern electronics; ➁ They enable complex operations to become efficient; ➂ Understanding IC design is vital for technology enthusiasts.
 
January 3
- Standard Cell Library: Ultimate Guide➀ Standard cell libraries are essential for IC design; ➁ They provide pre-designed cell layouts for various functions; ➂ Technology advancements have led to different types of libraries for specific performance metrics and applications.
 - Process Design Kit: Ultimate Guide➀ A Process Design Kit simplifies the complexities of chip design; ➁ Provides essential resources for IC engineers; ➂ Streamlines the development process and ensures high yield rates; ➃ Relies heavily on PDKs in the semiconductor industry to bridge the gap
 
December 18
- Building a Fabless Semiconductor Business: A Practical Guide➀ The term 'fabless semiconductor companies' signifies innovation and adaptability in the semiconductor technology landscape; ➁ These companies focus on design, innovation, and market agility, outsourcing manufacturing; ➂ Giants like Qualcomm and Nvidia have achieved significant strides in this field.
 
December 17
- Chiplet Summit 2025➀ Position your company as a leader in emerging technology; ➁ Lay claim to your share of a projected $5.8 billion market; ➂ Share thoughts with key experts and analysts; ➃ Show movers and shakers how your company is innovating
 - UMC Secures Major Advanced Packaging Order from Qualcomm, Challenging TSMC’s Dominance➀ UMC announced a significant breakthrough in the advanced packaging market; ➁ The contract is for high-performance computing (HPC) applications; ➂ The win challenges TSMC's long-standing dominance in the sector.
 - Cadence Appoints Moshe Gavrielov to Board of Directors➀ Cadence Design Systems announced the appointment of Moshe Gavrielov to its board of directors; ➁ The appointment will be effective from January 1, 2025; ➂ Gavrielov is currently a board member at NXP Semiconductors and Taiwan Semiconductor Manufacturing Company Ltd.
 
December 13
- Apple’s First AI Server Chip to be Engineered in Israel➀ Apple is developing its first custom server chip for AI processing; ➁ Codenamed 'Baltra', the chip is designed specifically for AI; ➂ The development marks a significant step in Apple's AI strategy.
 - Biden-Harris Administration Announce Preliminary Terms with Coherent, SkyWater, and X-Fab to Advance U.S. Supply Chain Security➀ The Biden-Harris Administration announced the signing of PMTs with Coherent, SkyWater, and X-Fab; ➁ The PMTs are part of the CHIPS and Science Act; ➂ Up to $33 million in proposed funding for Coherent, up to $16 million for SkyWater.
 
December 11
- MosChip selects Cadence tools for the design of HPC Processor “AUM” for C-DAC➀ MosChip selects Cadence's 5nm EDA tools for designing the HPC processor 'AUM' for C-DAC; ➁ MosChip is the first publicly traded fabless semiconductor company in India with over 25 years of experience in designing products and SoCs; ➂ The collaboration aims to leverage Cadence's advanced tools for the development of high-performance computing solutions.