➀ CEA-Leti is developing optical interposers using silicon photonics; ➁ The new technology, called Starac, aims to reduce communication delays; ➂ Starac uses an ONoC for high-speed data transmission between chiplets without intermediate hops.

➀ Contract prices of DRAM and NAND dropped by over 10% in September; ➁ The decline was due to low demand for PCs and consumer electronics; ➂ DDR4 8Gb 1Gx8 prices fell by 17.07% to US$1.7.

➀ DB Hitek is on the verge of signing a ten-year deal to manufacture power management ICs for Tesla vehicles. ➁ The quality control staff of the US carmaker visited DB Hitek's facility in South Korea for an inspection in June. ➂ The deal involves manufacturing power management ICs for Tesla vehicles.

➀ LPKF refutes Philoptics' claims about its TGV technology; ➁ Philoptics alleged LPKF's technology offers limited hole sizes; ➂ LPKF disputes Philoptics' claim of technological superiority.

➀ Intel has secured $8.5 billion in new funding from Apollo Global Management; ➁ The move is seen as a vote of confidence in Intel's turnaround strategy; ➂ Qualcomm is rumored to be considering a takeover bid for Intel.

➀ Samsung is expected to tape-out its next-generation HBM4 memory in Q4 2024. ➁ Mass production of HBM4 is scheduled for Q4 2025, targeting NVIDIA's next-gen Rubin R100 AI GPU. ➂ The AI industry's demand is driving the growth of HBM memory, with SK hynix and Samsung investing heavily in production capabilities.

➀ UCIe standardizes chiplet communication, lowering barriers and fostering innovation. ➁ It enables specialized and customized solutions by allowing mix-and-match of chiplets from various vendors. ➂ UCIe supports custom silicon for AI applications, enhancing performance and efficiency.

➀ Glass substrates offer superior flatness and higher interconnect densities, potentially replacing organic substrates and silicon interposers. ➁ They provide better thermal matching with silicon dies and can handle higher chip densities. ➂ Challenges include brittleness, adhesion issues, and lack of industry standards.

➀ The data center processing market shows robust growth, especially in processing, with a 20.3% increase. ➁ Nvidia dominates the market in terms of both revenue and profits, with a significant lead over competitors. ➂ The supply chain for AI GPUs has evolved, with memory supply becoming a critical component.

➀ Intel's next-gen Panther Lake CPU has been powered on and is on track for 2025 production on the Intel 18A process node. ➁ The CPU features up to 16 cores and up to 12 Xe3-GPU cores, primarily designed for mobile devices. ➂ Intel 18A process node has also been deployed for an external customer, featuring RibbonFET and PowerVIA technologies.

➀ The panel discussed the challenges of power efficiency in AI and data centers, highlighting the need for 3D hybrid bonding for denser and more power-efficient interconnects. ➁ Intel Foundry emphasized a systems approach to integrating 3D IC products, aiming for CAD agnostic tool flows and System Technology Co-Optimization (STCO). ➂ Qualcomm focused on co-optimization and shift-left strategies, staying EDA vendor-agnostic to tackle multi-physics challenges.

➀ Intel's latest earnings report indicates a deeper plunge into its financial woes, with revenue and gross margin missing guidance. ➁ The company is making tough decisions, including headcount reduction and capital expenditure cuts, to address its financial challenges. ➂ Intel is also leveraging creative financing strategies, such as the Semiconductor Co-Investment Program, to support its manufacturing expansion plans.

➀ Lam Research reported good financial results but provided a softer guidance, leading to investor disappointment. ➁ Applied Materials' request for CHIPS Act funding for their Epic facility seems to have been denied. ➂ The semiconductor industry is expected to recover steadily, but at a slower pace than previous cycles, influenced by factors like AI and HBM, as well as declining margins from Chinese customers.

1. SK Hynix plans to invest 9.4 trillion won to construct a new fab in response to the high demand for memory chips driven by AI. 2. The new fab will be located at the Yongin Semiconductor Cluster, a new industrial zone supported by the South Korean government. 3. Construction of the fab is set to commence soon.

1. TSMC plans to use ASML's High-NA EUV lithography machines for its A14 process node in Q3 2027 and A14P in 2028; 2. TSMC is ASML's largest customer and a key driver for its future growth; 3. The first wave of orders for High-NA EUV machines is estimated to be around 70 units, worth $26.6 billion.

1. Dr. Babak Taheri discusses his role as CEO of Silvaco, a provider of software platforms for design and fabrication. 2. Silvaco specializes in AI-assisted digital twin modeling, serving markets like automotive, display, and memory. 3. The company faces challenges in managing complexity, time-to-market, and cost management in the semiconductor industry.

1. IROC Technologies introduces an upgraded version of SoCFIT for soft error analysis and mitigation at #61DAC. 2. SoCFIT provides comprehensive error propagation analysis and detailed vulnerability reporting. 3. The new release includes FDR FastSIM, which offers 1,000 times faster fault propagation simulation.

1. Genesem, a semiconductor packaging firm, has provided next-generation hybrid bonding equipment to SK Hynix. 2. The equipment is intended for use in the production of high-bandwidth memory (HBM). 3. Two units of the equipment have been installed at SK Hynix’s pilot fab for testing purposes.

1. Doosan Tesna plans to integrate chip packaging capabilities with its existing chip testing business. 2. The goal is to develop the company into an integrated outsourced semiconductor assembly and test firm. 3. This move likely aims to offer comprehensive services including wafer test and packaging.

1. NVIDIA, TSMC, and SK hynix have formed a 'triangular alliance' to lead the development of next-gen AI GPUs and HBM4 memory. 2. SK hynix president Kim Joo-sun is expected to discuss next-generation HBM collaboration plans with TSMC executives at SEMICON Taiwan. 3. The alliance aims to dominate the AI GPU market with HBM4 entering mass production in 2026.