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February 26
- sureCore PowerMiser IP enables KU Leuven chip for AI applications to achieve dynamic power saving of greater than 40%
➀ SureCore, a specialist in ultra-low power memory, has enabled KU Leuven to develop a neural processing accelerator chip for AI applications.
➁ The chip achieves dynamic power savings of over 40% compared to industry standard SRAM solutions.
➂ The technology has been demonstrated on more mature nodes, such as the 16nm process.
- Andes Technology and proteanTecs Partner to Bring Performance and Reliability Monitoring to RISC-V Cores
➀ Andes Technology and proteanTecs have formed a strategic partnership;
➁ The collaboration allows joint customers to integrate proteanTecs' on-chip monitoring IP into Andes' RISC-V cores;
➂ The partnership aims to enhance performance and reliability monitoring for RISC-V cores.
February 21
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
➀ Breker Verification Systems宣布其RISC-V SystemVIP库组件和测试套件合成产品组合已部署在超过15个商业RISC-V半导体设计项目中；
➁ 其RISC-V产品也被用于多个大型学术项目；
➂ 这些项目涉及大型、复杂的应用处理器。
- Faraday Reports Full Year 2024 Results
➀ Faraday Technology reported full year 2024 results;
➁ Revenue reached NT$2,953 million (US$91.5 million);
➂ Gross margin was 42.8%;
➃ Net income attributed to stockholders of the parent was NT$236 million (US$7.3 million);
➄ Earnings per share of NT$0.91.
- SignOff Semiconductors Unveils Expansion Plans with Its New Office in Penang, Malaysia
➀ SignOff Semiconductors, a leading provider of VLSI and Embedded Design services, has opened a new office in Penang, Malaysia.
➁ The expansion is in response to the increasing demand for semiconductor chip design services from Fortune 500 companies in Penang.
➂ The move aligns with the Malaysian government's vision to establish the country as a semiconductor hub.
February 20
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
➀ YorChip, in collaboration with SiliconIPs, has developed a 50nS latency 100G Ultra Ethernet ready Mac/PCS IP core;
➁ The IP core is optimized for size, power, and latency;
➂ It targets edge AI applications and Data Center Accelerator developers requiring low power and high performance.
- Arteris Revolutionizes Semiconductor Design with FlexGen – Smart Network-on-Chip IP
➀ Arteris, Inc. introduces FlexGen, a revolutionary NoC interconnect IP;
➁ FlexGen accelerates chip development and optimizes performance efficiency;
➂ The solution addresses the growing demand for faster and more sustainable innovation in the automotive, datacenter, and consumer electronics sectors.
February 18
- ASE Expands its Chip Packaging and Testing Facility to Enable Next-Gen Applications
➀ ASE has officially launched its fifth plant in Penang, Malaysia;
➁ The new facility will enhance the company's packaging and testing capabilities;
➂ The expansion is part of a strategic plan to increase the floor space of ASE's Malaysia facility.
February 16
- Top Semiconductor Foundries 2024 Revenue
➀ A summary table of the full-year 2024 performance is provided, including revenue, year-over-year growth, and relevant notes for each company.
➁ TSMC, the world's leading foundry, has reported exceptional growth, though specific Q4 figures are not detailed.
February 12
- OpenAI to Finalize First 3nm AI Chip Design, Aiming for Independence from NVIDIA
➀ OpenAI, the creator of ChatGPT, is about to finalize its first in-house AI chip design;
➁ The company plans to send the chips to TSMC for fabrication with an aim for mass production in 2026;
➂ This move is a significant step towards reducing reliance on NVIDIA.
- Thalia Announces Latest Version of AMALIA with Game-Changing ‘Device-Stretching’ Algorithm and Flip Well Intelligence
➀ Thalia Design Automation has announced the latest version of the AMALIA Suite;
➁ The new version includes a 'Device-Stretching' algorithm and Flip Well Intelligence;
➂ Enhancements are particularly within the Layout Automation Suite.
- Silicon Creations Expands Clocking IP Portfolio on TSMC N2P Technology including Novel Temperature Sensor Design
➀ Silicon Creations successfully tape-outs a chip on the TSMC N2P process;
➁ The chip includes a novel temperature sensor design;
➂ The expanded portfolio of clocking IP supports next-generation semiconductor products.
February 10
- Texas Instruments (TI) 2024 Financial Report: A Year of Solid Performance Despite Market Slowdown
➀ Texas Instruments (TI) released its 2024 financial report, showing stable performance in a challenging economic environment;
➁ Revenue experienced a slight decline, but the company demonstrated strong cash generation and significant returns to shareholders;
➂ The report highlights the resilience of TI's business model and the effectiveness of its long-term strategy.
- X-FAB 2024 Financial Report: Navigating a Challenging Year
➀ X-FAB's 2024 financial report reflects a challenging year with significant market headwinds, mainly due to industry-wide destocking, especially in the automotive sector.
➁ Despite the challenges, the company demonstrated resilience, maintaining profitability and preparing for future growth.
➂ Key highlights include a full-year revenue of USD 816.4 million.
- Global Semiconductor Sales Increase 19.1% in 2024; Double-Digit Growth Projected in 2025
➀ The Semiconductor Industry Association (SIA) reported that global semiconductor sales reached $627.6 billion in 2024, a 19.1% increase over 2023's total of $526.8 billion.
➁ Fourth-quarter sales were $170.9 billion, marking a 17.1% increase from the same period in 2023 and a 3.0% rise from the third quarter of 2024.
