➀ Intel's shift to a more transparent strategy in technology announcements; ➁ The competition between Intel's PowerVia and TSMC's Super Power Rail; ➂ Andy Grove's philosophy of maintaining a 'healthy amount of paranoia'.
Recent #AI chip news in the semiconductor industry
➀ The shift in MCU design from simple to complex, requiring more sophisticated interconnects like NoC; ➁ The factors driving this change, including power reduction, safety standards, and support for multiple protocols; ➂ The importance of scalability in design and how NoC architectures can support this.
➀ A class-action lawsuit alleges that UnitedHealthcare uses a faulty algorithm to deny patient coverage, filed by two now-deceased individuals. ➁ UnitedHealthcare CEO Brain Thompson was killed in Midtown Manhattan earlier this week, and the suspect is currently on the run. ➂ The lawsuit claims UnitedHealthcare pushed employees to use an algorithm with a 90% error rate to deny coverage.
➀ Elon Musk files an injunction against OpenAI and its CEO to prevent the company from becoming for-profit; ➁ Musk argues that OpenAI has deviated from its original non-profit mission; ➂ The case will be heard in January in California.
➀ The rise of RISC-V cores and the challenges of certification; ➁ The role of Breker Verification Systems in the certification process; ➂ The complexity of certifying RISC-V ISA implementations and the efforts of RISC-V International.
➀ Ollie Jones emphasizes customer focus at Sondrel, ensuring high-quality personal service in custom chip delivery; ➁ Sondrel expands into the American market after establishing a strong reputation in Europe and Israel; ➂ The company differentiates itself by providing tailored services for complex chip designs.
➀ OpenAI is collaborating with Broadcom and TSMC to develop its first in-house AI chip; ➁ The company is scaling back its foundry ambitions due to cost and time constraints; ➂ OpenAI is adopting a strategy of using industry partnerships and a mix of internal and external approaches to manage chip supply and costs.
➀ Google is rumored to switch to TSMC's N3E process for Tensor G5; ➁ The report also clarifies that Google has chosen not to use 2nm technology for Tensor G6; ➂ The move could impact the competition in the AI and smartphone chip markets.
➀ The increasing complexity of chip design necessitates efficient debugging solutions for successful prototype verification; ➁ Prototyping plays a crucial role in chip verification by enabling real-world scenario testing and early customer demonstrations; ➂ S2C's Prodigy prototyping solution offers a comprehensive debugging platform with tools like real-time control software, design debugging software, Multi-Debug Module, and ProtoBridge co-simulation software.
➀ Arm is exploring the feasibility of running LLMs on mobile devices; ➁ Arm's optimization techniques for LLMs on mobile; ➂ The importance of practical use cases for LLMs in mobile devices
➀ Electron Beam Probing (EBP) has become a powerful method for security analyzing of sub-7nm ICs. ➁ It offers better spatial resolution than optical probing and is suitable for sub-7nm flip-chips and advanced 3D architectures. ➂ The research focuses on the importance of EBP in failure analysis and hardware assurance.
➀ Huawei is shipping its Ascend 910C AI Accelerator to NVIDIA customers in China; ➁ The move comes as the US imposes trade restrictions on AI hardware, making it challenging for Chinese tech giants to source NVIDIA chips; ➂ Huawei aims to compete with NVIDIA in the AI chip market with its new chip.
➀ NVIDIA's dominance in AI GPU market extends to 2027 with Rubin Ultra AI GPU featuring 576GB of HBM4 memory; ➁ Competitors include AMD, Intel, Google, and others with their respective AI chip developments; ➂ TSMC's advanced CoWoS-L packaging technology and N3 process node support NVIDIA's next-gen AI GPUs.
➀ NVIDIA and MediaTek are rumored to be co-developing an Arm-based AI processor for the first half of 2025. ➁ The new chip will compete against AMD, Intel, and Qualcomm's AI processors. ➂ The processor is expected to be manufactured using TSMC's 3nm process node.
➀ NVIDIA faces scrutiny from global regulators over its dominance in the AI chip market. ➁ Authorities from the EU, Britain, and China have requested information on NVIDIA's AI chip sales and investments. ➂ NVIDIA is building new offices and hiring staff to respond to regulatory scrutiny.
1. TSMC is buying equipment for two CoWoS advanced packaging plants in Chiayi, Taiwan.
2. TSMC is also surveying land for a third CoWoS plant.
3. The new CoWoS plant in Nanke Chiayi Park is in the 'environmental review stage'.
4. TSMC's new advanced packaging plant will cover around 20 hectares.
5. The first CoWoS plant will be completed by 2026 and create 3000 jobs.
6. TSMC is preparing for future AI chips with its 3nm process and CoWoS-L packaging.
7. NVIDIA's future R100 AI GPU will use TSMC's 3nm process and CoWoS-L packaging with HBM4 memory.
1、韩国计划在美国圣何塞开设人工智能芯片创新中心,以促进国内系统芯片公司在美国的销售。2、该中心将为三到四家公司提供独立办公室,并提供一个大的开放空间供其他公司使用。3、该项目是韩国贸易、工业和能源部的一项计划,旨在推广系统半导体技术出口。
PreviousPage 3 of 3 pages