Recent #AI chip news in the semiconductor industry

10 months ago
➀ Intel's shift to a more transparent strategy in technology announcements; ➁ The competition between Intel's PowerVia and TSMC's Super Power Rail; ➂ Andy Grove's philosophy of maintaining a 'healthy amount of paranoia'.
2nm3D IC3nmAIAI PCAI chipAMDASUSArmCPUChipletDRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonLinuxNPUNVIDIAPCIePrivacyRaspberry PiSEMICONDUCTORSK hynixSSDSwitchTIautomotivecoolingcybersecuritygamingiOSlaptopmemorymicrochipmonitorsoftware
11 months ago
➀ A class-action lawsuit alleges that UnitedHealthcare uses a faulty algorithm to deny patient coverage, filed by two now-deceased individuals. ➁ UnitedHealthcare CEO Brain Thompson was killed in Midtown Manhattan earlier this week, and the suspect is currently on the run. ➂ The lawsuit claims UnitedHealthcare pushed employees to use an algorithm with a 90% error rate to deny coverage.
2nm3D IC3nmAIAI PCAI chipAMDASUSArmCPUChipletDRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonLinuxNPUNVIDIAPCIePrivacyRaspberry PiSEMICONDUCTORSK hynixSSDSwitchTIautomotivecoolingcybersecuritygamingiOSlaptopmemorymicrochipmonitorsoftware
11 months ago
➀ The rise of RISC-V cores and the challenges of certification; ➁ The role of Breker Verification Systems in the certification process; ➂ The complexity of certifying RISC-V ISA implementations and the efforts of RISC-V International.
2nm3D IC3nmAIAI PCAI chipAMDASUSArmCPUChipletDRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonLinuxNPUNVIDIAPCIePrivacyRaspberry PiSEMICONDUCTORSK hynixSSDSwitchTIautomotivecoolingcybersecuritygamingiOSlaptopmemorymicrochipmonitorsoftware
about 1 year ago
➀ OpenAI is collaborating with Broadcom and TSMC to develop its first in-house AI chip; ➁ The company is scaling back its foundry ambitions due to cost and time constraints; ➂ OpenAI is adopting a strategy of using industry partnerships and a mix of internal and external approaches to manage chip supply and costs.
AI chipBroadcomFoundryOpenAITSMCchip supplytechnology partnership
about 1 year ago
➀ Google is rumored to switch to TSMC's N3E process for Tensor G5; ➁ The report also clarifies that Google has chosen not to use 2nm technology for Tensor G6; ➂ The move could impact the competition in the AI and smartphone chip markets.
2nm3D IC3nmAIAI PCAI chipAMDASUSArmCPUChipletDRAMDellEDAGDDRGPUGaNHBMHPCInfineonLinuxNPUNVIDIAPCIePrivacyRaspberry PiSEMICONDUCTORSK hynixSSDSwitchTITSMCautomotivecoolingcybersecuritygamingiOSlaptopmemorymicrochipmonitorsoftware
about 1 year ago
➀ The increasing complexity of chip design necessitates efficient debugging solutions for successful prototype verification; ➁ Prototyping plays a crucial role in chip verification by enabling real-world scenario testing and early customer demonstrations; ➂ S2C's Prodigy prototyping solution offers a comprehensive debugging platform with tools like real-time control software, design debugging software, Multi-Debug Module, and ProtoBridge co-simulation software.
AI chipChipletDeepCoolEDAHPCNoctuacoolinggamingsoftware
about 1 year ago
➀ Arm is exploring the feasibility of running LLMs on mobile devices; ➁ Arm's optimization techniques for LLMs on mobile; ➂ The importance of practical use cases for LLMs in mobile devices
2nm3D IC3nmAIAI PCAI chipAMDASUSArmCPUChipletDRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonLinuxMobileNPUNVIDIAPCIePrivacyRaspberry PiSEMICONDUCTORSK hynixSSDSwitchTIautomotivecoolingcybersecuritygamingiOSlaptopmemorymicrochipmonitorsoftware
about 1 year ago
➀ Electron Beam Probing (EBP) has become a powerful method for security analyzing of sub-7nm ICs. ➁ It offers better spatial resolution than optical probing and is suitable for sub-7nm flip-chips and advanced 3D architectures. ➂ The research focuses on the importance of EBP in failure analysis and hardware assurance.
2nm3nmAI chipAMDASUSDellEDAEUVGDDRGaNHPCICInfineonLinuxPCIePrivacyRaspberry PiSEMICONDUCTORSecuritySwitchautomotivecoolingcybersecuritygamingiOSlaptopmemorymicrochipmonitorsoftwaretechnology
over 1 year ago
1. TSMC is buying equipment for two CoWoS advanced packaging plants in Chiayi, Taiwan. 2. TSMC is also surveying land for a third CoWoS plant. 3. The new CoWoS plant in Nanke Chiayi Park is in the 'environmental review stage'. 4. TSMC's new advanced packaging plant will cover around 20 hectares. 5. The first CoWoS plant will be completed by 2026 and create 3000 jobs. 6. TSMC is preparing for future AI chips with its 3nm process and CoWoS-L packaging. 7. NVIDIA's future R100 AI GPU will use TSMC's 3nm process and CoWoS-L packaging with HBM4 memory.
AI chipCoWoSadvanced packaging