➂ Double-digit growth is projected for 2025.
February 7
- 1nm Revolution: TSMC’s Next-Gen Chip Plant to Transform Southern Taiwan
➀ TSMC, Taiwan's leading semiconductor manufacturer, is reportedly planning a new 1-nanometer fabrication plant in Tainan's Shalun area;
➁ The massive facility, a Giga-Fab, is capable of housing six 12-inch wafer fabs;
➂ It aims to leverage the existing advanced manufacturing cluster in the Southern Taiwan Science Park (STSP) and connects strategically to the science park.
- GlobalFoundries Announces Leadership Transition
➀ GlobalFoundries, a leading semiconductor manufacturer, has announced a major leadership transition;
➁ Tim Breen, the current Chief Operating Officer (COO), will take over as President and CEO effective April 28th, 2025;
➂ Thomas Caulfield, who has been serving as CEO since 2018, will transition to a new role.
February 3
- The Global Expansion of Advanced Semiconductor Packaging Facilities: A 2025 Outlook
➀ The semiconductor industry is witnessing a surge in investment and expansion of advanced packaging facilities;
➁ This surge is driven by the growing demand for high-performance computing and other applications;
➂ Key players are significantly expanding their capacity with the aim of substantial production increases by 2025.
- Teradyne and Infineon Announce Strategic Partnership to Advance Power Testing
➀ Teradyne and Infineon Technologies have announced a strategic partnership;
➁ The partnership aims to advance power semiconductor testing;
➂ The collaboration is part of a strengthened relationship between the companies.
January 29
- Memorandum of Understanding to Develop AI Acceleration Technologies
➀ Codasip GmbH and RED Semiconductor International Ltd have signed a Memorandum of Understanding (MoU) to collaborate on developing advanced AI acceleration technologies.
➁ Under the MoU, RED will use Codasip Studio processor design tools to integrate its VISC technology with Codasip RISC-V cores.
➂ The collaboration aims to enhance AI processing capabilities through specialized accelerators.
January 28
- Chipmakers Rush to Build New Fabrication Plants in 2025
➀ The semiconductor industry is expected to see significant expansion in 2025 with plans to start construction on 18 new fabrication plants (fabs).
➁ According to SEMI's World Fab Forecast, the industry is projected to grow to $697 billion in 2025, marking an 11.2% increase from 2024.
➂ Some of these fabs are scheduled for production in 2026 or later.
- Plexus and intoPIX Expand IPMX Solutions Offering
➀ PlexusAV and intoPIX have successfully tested the interoperability between Plexus P-AVN-4 IPMX JPEG XS FIP transceiver and intoPIX's new Titanium Software Suite.
➁ This collaboration demonstrates the increasing synergy between the two companies in providing advanced image compression technologies.
➂ The announcement was made on January 28, 2025, in Mont-Saint-Guibert, Belgium.
January 22
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X
➀ Blue Cheetah Analog Design has successfully taped out its next generation BlueLynx™ die-to-die (D2D) PHY on Samsung Foundry's SF4X 4nm advanced manufacturing process.
➁ The latest PHY supports both advanced and standard chiplet packaging with an aggregate throughput exceeding 100 Tbps.
➂ It achieves industry-leading silicon area footprint.
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
➀ Cadence announces its plan to acquire Secure-IC, a leader in embedded security IP platforms.
➁ The acquisition aims to enhance Cadence's existing portfolio with Secure-IC's advanced security solutions and tools.
➂ Financial details of the deal were not disclosed.
January 21
- Understanding Multi Chip Module (MCM)
➀ Multi Chip Modules (MCM) are emerging as a game-changing solution for faster and more powerful electronics.
➁ Traditional chip designs can no longer meet the growing need for performance and space-saving designs.
➂ MCMs integrate multiple chips into a single package, offering a sophisticated approach to semiconductor architecture.
- Understanding Heterogeneous Integration (HI)
➀ Heterogeneous integration is a solution that allows different materials and components to work together seamlessly, enhancing system performance.
➁ This approach enables the development of sophisticated electronic devices that are smaller, faster, and more efficient.
➂ Understanding heterogeneous integration involves grasping its key concepts and technologies.
January 20
- Micross Acquires Integra Technologies, Creating the Leading U.S. Domiciled OSAT Provider
➀ Micross Components, Inc. has completed the acquisition of Integra Technologies.
➁ This acquisition makes Micross the leading U.S.-based Outsourced Semiconductor Assembly and Test (OSAT) provider.
➂ The acquisition strengthens Micross's capabilities in providing high-reliability microelectronic products and services for various applications including aerospace, defense, space, medical, and industrial sectors.
- onsemi Acquires Silicon Carbide JFET Technology to Enhance Its Power Portfolio for AI Data Centers
➀ onsemi announces the acquisition of Qorvo's Silicon Carbide JFET technology business for $115 million.
➁ This acquisition will enhance onsemi's EliteSiC power portfolio.
➂ The acquisition aims to strengthen onsemi's offerings for AI data centers.
- Introduction to Chip Scale Packaging
➀ Chip Scale Packaging (CSP) is an advanced packaging technology that allows for smaller, more efficient electronic components.
➁ CSP is transforming device design and manufacturing processes across various industries.
➂ The technology optimizes space usage and enhances performance in microelectronics.
January 16
- Semiconductor Trends Shaping 2025➀ The semiconductor industry is at the forefront of innovation and change; ➁ Semiconductors are critical building blocks for various sectors; ➂ Understanding industry trends is essential for technology's future.