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March 6
- CEO Interview with Pradyumna (Prady) Gupta of Infinita Lab
➀ Dr. Prady Gupta is the Founder and Chief Scientist at Infinita Lab and Infinita Materials, focusing on materials testing and specialized chemicals for high-tech industries.
➁ Infinita Lab offers a network of over 2,000 accredited labs for comprehensive materials testing services.
➂ Infinita Materials specializes in custom inorganic chemicals for sectors like semiconductors and batteries.
March 5
- Executive Interview: Steve Howington of the High Performance Flooring Division of Sherwin-Williams
➀ Sherwin-Williams is a global leader in protective coatings for semiconductor fabs.
➁ The company addresses challenges like tight deadlines and labor shortages with efficient solutions.
➂ Steve Howington emphasizes the company's partnership approach and expertise in semiconductor construction.
March 4
- Unlocking the cloud: A new era for post-tapeout flow for semiconductor manufacturing
➀ The complexity of semiconductor chip design has increased the demand for scalable cloud solutions in post-tapeout flow management.
➁ Cloud platforms offer dynamic scaling and cost-effective resource management.
➂ Strategic partnerships and cloud services like Siemens EDA and AWS are revolutionizing PTOF processes.
- SemiWiki Outlook 2025 with yieldHUB Founder & CEO John O’Donnell
➀ yieldHUB在2024年扩展了其数据科学团队，推动了AI集成和现有客户基础的扩大；
➁ 公司面临在开发下一代平台的同时满足当前平台增长需求的挑战；
➂ yieldHUB即将推出yieldHUB Live，这是一款AI驱动的实时监控系统，旨在改进测试流程和减少停机时间。
March 3
- Powering the Future: How Engineered Substrates and Material Innovation Drive the Semiconductor Revolution
➀ Engineered substrate technology is driving the semiconductor industry from traditional planar scaling to innovative materials and 3D integration.
➁ Companies like Soitec, Intel, and Samsung are leading the adoption of this technology.
➂ Foundries are increasingly recognizing the strategic importance of engineered substrates like Fully Depleted SOI (FD-SOI) for their benefits in cost and performance.
March 1
- CEO Interview: Dr. Andreas Kuehlmann of Cycuity
➀ Cycuity specializes in semiconductor security products and services.
➁ The Radix platform provides early detection of security weaknesses.
➂ Dr. Kuehlmann emphasizes the importance of security in semiconductor design.
February 28
- The Double-Edged Sword of AI Processors: Batch Sizes, Token Rates, and the Hardware Hurdles in Large Language Model Processing
➀ AI software modeling represents a significant shift from traditional programming, enabling systems to learn from data.
➁ The complexity of AI systems lies in their model parameters, which can number in the billions or trillions.
➂ GPUs have become essential for AI processing, but they face efficiency challenges, particularly during inference with large language models.
February 27
- Is Arteris Poised to Enable Next Generation System Design?
➀ The semiconductor industry is transitioning from monolithic to multi-die designs, driven by complex AI software.
➁ Arteris is addressing challenges like the 'memory wall' with cache-coherent NOC technology.
➂ Arteris's Magillem technology helps manage and integrate numerous IP blocks in modern designs.
February 26
- Bug Hunting in Multi Core Processors. Innovation in Verification
➀ This paper discusses the post-silicon validation of the IBM POWER9 processor, highlighting its significance in the context of increasing multi-core processor adoption by hyperscalers.
➁ IBM's Threadmill, a tool for processor verification, has been enhanced since the POWER7, including optimized template allocation and debugging strategies for multi-core write drops.
➂ The validation methodology for POWER9 has significantly improved bug detection rates compared to POWER8, with new techniques like AI prioritization and hardware irritators to induce bugs.
- 2025 Outlook with Dr. Rui Tang of MSquare Technology
➀ MSquare Technology has achieved significant milestones in Chiplet technology with the launch of the ML100 IO Die.
