➀ YEST announced that it will supply 11.16 billion won worth of eFurnace to SK Hynix; ➁ The eFurnace is used for purifying wafers and enhancing their electrical properties; ➂ SK Hynix is expected to use the equipment in HBM production.

➀ Overclocker AKM sets a new DDR5 memory frequency world record of 12527MHz; ➁ The record is achieved with an Intel Core Ultra 9 285K Processor, ASRock Z890 Taichi OCF motherboard, and V-COLOR Manta XFinity DDR5 memory; ➂ ASRock's design features contribute to the record-breaking performance.

➀ Samsung is developing customized HBM4 memory solutions for Meta and Microsoft; ➁ Mass production is expected by the end of 2025; ➂ The new HBM4 memory will offer 2TB/sec bandwidth and up to 48GB capacities.

➀ DDR5 memory speed world record broken by overclocker AKM; ➁ DDR5-12264 achieved with Intel Core Ultra 9 285K, V-COLOR XFinity memory, and ASRock Z890 Taichi OCF; ➂ New record surpasses previous DDR5-12112 record.

➀ SK Hynix is scheduled to provide samples of its Gen 5 HBM, HBM3E 16H, in early 2025; ➁ The HBM3E 16H features 16 stacked DRAM dies and will utilize mass reflow molding technology; ➂ SK Hynix CEO Kwak Noh-jung announced this at an event hosted by SK Group.

➀ NVIDIA CEO Jensen Huang requested SK hynix to accelerate the supply of HBM4 memory by six months; ➁ SK hynix originally planned to have its next-gen HBM4 memory ready in the second half of 2025; ➂ NVIDIA currently uses SK hynix's HBM3E memory for its AI chips and plans to use HBM4 in its upcoming Rubin R100 AI GPU.

➀ Samsung Electronics reported a better-than-expected profit in its third-quarter earnings, despite a significant decline in profits. ➁ The company highlighted its advancement in high-bandwidth memory (HBM) supply. ➂ Samsung hinted at a potential partnership with TSMC, indicating a strategic move in the semiconductor industry.

➀ DDR5 prices remain stable; ➁ DDR4 prices are unlikely to rebound in the near future; ➂ Market analysis suggests stable DDR5 prices and limited prospects for DDR4 price recovery.

➀ G.SKILL and ASUS ROG set a new DDR5 frequency world record at 12,112 MT/s; ➁ The record was achieved using G.SKILL Trident Z5 RGB memory and Intel Core Ultra 9 285K CPU; ➂ The record-breaking performance showcases the capabilities of the latest Intel processors and G.SKILL DDR5 memory.

➀ Samsung is reportedly planning to introduce 400-layer vertical NAND by 2026; ➁ The company aims to reach a 1,000-layer NAND target by 2030; ➂ This move is part of the competition in the memory market, especially with HBM becoming a crucial battlefield in the AI era.

➀ Samsung is developing Selector-Only Memory (SOM), a new type of memory that combines the properties of RAM and SSDs. ➁ Researchers used advanced computer modeling to narrow down 4,000 potential material combinations to 18 prime candidates. ➂ The findings will be presented at the International Electron Devices Meeting in December.

➀ Kingston sets a new memory overclocking world record with its FURY Renegade DDR5 CUDIMM at 12,108MT/s; ➁ The record was achieved on Intel's Z890 platform with liquid nitrogen cooling; ➂ Kingston's 8400MT/s CUDIMM modules are tested and qualified for high-performance applications.

➀ The RISC-V and open-source functional verification challenge highlights the differences in verification processes between RISC-V and ARM cores. ➁ The importance of selecting a reliable IP vendor and the impact of software support on verification is discussed. ➂ The role of RISC-V profiles in simplifying verification and enabling software compatibility is emphasized.

➀ Google is rumored to switch to TSMC's N3E process for Tensor G5; ➁ The report also clarifies that Google has chosen not to use 2nm technology for Tensor G6; ➂ The move could impact the competition in the AI and smartphone chip markets.

➀ Arm is exploring the feasibility of running LLMs on mobile devices; ➁ Arm's optimization techniques for LLMs on mobile; ➂ The importance of practical use cases for LLMs in mobile devices

➀ Electron Beam Probing (EBP) has become a powerful method for security analyzing of sub-7nm ICs. ➁ It offers better spatial resolution than optical probing and is suitable for sub-7nm flip-chips and advanced 3D architectures. ➂ The research focuses on the importance of EBP in failure analysis and hardware assurance.

➀ The NVIDIA GeForce RTX 5070 12GB is rumored to be 5% faster in rasterization than the RTX 4070 Ti SUPER; ➁ It is expected to offer 5-10% more performance in RT; ➂ The RTX 5070 18GB version is rumored to have faster GDDR7 memory modules and 50% more VRAM.

➀ Intel's Core Ultra 200S desktop CPUs are launching; ➁ Non-K variants may have DDR5 support limitations; ➂ Arrow Lake non-K CPUs will top out at DDR5-7200.

➀ NVIDIA's next-generation GeForce RTX 5070 is rumored to launch with 18GB of GDDR7 memory; ➁ Initially, it will be available in a 12GB model, breaking the VRAM mold; ➂ The 18GB version could be the RTX 5070 SUPER 18GB.

➀ NVIDIA's next-gen GeForce RTX 5090 Laptop GPU rumored to have 24GB of ultra-fast GDDR7 memory on a 256-bit memory bus; ➁ Expected to launch in Q1 2025; ➂ Speculation on the overall lineup and potential configurations.