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Today
- The SemiWiki DAC#62 Preview
➀ The 62nd Design Automation Conference (DAC) will be held in San Francisco with over 6,000 participants, featuring a new Chiplet Pavilion and AI-focused discussions in EDA;
➁ Keynotes and panels will explore AI-driven electronic design cost reduction, with experts from NVIDIA and ChipAgents sharing insights;
➂ SemiWiki will provide live coverage and host panels, highlighting technologies like AgenticAI that aim to transform chip verification.
June 1
- CEO Interview with Kit Merker of Plainsight
➀ Plainsight introduces OpenFilter, an open-source framework that simplifies large-scale computer vision deployment through containerized modular applications;
➁ The platform excels in retail, logistics, and manufacturing sectors with capabilities in object detection, real-time streaming (RTSP), and IoT integration;
➂ Differentiates through a unique filter abstraction technology that reduces development costs by 60% and enables seamless scaling from prototypes to production systems
- CEO Interview with Bjorn Kolbeck of Quobyte
➀ Quobyte is a massively scalable storage system built on hyperscaler principles, capable of handling thousands of nodes on commodity hardware with fault-tolerant architecture;
➁ It excels in AI, HPC, and sectors like EDA/life sciences, offering hybrid cloud support and a unified file-object namespace to eliminate data silos;
➂ Differentiates through extreme simplicity of deployment (production-ready in <1 hour) and cost-efficiency compared to complex appliance-based competitors.
May 29
- Synopsys Addresses the Test Barrier for Heterogeneous Integration
➀ Heterogeneous chip design faces multidimensional challenges requiring holistic solutions balancing architecture, verification, and testing;
➁ High-speed testing becomes critical for chiplet-based AI/HPC designs, demanding innovative approaches to overcome GPIO bandwidth limitations;
➂ Synopsys introduces HSGPIO technology enabling 10x faster test throughput without additional hardware, supporting multi-mode configurability for manufacturability and debug.
- Anirudh Keynote at CadenceLIVE 2025 Reveals Millennium M2000
➀ Cadence unveiled the Millennium M2000 AI supercomputer platform powered by NVIDIA Blackwell, targeting acceleration in chip design, computational fluid dynamics, and biosciences;
➁ Announced a moonshot initiative to achieve full autonomy in chip design through agentic AI, guided by an automotive-inspired SAE autonomy framework;
➂ Expanded digital twin applications beyond semiconductors to data centers, robotics, and aerospace, leveraging partnerships with NVIDIA and Google.
May 28
- Semiconductor Market Uncertainty
➀ Q1 2025全球半导体市场营收达1677亿美元，同比增18.8%，但环比降2.8%，头部企业表现分化：NVIDIA增12%，而铠侠降超20%；
➁ 关税不确定性导致Q2展望复杂，SK海力士预计增14.6%，铠侠则预降10.7%，AI需求持续支撑存储与GPU市场；
➂ 2025年全球半导体增长预测存分歧（7%-14%），IDC预计服务器/PC增速放缓，IMF因关税下调全球GDP至2.8%，产业链或延续低增长至2026年。
- Design-Technology Co-Optimization (DTCO) Accelerates Market Readiness of Angstrom-Scale Process Technologies
➀ DTCO has transformed into a predictive strategy enabling co-development of process and design, exemplified by Synopsys' collaboration with Intel on 18A technology;
➁ Key advancements include RibbonFET alignment and PowerVia optimization, boosting design productivity and power efficiency in Intel’s 18A process;
➂ Synopsys’ PICO framework expands DTCO’s scope, ensuring full-stack optimization and enabling faster market readiness through pre-silicon validation.
- Optimizing an IR for Hardware Design. Innovation in Verification
➀ LLHD, a multi-level intermediate representation (IR) for hardware design, aims to bridge high-level languages and machine code, offering optimization opportunities across EDA workflows;
➀ Cadence’s Paul Cunningham highlights LLHD’s potential for academic research but notes challenges in commercial adoption due to maturity barriers;
➂ Raúl Camposano acknowledges LLHD’s alignment with open-source compiler innovations but questions its scalability compared to software ecosystems.
May 27
- WEBINAR: PCIe 7.0? Understanding Why Now Is the Time to Transition
➀ PCIe 7.0 achieves 128 GT/s bandwidth with PAM4 signaling and enhanced error correction, extending the innovations of PCIe 6.0;
➁ Key challenges involve managing multiple data movers and link layers, favoring bifurcation and dual-port interfaces over ultra-high clock speeds;
➂ PCIe 7.0 provides SoC designers flexibility for AI/HPC systems due to its cost-efficiency and low pin count compared to parallel buses.
- Andes Technology: Powering the Full Spectrum – from Embedded Control to AI and Beyond
➀ Andes Technology offers a comprehensive RISC-V processor portfolio spanning embedded control, AI/ML acceleration, and high-performance computing (HPC), with cores ranging from ultra-low-power D23 to Linux-capable multicore AX60;
➁ The AndesAIRE platform enables tailored AI inference engines through automated custom instructions and RISC-V vector extensions, with deployments in Meta's recommendation systems and EdgeQ's 5G chips;
➂ Automotive-grade ISO 26262 ASIL-D certified processors and cybersecurity applications with Cornami's FHE solutions demonstrate cross-industry adoption, cementing Andes' 30% RISC-V market leadership.
