➀ The article introduces a book titled *How AI Thinks* by Nigel Toon, an expert with extensive experience in the electronics and AI industries;
➁ It positions the book as a valuable resource for technology enthusiasts and engineers exploring AI's development and applications;
➂ The author humorously notes reading a physical copy instead of adding it to a “virtual shelf” as usual.
➀ Nuvoton launched the Arbel NPCM8mnx SiP, a compact BMC subsystem integrating CPU, memory, storage, and power management into a 23x23mm chip, reducing development complexity for AI servers and datacenters;
➁ The SiP achieves a 70% size reduction, supports up to 4GB DDR4 and 64GB eMMC, and features post-quantum cryptography for security compliance;
➂ Designed for hyperscale deployments, it accelerates hardware development cycles and supports open standards like OpenBMC, with engineering samples currently available.
➀ Texas Instruments' TIDA-00431 integrates a 4 GSPS ADC and an 8 GHz DC-coupled differential amplifier, enabling direct RF signal capture up to 2 GHz bandwidth;
➁ Designed for radar, communication, and test systems, it eliminates traditional frequency translation stages to reduce latency and enhance signal fidelity;
➂ Includes full schematics, layout files, and TI component support (LMH5401 amplifier, ADC12J4000 converter) for streamlined high-performance receiver development.
➀ A new analog computing method integrates computation directly into resistive memory chips, eliminating data transfer bottlenecks between memory and processors;
➁ The system uses low-precision initial calculations followed by high-precision corrections, achieving 32-bit digital processor accuracy with 100x improved energy efficiency;
➂ Demonstrated 16×16 matrix processing in wireless communication tests, showing potential for 1,000x faster AI hardware at 100x lower energy consumption.
➀ Researchers at FH Dortmund aim to reduce energy losses in high-performance battery storage systems by increasing voltage levels tenfold to twentyfold, minimizing resistance-induced heat waste;
➁ A real-world lab in Ense will test 10,000–20,000V battery systems, analyze lifespan impacts, and develop insulation standards for medium-voltage DC applications;
➂ The modular high-voltage design eliminates active cooling, reduces maintenance, and enables scalable configurations, potentially revolutionizing energy storage efficiency and infrastructure.