➀ The Fraunhofer Institute for Production Systems and Design Technology IPK presents research projects and solutions addressing the challenges of modern manufacturing; ➁ The focus is on data management, flexible manufacturing processes, machine efficiency, human resource support, and sustainable production; ➂ The article highlights the importance of holistic system solutions and interdisciplinary collaboration in research and innovation.

➀ SemiWiki celebrates its 14th anniversary; ➁ The author reflects on his journey in the semiconductor industry; ➂ The evolution of SemiWiki from a blog to a leading industry platform.

➀ Intel's Foundry Services (IFS) division is struggling with low wafer yields and projected cumulative losses. ➁ Selling IFS could provide Intel with $30 billion to focus on core operations, but might hinder IDM 2.0 strategy. ➂ The decision hinges on whether Intel should continue investing in IFS or sell it to reduce financial risks.

➀ Intel needs to fill its fabs to remain competitive; ➁ TSMC's rapid expansion with new partnerships; ➂ The potential of a Common Foundry Platform Alliance for Intel.

➀ FOUP cleaner manufacturer ISTE is expanding into plasma-enhanced chemical vapor deposition (PECVD) equipment; ➁ The CEO of the fab equipment maker, Cho Chang-hyun, mentioned this during the company’s conference; ➂ The PECVD equipment market is 30 times larger than the FOUP market.

➀ PDF Solutions to host AI Executive Conference focusing on AI in semiconductor design and manufacturing; ➁ Featuring keynotes, presentations, and panels from industry leaders; ➂ Discussing AI deployment, digital transformation, and use cases.

➀ Samyang NC Chem, a photoresist firm, has been fined 16 times in the past six years; ➁ The fines have raised concerns as the company is preparing for its IPO; ➂ The company operates two factories in Gongju City, South Choongcheong Province.

➀ EdgeCortix is focused on energy-efficient AI processing; ➁ Solving AI performance and power inefficiency at the edge; ➂ Strong demand in smart cities, industrial, aerospace, and security industries.

➀ South Korea's semiconductor industry is facing increasing pressure from Taiwan's aggressive R&D efforts; ➁ The report from Business Korea suggests that South Korea's labor regulations may weaken its competitiveness in the semiconductor sector; ➂ The intensifying competition in the industry may impact the global semiconductor landscape.

➀ Apple is reportedly in talks with Foxconn; ➁ to manufacture AI servers in Taiwan; ➂ as part of its strategy...

➀ OpenLight is the first open silicon photonics platform with integrated lasers; ➁ Solves challenges in design, manufacturing, and deployment of silicon photonics; ➂ Strongest application areas include data centers, AI/ML, and HPC; ➃ Focuses on scalability and efficiency for photonic components; ➄ Differentiates by enabling direct integration of active components into silicon; ➅ Developing advanced PICs and expanding portfolio with 1.6Tb products.

➀ China's manufacturing Purchasing Managers' Index (PMI) has rebounded into expansion territory, marking the first expansion in nearly six months; ➁ This comes after a five-month contraction phase; ➂ The data was released by the National Bureau of Statistics, indicating a positive trend in the country's manufacturing sector.

➀ Intel's latest earnings report indicates a deeper plunge into its financial woes, with revenue and gross margin missing guidance. ➁ The company is making tough decisions, including headcount reduction and capital expenditure cuts, to address its financial challenges. ➂ Intel is also leveraging creative financing strategies, such as the Semiconductor Co-Investment Program, to support its manufacturing expansion plans.

1. Apple is rumored to manufacture its higher-end iPhone 16 Pro and iPhone 16 Pro Max in India for the first time. 2. The decision is aimed at deepening manufacturing capabilities with partners in India. 3. The India-assembled iPhone 16 models are expected to be available in the country after the launch in 2025.

1. TSMC plans to use ASML's High-NA EUV lithography machines for its A14 process node in Q3 2027 and A14P in 2028; 2. TSMC is ASML's largest customer and a key driver for its future growth; 3. The first wave of orders for High-NA EUV machines is estimated to be around 70 units, worth $26.6 billion.

1. NVIDIA introduces the GB200 AI superchip, dubbed the 'most powerful AI chip on earth'; 2. Taiwan's Foxconn and Quanta Computer secure major assembly contracts for GB200 AI servers, with Foxconn at 40% and Quanta at 30%; 3. Shipments for the GB200 AI servers are expected to begin in Q3 2024, with mass production of NVIDIA's DGX GB200 starting in the second half of the year, aiming for around 40,000 units in 2025.

1. TSMC's 3nm supply exceeds demand, with major US tech companies like AMD, Apple, NVIDIA, Qualcomm, and others fully utilizing production capacity with orders expected to continue through 2026. 2. TSMC plans to increase 3nm OEM prices by more than 5%, and the annual quotation for advanced packaging in 2026 is also expected to rise by 10-20%. 3. TSMC's stock price has reached a record high, and the company is investing in advanced processing and packaging technologies, expecting a 'double success'. 4. The Zhunan Advanced Packaging Factory (AP6) has been operational for a year, and with the arrival of new AP6C machines, it has become Taiwan's largest CoWoS advanced packaging facility. 5. In 2024, TSMC's monthly CoWoS production capacity is expected to nearly double, from 17,000 to 33,000 pieces. 6. Advanced packaging production is in high demand, with NVIDIA accounting for about half of the capacity, followed by AMD, Broadcom, Amazon, and Marvell. 7. NVIDIA, with a gross profit margin close to 80%, is unlikely to give up newly opened advanced packaging production capacity and will adopt a price increase and profit-sharing strategy. 8. TSMC's additional CoWoS-related equipment is expected to be in place in Q3 2024, requiring more engineers at various factories. 9. Prices for advanced processes, including 3nm and 5nm, will also be adjusted, with strong 3nm orders in the second half of the year and high utilization rates extending into 2025. 10. The shortage of advanced packaging production capacity is expected to continue into 2025, with a projected production of over 600,000 pieces, and TSMC's supply for next year estimated at 530,000 pieces, indicating a gap of around 70,000 pieces.

➀ eSIM technology is gaining attention in India due to its potential to drive digital manufacturing growth; ➁ The rise of IoT and the need for flexible and secure connectivity are fueling the demand for eSIMs; ➂ Kigen, a global leader in eSIM security, is supporting India's eSIM ecosystem with its GSMA SAS-UP certification.

➀ TSMC is set to acquire its first high-NA EUV lithography machine by the end of the year; ➁ Intel currently has two of these $350 million machines; ➂ TSMC plans to use the new machines for its A10 process in 2030, two generations after its 2nm process.