➀ Silex Technology has launched the AMC Edge System-on-Module (SoM), EP-200Q, which is powered by the Qualcomm Dragonwing™ QCS6490 processor and offers high-performance edge AI capabilities in a very small form factor.

➁ The EP-200Q integrates Wi-Fi 7 drivers and is optimized for industrial and healthcare IoT devices requiring power efficiency and rapid deployment.

➂ It features an octa-core CPU, Hexagon DSP, and a 12-TOPS AI engine, along with long-term availability through the Qualcomm Product Longevity Program.

➀ MediaTek has unveiled two new IoT platforms, the Genio 720 and Genio 520, aimed at bringing advanced generative AI capabilities to edge devices.

➁ These platforms are designed for smart home, retail, industrial, and commercial applications, featuring high performance, advanced multimedia, and energy efficiency.

➂ Built on a 6nm process, they include an octa-core CPU with AI acceleration and support for up to 16GB LPDDR5 memory, enabling real-time AI tasks like natural language processing and computer vision.

At NVIDIA GTC 2025, we got to tour Pegatron's booth, where we saw the Pegatron NVIDIA GB300 NVL72 rack and other GPU systems. The GB300 NVL72 racks are liquid cooled with a busbar for power in the rear. The sleds have four Blackwell modules along with two NVIDIA Grace CPUs and are liquid cooled.

The article also mentions that Pegatron is integrating Delta power supply shelves into their racks and that the NVIDIA GB300 NVL72 is neat, with several other GPU systems on display.

➀ Photonic computing chips, which combine light and electricity, have been proven to enhance computing performance while reducing energy consumption compared to traditional electronic chips.

➁ Two recent studies demonstrated the capabilities of integrated photonic and electronic chips in performing key AI operations like multiplication and accumulation more efficiently.

➂ A large-scale photonic accelerator and another processor showed promising results in solving complex computational tasks and executing AI models such as BERT and ResNet with high accuracy.

➀ MIT engineers have developed an insect-sized hopping robot capable of crossing challenging terrains and carrying heavy loads.

➁ The robot uses a springy leg and four flapping wings, consuming 60% less energy than flying robots while jumping up to four times its height.

➂ It can adapt to various surfaces, including ice, wet glass, and uneven soil, and can even land on a hovering drone, showcasing potential applications in search and rescue operations and beyond.

➀ Broadcom has introduced two new 200G/lane DSP PHY designs, Sian3 and Sian2M, to address the growing demand for AI and machine learning cluster connectivity.

➁ Sian3, built on 3nm technology, offers the lowest power consumption for SMF-based 800G and 1.6T modules, improving on its predecessor by reducing power usage by over 20%.

➂ Sian2M is optimized for short-reach MMF links in AI clusters, featuring an integrated VCSEL driver and leveraging Broadcom's 200G VCSEL technology for enhanced performance and efficiency.

➀ A new wave of mobile air pollution sensors, powered by Artificial Intelligence (AI), could greatly enhance the precision of air quality monitoring and empower individuals with clearer insights into pollution levels in their communities.

➁ Researchers from Kingston University collaborated with Technocomm Consulting Ltd to develop an affordable device called EnviroSense, which uses AI to correct inaccuracies and reduce measurement errors by up to 46%.

➂ Trials are currently underway in Spain and Malaysia to evaluate the technology under diverse environmental conditions, signaling a promising global future for accessible, AI-enhanced air monitoring.

➀ Nuvoton Technology has launched the NuMicro MA35D1, a high-performance dual-core microprocessor based on the Arm Cortex-A35 architecture, featuring instant boot-up in under one second.

➁ The microprocessor supports concurrent operation of Linux and RTOS, offering a balance between flexibility and real-time responsiveness, ideal for smart building and industrial applications.

➂ It includes advanced features such as dual OS capability, real-time data handling, smooth UI, and smart connectivity options like web server integration, making it suitable for edge computing and AIoT applications.

➀ This article provides a comprehensive guide on building the world's smallest AI-powered spy camera.

