➀ ASE has officially launched its fifth plant in Penang, Malaysia;
➁ The new facility will enhance the company's packaging and testing capabilities;
➂ The expansion is part of a strategic plan to increase the floor space of ASE's Malaysia facility.
Recent #chip packaging news in the semiconductor industry
1. TSMC is reportedly exploring the use of 510x515 mm rectangular silicon wafers. 2. This move could triple the usable area compared to the current 300mm diameter technology. 3. The research is focused on advanced chip packaging.