➁ The company faced challenges in 2024 due to macroeconomic factors and technical hurdles but turned them into growth opportunities.
➂ MSquare's solutions are addressing the rapid expansion of AI and data centers with innovative Chiplet solutions.
February 25
- Synopsys Expands Hardware-Assisted Verification Portfolio to Address Growing Chip Complexity
➀ Synopsys has expanded its Hardware-Assisted Verification (HAV) portfolio to address the growing complexity of chip design.
➁ The new solutions aim to accelerate semiconductor design and system validation.
➂ Key products include the next-generation hardware engines ZeBu-200 and HAPS-200, offering significant performance improvements.
- How Synopsys Enables Gen AI on the Edge
➀ Generative AI has evolved with the rise of transformer models, improving accuracy and enabling automated creation.
➁ Running Gen AI on the edge addresses challenges like latency, privacy, and limited connectivity.
➂ Synopsys offers specialized NPUs for efficient edge-based Gen AI processing.
February 24
- Harnessing Modular Vector Processing for Scalable, Power-Efficient AI Acceleration
➀ A new chiplet-based RISC-V vector processor architecture aims to balance performance, efficiency, and flexibility for AI workloads.
➁ The architecture utilizes modular chiplets, including a vector processing chiplet and a matrix multiplication accelerator, to optimize various AI computation aspects.
➂ The RISC-V solution addresses memory bottlenecks and enhances energy efficiency with time-based execution and dynamic power gating.
- Rethinking Multipatterning for 2nm Node
➀ EUV和DUV在20nm间距下都是可行的选项；
➁ 在20nm间距下，EUV和DUV方法可以实现类似的特征尺寸和分辨率；
➂ 即使在EUV光刻中，2nm节点的任何双曝光方案仍然需要成像10nm线宽。
February 21
- CEO Interview with Dr. William Wang of Alpha Design AI
➀ Alpha Design AI is revolutionizing chip design and verification with ChipAgents, an AI tool that automates debugging and verification processes.
➁ The company is led by CEO and founder Dr. William Wang, who is also a professor at UC Santa Barbara.
➂ ChipAgents addresses industry challenges by integrating with existing EDA tools and reducing design cycle time.
- 2025 Outlook with Sri Lakshmi Simhadri of MosChip
➀ Sri Lakshmi Simhadri discusses MosChip's achievements in 2024;
➁ Challenges faced in adapting to market changes and hiring skilled professionals;
➂ Insights on the biggest growth area for 2025 in the semiconductor industry.
February 20
- Soitec: Materializing Future Innovations in Semiconductors
➀ Soitec通过其Smart Cut™技术和工程化基板，推动了芯片性能和功率效率的提升；
➁ 公司在移动通信、汽车应用和人工智能数据中心的硅光子技术方面发挥着关键作用；
➂ Soitec致力于成为半导体材料领域的可持续领导者，推动技术创新与环境保护的结合。
- Webinar: RF design success hinges on enhanced models and accurate simulation
➀ Traditional RF board design strategies are insufficient for high frequencies and dense layouts;
➁ Keysight and Modelithics collaborate on an advanced RF board simulation workflow;
➂ The use of 3D passive component models enhances simulation accuracy and reduces the risk of board re-spins.
- 2025 Outlook with Paul Wells of sureCore
➀ sureCore专注于低功耗内存解决方案，显著降低了SRAM和其他嵌入式内存的功耗；
➁ 2024年，sureCore成功实施了低功耗内存编译器，并领导了一个开发量子计算机低温IP的项目；
➂ 公司预计AI和智能医疗解决方案将在2025年推动增长，同时继续在超低功耗内存技术上进行创新。
February 18
- Samtec Advances Multi-Channel SerDes Technology with Broadcom at DesignCon
➀ Samtec showcased its Si-Fly® HD 224 Gbps PAM4 interconnect technology at DesignCon, collaborating with Broadcom.
➁ The demo featured Broadcom’s 200 Gbps SerDes technology and Samtec’s high-speed cable systems.