➁ Readers will learn about Digital Visual Interface (DVI), interfacing a camera with a microcontroller, and designing a multi-stream live-streaming camera.

➂ The article also highlights the integration of AI algorithms for image processing and object detection to enhance the camera's capabilities.

➀ Researchers are developing soft, flexible robots that combine soft materials with magnetically controlled movement and integrated electronics, allowing them to move through tight spaces like earthquake debris or the human body.

➁ These robots contain tiny magnetic components within their soft bodies, enabling them to respond to external magnetic fields, bend, twist, or crawl without requiring batteries or wires.

➂ The next steps include improving the robots for specific applications such as creating a 'robot pill' to navigate the digestive system, detecting diseases, and delivering medicine precisely, offering a less invasive alternative to surgery.

➀ Hamamatsu Photonics Europe has launched NZConnectMD Scan, an image acquisition platform for digital pathology workflows.

➁ The software allows for centralized control of multiple NanoZoomer MD Series scanners.

➂ Key features include barcode-based slide tracking, workflow balancing, and space optimization.

➀ IBM unveiled its new z17 mainframe, powered by the Telum II processor, which integrates advanced AI capabilities with built-in accelerators and PCIe-based Spyre cards.

➁ The Telum II processor features larger caches and a new on-die AI accelerator, while the Spyre cards offer high-performance AI acceleration.

➂ The system is designed for high-reliability transaction processing, with liquid cooling and DPU technology to enhance performance and efficiency.

➀ A research team from Peking University and other institutions has developed a new method to integrate 2D semiconductors with dielectric materials, opening the door to smaller and faster electronics.

➁ The method involves growing an ultra-thin dielectric film on a copper surface covered with graphene, allowing the film to be transferred to different substrates with minimal defects.

➂ This advancement could lead to the scalable production of high-performance, low-power microelectronics and optoelectronics based on 2D materials, with future efforts focusing on precise alignment and stacking of 2D materials.

➀ At NVIDIA GTC 2025, ASUS showcased the AI Pod for the NVIDIA GB300 generation, featuring PCIe GPU systems and new HGX B200 and B300 systems.

➁ The rack contains 18 NVIDIA GB300 compute blades, each with four B300 modules and two Grace CPUs.

➂ The system also includes NVIDIA ConnectX-8 NIC, BlueField-3 DPU, and liquid-cooled SSD array, with NVLink Switch sleds and complex cable cartridges.

➀ Magnachip Semiconductor Corporation has launched 25 new 6th-generation Super Junction (SJ) MOSFETs, which are designed for various applications such as AI TVs, smart appliances, industrial equipment, and electric vehicle (EV) chargers.

➁ These new MOSFETs offer improved switching speeds (up to 23% faster), reduced size (about 30% smaller), and enhanced reliability compared to the previous generation.

➂ The products support voltage ratings of 600V, 650V, and 700V, and are available in multiple package types including TO220, TO220FT, SOT223, and others.

➀ Researchers at the University of Wisconsin–Madison have developed a new computational model to understand lithium plating in fast-charging lithium-ion batteries.

➁ The model provides insights into the mechanisms of lithium plating on the anode during fast charging, which can lead to quicker battery degradation or even fire hazards.

➂ The findings could guide the design of safer and more durable batteries by optimizing charging protocols and materials based on operating conditions and material properties.

➀ In Q1'25, global venture funding reached $121 billion, driven by OpenAI's $40 billion raise, valuing the company at $300 billion;

➁ Despite a decline in deal count, AI startups remained the primary beneficiaries of this capital concentration, capturing more than half of the quarter's funding;

➂ The AI dealmaking landscape is evolving, with a shift from infrastructure investments to vertical solutions and application-layer platforms.

➀ The Asus ROG Strix X870E-E Gaming Wifi is a budget-friendly AM5 motherboard with a variety of features and a premium design.

➁ It offers ample USB Type-A and C ports, 3x PCIe 5.0 M.2 sockets, and AI features like AI Overclocking and AI Cooling II.

➂ The board delivers robust performance and connectivity at a sub-$500 price point, making it a competitive option for gamers and DIY builders.