➀ Minisforum announced a slight price adjustment on its mini PC models due to rising global raw material costs.

➁ The price increase will affect models with DDR5 memory and SSD storage, while barebone models and accessories will remain unchanged.

➂ The increase is attributed to the soaring demand for DRAM and NAND flash memory chips driven by AI workloads.

➀ Samsung reported strong Q3 results with operating profit of $8.6 billion, up 160% quarter-on-quarter and 8.9% year-on-year;

➁ Memory chip sales reached $23.6 billion, with operating profit surging 81% to $4.9 billion due to rising AI server demand;

➂ The company highlighted robust growth in smartphone and wearable sales, driven by its latest folding phone launch, while forecasting continued AI infrastructure investments.

➀ Renesas Electronics launches RA8M2 and RA8D2 MCUs featuring 1GHz Arm Cortex-M85 cores and MRAM technology for edge computing applications;

➁ Embedded MRAM enables faster data writes, 100x higher endurance than flash, and energy-efficient real-time control in industrial/IoT systems;

➂ Integrated graphics engine, ML acceleration, and TSN-enabled Ethernet support advanced HMI and AI-driven automation solutions.

➀ Micron has started sampling its new 192GB SOCAMM2 module, which is the largest-capacity SOCAMM2 module on the planet.

➁ The module is optimized for large data center clusters and offers 50% more capacity in the same small footprint.

➂ It delivers more tokens for every watt of power, making it ideal for AI servers.

➀ JEDEC announced version 1.4 of the DDR5 SPD Contents standard (JESD400-5D), enhancing memory initialization and optimization for BIOS;

➁ The update adds support for DDR5-9200 speeds, introduces codes for SOCAMM2 modules, and expands error logging for MRDIMMs;

➂ The standard applies to all DDR5 modules, reflecting JEDEC's role in unifying industry solutions with input from 360 member companies.

➀ A new analog computing method integrates computation directly into resistive memory chips, eliminating data transfer bottlenecks between memory and processors;

➁ The system uses low-precision initial calculations followed by high-precision corrections, achieving 32-bit digital processor accuracy with 100x improved energy efficiency;

➂ Demonstrated 16×16 matrix processing in wireless communication tests, showing potential for 1,000x faster AI hardware at 100x lower energy consumption.

➀ The electronic components market faces widespread uncertainty, with DRAM supply tightened due to AI-driven HBM demand and Micron's temporary price suspension spooking buyers;

➁ Texas Instruments (TI) raised prices by 15-70% on select products and discontinued certain lines, while Vicor announced a 10% price hike;

➂ Procurement teams are advised to monitor tariffs, diversify suppliers, and avoid single-source components to mitigate risks.

➀ Western Digital offers a 13% discount on two 26TB WD Red Pro NAS drives, reducing the price per drive to $449.99;

➁ The helium-sealed HDD features 11 platters, 7200 RPM, OptiNAND tech, and a 272 MB/s transfer rate for enterprise-grade NAS environments;

➂ Designed for 24/7 operation with vibration sensors and a 550TB/year workload rating, targeting users needing bulk storage.

➀ August 2025 semiconductor sales reached $64.9 billion, up 21.7% year-over-year and 4.4% month-over-month;

➀ Growth was driven by strong sales in the Asia Pacific and Americas regions, with memory and logic chips showing significant increases;

➀ Year-over-year sales rose in most regions except Japan (-6.9%), while month-to-month sales saw growth across all regions.

➀ The rise of AI has driven unprecedented demand for data center hardware, including graphics chips and high-speed storage.

➁ Phison CEO Pua Khein-Seng predicts severe NAND shortages through 2035.

➂ He attributes this to limited investment in flash memory and the shift towards SSDs as HDDs become obsolete.

➀ Micron's Crucial LPCAMM2 memory modules reach new heights in speed, designed for thin, high-performance laptops.

➁ The new memory solution is 1.52x faster than standard DDR5 SODIMMs and is compatible with next-gen AI mobile workstations.

➂ Micron offers the 8,533 MT/s memory in 32GB and 64GB capacities, with prices starting at $232.99 for the 32GB kit.

➀ A 1978 article by Mike Evans of National Semiconductor highlighted the critical role of efficient memory usage in microprocessor systems and the lack of universal controllers for MADRAMs (Multiplexed Address DRAMs) in multi-chip configurations;

➁ MADRAMs, like the MM5290, utilized separate row/column strobes for page-mode operation but required specialized controllers that limited timing and power-saving optimizations;

➂ The article proposed a general-purpose MADRAM controller to bridge 8/16-bit microprocessors with various memory setups, focusing on address multiplexing and selective RAS activation for enhanced efficiency.

➀ A retrocomputing enthusiast successfully repaired a 1994 Sound Blaster 2.0 ISA card by replacing a missing Atmel MCU chip and restoring damaged circuits, reviving its iconic 8-bit audio capabilities;

➁ The Sound Blaster 2.0 revolutionized PC gaming in the 1990s with FM synthesis and Direct Memory Access (DMA), enabling realistic sound effects without taxing CPU performance;

➂ Adrian's restoration process, documented in a YouTube tutorial, highlights the card's historical significance as a bridge between AdLib compatibility and modern digital audio standards.

➀ In 1978, IBM scientists experimentally developed magnetic bubbles 8 times smaller than commercial garnet-based ones, promising a dramatic increase in memory density (e.g., 3 million bits to 100 million bits per square inch);

➀ The research by Edward Giess and Robert Kobliska analyzed garnet properties and magnetic interactions, laying groundwork for submicron bubble device design;

➂ IBM emphasized that smaller bubbles reduce chip costs by enabling higher data density, serving as foundational progress for future memory technologies.

➀ Chinese researchers developed a prototype DNA-based storage system mimicking magnetic tape, achieving theoretical petabyte/km density but currently limited to 156KB/hour speeds;

➁ The system uses barcode-addressed polyester-nylon tape with ZIF-protected DNA payloads, claiming 300+ year shelf life at room temperature;

➂ Despite automated cartridge loading and addressing capabilities, commercial viability remains hampered by slow DNA synthesis/sequencing bottlenecks.

➀ Gigabyte and V-Color have partnered to create a 'groundbreaking' DDR5 memory kit with an integrated OLED display;

➁ The XFinity+ DDR5 modules by V-Color feature a real-time monitoring OLED display that communicates with the motherboard;

➂ The display can show memory capacity, speed, timings, voltage, temperature, and more, with a patent on the technology.