➀ The panel discussed the challenges of power efficiency in AI and data centers, highlighting the need for 3D hybrid bonding for denser and more power-efficient interconnects. ➁ Intel Foundry emphasized a systems approach to integrating 3D IC products, aiming for CAD agnostic tool flows and System Technology Co-Optimization (STCO). ➂ Qualcomm focused on co-optimization and shift-left strategies, staying EDA vendor-agnostic to tackle multi-physics challenges.