➂ The collaboration aims to enhance system performance and open new horizons in multi-channel SerDes technology.
- Outlook 2025 with David Hwang of Alchip
➀ Alchip预计2024年营收将超过10亿美元，实现重大里程碑；
➁ 公司专注于先进技术，包括2nm测试车间的发布和3DIC设计流程的准备工作；
➂ Alchip通过灵活且强大的3DIC设计流程应对先进封装的挑战，优化功率传输、互连和热特性。
February 17
- Synopsys Expands Optical Interfaces at DesignCon
➀ Synopsys introduces a direct drive/linear optical interface to simplify designs and reduce power consumption.
➁ Optical interconnects are crucial for data centers to overcome copper wiring limitations.
➂ Synopsys demonstrates near-error-free data transmission with TeraSignal's ultra-low power driver at DesignCon.
- AMAT- In line QTR – poor guide as China Chops hit home- China mkt share loss?
➀ Applied Materials reported lower-than-expected QTR guidance due to China market share loss.
➁ AMAT attributed the weakness to China export restrictions but analysts believe share loss is also a factor.
➂ Domestic Chinese semiconductor equipment makers are gaining market share, potentially reducing AMAT's sales.
February 12
- Embracing the Chiplet Journey: The Shift to Chiplet-Based Architectures
➀ The semiconductor industry is facing a paradigm shift due to the slowing down of traditional scaling.
➁ Chiplet-based architectures offer advantages such as modularity, customization, and improved yield.
➂ Innovations in packaging technology and pre-designed frameworks are streamlining chiplet design.
February 11
- 2025 Outlook with Oliver Jones of Sondrel
➀ Sondrel offers a comprehensive custom chip creation service focusing on meeting customer needs and ensuring quality;
➁ Anticipates growth in advanced semiconductor designs due to increasing complexity in electronics;
➂ Highlights importance of detailed project alignment with customers using an Architectural Specification stage.
February 7
- CEO Interview: Mouna Elkhatib of AONDevices
➀ AONDevices specializes in super-low-power Edge AI solutions with a focus on energy efficiency and high accuracy.
➁ The AONx360 platform simplifies ML model creation and deployment.
➂ AONDevices differentiates itself through an end-to-end approach combining ML chips, models, and software.
- Resist Loss Model for the EUV Stochastic Defectivity Cliffs
➀ EUV光刻受到随机缺陷的影响，这些缺陷在曝光剂量的‘悬崖’处增加，即在曝光的上下限处缺陷密度呈指数增长。
➁ 增加的剂量会导致抗蚀剂厚度减少，这是由于氢诱导的蚀刻，这对抗蚀剂性能和缺陷率有影响。
➂ 存在一个最佳入射剂量范围，其中剩余抗蚀剂中吸收的剂量达到最大值，最小化随机缺陷的风险。
February 5
- KLAC Good QTR with AI and HBM drive leading edge and China is Okay
➀ KLA报告第三季度营收31亿美元，非GAAP每股收益8.20美元；
➁ 预计未来季度营收30-35亿美元，非GAAP每股收益7.55-8.65美元；
➂ AI和HBM是推动高端市场增长的关键因素。
February 4
- 2025 Outlook with Uzi Baruch of proteanTecs
➀ proteanTecs提供先进的电子设备，具备自监控功能，以优化性能、降低功耗并防止故障；
➁ proteanTecs的AVS Pro™解决方案为客户实现了显著的节能效果，最高可达14%；
➂ proteanTecs通过生产测试和深度数据可见性解决方案，帮助公司优化芯片性能并缩短上市时间。
- What is Different About Synopsys’ Comprehensive, Scalable Solution for Fast Heterogeneous Integration
➀ Multi-die design and heterogeneous integration are crucial for semiconductor technology scaling.
➁ Synopsys offers a comprehensive suite of solutions for multi-die design challenges.
➂ Detailed insights into multi-die system architecture, verification, implementation, and testing are provided by Synopsys white papers.