➀ NVIDIA develops 800V HVDC architecture to support 1 MW server racks by 2027, addressing existing 54V DC system limitations;
➀ Current 54V DC systems struggle beyond 200kW, requiring impractical copper quantities for gigawatt data centers;
➂ New 800V HVDC integrates with 13.8kV AC sources, reduces copper use by 45%, and eliminates inefficient AC-DC conversions.
➀ Sruhad Technologies offers a 3–6 month Electronics Engineering Internship in Vadodara, focusing on circuit design, firmware development, and automation;
➁ Responsibilities include troubleshooting, PCB design, and collaboration with cross-functional teams;
➂ Candidates should pursue relevant degrees, have C/Python skills, and local residency in Vadodara.
➀ NVIDIA's suppliers, including Foxconn and Dell, resolved technical challenges such as liquid cooling leaks and overheating, enabling accelerated production of the GB200 AI server racks;
➁ Delays in GB200 shipments were due to software bugs and inter-chip connectivity issues, with suppliers collaborating closely with NVIDIA for months;
➂ NVIDIA abandoned the Cordelia design for GB300, reverting to the older Bianca layout, which limits GPU replacement flexibility but expedites production.
➀ Solar inverters and energy storage batteries contain undocumented cellular communication interfaces, potentially enabling covert remote access;
➀ Reuters reports unidentified manufacturers, with concerns these interfaces could bypass security firewalls in critical power infrastructure;
➂ The discovery highlights cybersecurity risks but lacks specifics on exploit incidents or responsible parties.
① Sparkle showcased its Intel Arc Pro B60 GPUs at Computex 2025, confirming dual-GPU prototypes for AI inference and professional workloads;
② The card features 24GB GDDR6 memory and three cooling solutions (blower, passive, and liquid), though liquid cooling's necessity for a 200W TDP design is questioned;
③ Priced for workstation/server markets, these entry-level GPUs aim to compete via affordability rather than raw performance.
➀ TSMC's first European Design Center in Munich is set to launch in Q3 2025;
➁ Focuses on developing high-density, high-performance, and energy-efficient chips for automotive and industrial applications;
➂ The center will offer design support and collaborate with ecosystem partners to strengthen TSMC's presence in Europe's semiconductor market.
➀ The Power2Change exhibition, running from May to November 2025 at DB Museum Nürnberg, explores pathways to climate-neutral energy solutions in industry, economy, and transport;
➁ Featuring interactive exhibits, it addresses CO₂ utilization for materials, hydrogen/e-fuel aviation, and engages visitors with polls on energy transition challenges and societal acceptance;
➂ Funded by the German Federal Ministry, the exhibition is part of the 2025 Science Year initiative, highlighting collaborative research and innovation for a sustainable energy future.
➀ Brite Semiconductor launched Ternary Content-Addressable Memory (TCAM) IP based on 28HKC+ 0.9V/1.8V process, targeting high-performance applications;
➁ The IP features high-frequency operation and low power consumption, addressing growing demands for efficient data lookup in networking and computing;
➂ Designed for applications in networking, data centers, 5G infrastructure, and AI acceleration, enhancing energy efficiency in memory-intensive systems.
➀ Toshiba's 1 kW Full-Bridge DC-DC Converter reference design targets server power supplies, achieving 94.7% efficiency at full load with phase-shifted full-bridge topology and synchronous rectification；
➁ The compact design (207×120×45 mm) operates at -36 V to -60 V input, delivering 54 V output, and utilizes high-performance MOSFETs and photocouplers for reliable isolation；
➂ Includes complete BOM, schematics, and PCB layouts to accelerate development of energy-efficient power systems for data centers and telecommunications.
