Recent #memory news in the semiconductor industry
➀ The article revisits a historical advertisement from Electronics Weekly's July 1978 issue, focusing on semiconductor components like Zener diodes;
➁ It highlights nostalgic insights into the electronics industry's past, emphasizing the evolution of technology and components;
➂ Authored by David Manners, a veteran journalist with over four decades of experience covering the electronics sector.
➀ Tech enthusiast Bitluni recreated a Commodore 64 Datasette using 1993 microcassette tech, achieving 1MB storage per tape (5x original capacity);
➁ Custom PCB design, 3D-printed housing, and signal optimization enabled real-time data transfer at 500bps;
➂ Future plans include USB-C mass storage integration and running C64 emulators directly from tapes.
➀ David Manners reflects on a witty 65-year-old advertisement from Electronics Weekly's December 1960 edition;
➁ The article highlights Manners' four-decade experience in covering the electronics industry and its trends;
➂ It serves as a nostalgic look back at historical tech marketing and industry evolution.
➀ WSTS reports H1 2025 semiconductor market growth of 18.9% YoY, reaching €346 billion, driven by data center demand and early AI Edge applications;
➁ 2025 full-year forecast revised upward to €728 billion (15.4% growth), with logic and memory sectors expected to grow 29% and 17%, respectively;
➂ Geographically, the Americas and Asia Pacific lead expansion, Europe strengthens, while Japan faces a slight decline; 2026 growth projected at 9.9% to €800 billion.
➀ Simulation studies using SEMulator3D expose structural challenges in 3D NAND memory when layers exceed 300, with stress causing bending and collapse;
➁ Two DOE analyses identified that balancing silicon nitride (SiN) and oxide layer properties mitigates deformation, highlighting material optimization as key;
➂ Virtual testing offers a cost-effective method to explore designs and improve yield without physical fabrication.
➀ A severely damaged AMD Radeon RX 7800 XT, previously subjected to a failed DIY oven reflow attempt, was expertly repaired by Northwest Repairs through GPU core and VRAM reballing;
➁ Thermal imaging and memory tests revealed short circuits and faulty VRAM chips, requiring meticulous component replacement and pad repairs;
➂ The restoration highlights the technical mastery of professional repair services in salvaging high-end hardware, emphasizing sustainability and the value of skilled craftsmanship in DIY culture.
❶ Kioxia introduces 128GB, 256GB, and 1TB UFS 4.1 embedded flash memory for automotive applications, supporting up to 115°C; 512GB version to follow.
❷ Compliant with AEC-Q100/104 Grade 2 standards, targeting infotainment, ADAS, telematics, and vehicle computers.
❸ Delivers 2.1x sequential read, 2.5x write, and up to 3.7x random write improvements over UFS 3.1.
➀ The article lists the top ten fabless semiconductor companies in Q1 2025, based on data from research firm TrendForce;
➀ It highlights the rankings and market dynamics within the fabless industry, emphasizing the role of key players in driving semiconductor innovation;
➂ The analysis underscores trends such as AI demand, memory advancements, and high-performance computing (HPC) influencing the competitive landscape.
➀ SEMI forecasts semiconductor manufacturing equipment sales to grow 7.4% YoY to $125.5B in 2025, with further growth to $138.1B in 2026 driven by logic, memory, and next-gen technologies;
➁ Wafer Fab Equipment (WFE) and backend segments (test, assembly/packaging) show strong growth, fueled by AI, HBM demand, and advanced nodes like 2nm GAA, though automotive/consumer sectors lag;
➂ Regional investments led by China, Taiwan, and Korea face trade policy risks, while NAND/DRAM rebounds highlight memory's role in AI infrastructure.
➀ Kioxia is sampling 512Gbit TLC flash memory using 9th-gen 3D technology, targeting mid-low capacity storage and enterprise SSDs for AI systems;
➁ Features 61% write/12% read performance gains, 36% write/27% read efficiency improvements, with 3.6Gbit/s Toggle DDR6.0 speeds;
➂ Targets IoT/automotive embedded systems, uses wafer-level bonding for CMOS-memory integration, commercial production planned FY2025.
➀ The G.Skill Trident Z5 Neo RGB DDR5-6000 C26 96GB kit delivers outstanding out-of-box performance and tight timings, optimized for AMD Ryzen systems.
➀ With 96GB (2x48GB) capacity and DDR5-6000 speeds, it excels in professional workloads and gaming, though it requires 1.45V voltage and offers limited overclocking headroom.
➂ Priced at $479.99, it’s a premium choice for users needing high-capacity RAM on dual-DIMM motherboards, despite its higher cost.
➀ CXMT delays mass production of DDR5 memory to late 2025 due to quality and yield challenges, with rates around 50% and resolved thermal issues through costly redesigns;
➁ The company's DDR5 quality now matches Nanya Technology, but global competitiveness is hampered by outdated 16nm process and U.S. export restrictions on equipment maintenance;
➂ China's state-backed expansion targets 280,000 wafers monthly by 2025, though reliance on foreign tools (80% imported) poses long-term risks amid geopolitical tensions.
➀ Researchers developed the world's first comparator-free memory sorting chip using memristor-based PIM architecture and Tree Node Skipping algorithm;
➁ The system achieved 7.7× speed improvement and 160.4× energy efficiency compared to ASIC solutions, enabling real-time applications;
➂ Demonstrated versatility in path planning and AI acceleration, paving the way for next-gen edge computing and intelligent hardware.
➀ G.Skill 与专业超频者 bl4ckdot 合作,刷新了 DDR5 内存频率的世界纪录;
➁ 新纪录为 12,872MHz,使用 G.Skill Trident Z5 DDR5 内存单条 24GB 模块,并采用液氮冷却;
➂ 该成就展示了 G.Skill 对内存超频性能的承诺,并在 HWBOT 领跑者榜单上领先于 Corsair 的 Vengeance RAM。
➀ The article highlights a 1960 Electronics Weekly advertisement celebrating the emergence of silicon transistors;
➁ It marks the 65th anniversary of this milestone in semiconductor technology development;
➂ The content reflects on historical advancements through the blog's "Memory Lane" series.
➀ G.Skill展示了在ASUS ROG Maximus Z890 Hero CAMM 2主板上运行的10,000MHz DDR5内存;
➁ CAMM2形式因具有更好的散热和信号完整性;
➂ G.Skill的64GB CAMM2模块在DDR5-10000 CL52下运行,并通过Memtest进行100%覆盖测试。
➀ IQE and Quinas Technology announced the completion of a £1.1m UltraRAM industrialisation project, developing scalable GaSb epitaxy for memory devices;
➁ ULTRARAM integrates non-volatility of flash storage with the speed and efficiency of DRAM, targeting AI, quantum computing, and space/defense applications;
➂ The project leveraged Innovate UK funding and IQE's industrial capabilities, advancing sovereign memory technology in the UK semiconductor sector.
➀ The article revisits a 1960 Electronics Weekly piece discussing historical technological advancements;
➁ It references the UK's former dominance in computers and business perspectives on the space program;
➂ Highlights the significance of GEC Semiconductors and reflects on past semiconductor industry developments.