April 1
- A Synopsys Webinar Detailing IP Requirements for Advanced AI Chips
➀ The webinar discusses the impact of generative AI on technology evolution and the rise in compute power demand.
➁ It covers the trends in larger compute chips, multi-die systems, advanced packaging, and memory architectures.
➂ Key technologies like die-to-die communication, custom HBMs, and 3D stacking are explored in detail.
- CEO Interview with Matthew Stephens of Impact Nano
➀ Matthew Stephens of Impact Nano has over 20 years of experience in advanced materials commercialization.
➁ Impact Nano is a tier 2 supplier specializing in advanced materials for semiconductor manufacturing.
➂ The company addresses challenges in materials innovation, scale-up, and manufacturing sustainability.
March 31
- An Important Advance in Analog Verification
➀ Mach42的发现平台利用机器学习创建一个代理模型，以实现更快的电路设计探索，而无需进行完整的SPICE模拟。
➁ 平台的目标是达到90%的准确率，允许快速迭代，同时保留在最终确认时进行完整准确性的选项。
➂ Mach42正在与Cadence合作开发Spectre，并计划开发Verilog-A模型，这可能会显著增强模拟-数字设计验证。
March 30
- Semiconductor CapEx Down in 2024 up in 2025
➀ Semiconductor capital expenditures (CapEx) are expected to decrease to $155 billion in 2024, before increasing to $160 billion in 2025.
➁ TSMC plans a significant increase in CapEx for 2025, estimating between $38 billion and $42 billion, while Micron Technology is projecting $14 billion.
➂ The CHIPS Act has allocated $32 billion in grants and $6 billion in loans to support semiconductor manufacturing in the U.S.
March 28
- CEO Interview with Dr Greg Law of Undo
➀ Undo's technology enables engineers to see exactly what their code did, facilitating root-cause analysis and improving collaboration.
➁ Undo is prominent in industries such as semiconductor design, databases, and networking, where debugging efficiency is critical.
➂ Undo's solution helps customers overcome challenges like development bottlenecks and missed deadlines by improving debugging processes.
- Upcoming Webinar: Accelerating Semiconductor Design with Generative AI and High-Level Abstraction
➀ Rise Design Automation has developed a solution that integrates generative AI with human expertise to improve RTL design productivity.
➁ The webinar hosted by RDA and SemiWiki will showcase how generative AI can enhance semiconductor design through high-level abstraction.
➂ The Rise AI solution translates natural-language intent into high-level design code, reducing manual effort in the design process.
March 27
- CEO Interview with Jonathan Klamkin of Aeluma
➀ Aeluma通过结合高性能材料和可扩展的硅制造技术，重新定义了半导体技术；
➁ Aeluma的技术在AI基础设施、国防、量子计算和下一代传感等领域产生了重大影响；
➂ Aeluma正在解决AI和高性能计算在扩展方面遇到的挑战，通过集成化合物半导体和大型衬底来实现大规模生产。
March 25
- Webinar: RF board design flow examples for co-simulating active circuits
➀ This webinar series focuses on 3D passive vendor component models for accurate EM-circuit co-simulation of high-frequency RF board designs.
➁ It explores simulating active circuits on boards using Modelithics models in Keysight EDA software.
➂ The Modelithics COMPLETE Library supports accurate simulations and provides a ready bill of materials.
- Ceva-XC21 and Ceva-XC23 DSPs: Advancing Wireless and Edge AI Processing
➀ Ceva recently unveiled the XC21 and XC23 DSP cores for advanced wireless and edge AI processing;
➁ The XC21 is optimized for low-power, high-performance applications in cost-sensitive markets;
➂ The XC23 provides significant performance improvements for high-end communications with AI capabilities.
- CEO Interview with Brad Booth of NLM Photonics
➀ Brad Booth, CEO of NLM Photonics, discusses his background in technology strategy.
➁ NLM Photonics aims to reduce power consumption in photonics by 50%.
➂ The company addresses the high power demands of AI data centers and focuses on energy-efficient modulation.
March 24
- Going Beyond DRC Clean with Calibre DE
➀ Achieving design rule compliance and optimal electrical performance in advanced semiconductor designs is crucial for minimizing design iterations and ensuring product reliability.
➁ Siemens Digital Industries Software's Calibre DesignEnhancer (DE) provides analysis-based EMIR solutions that enhance power integrity and reduce IR drop.
➂ Both Google and Intel utilized Calibre DE to address IR drop issues, demonstrating significant improvements in power grid robustness and electrical performance.
March 20
- Cut Defects, Not Yield: Outlier Detection with ML Precision
➀ Aggressive testing in chip manufacturing often leads to the discarding of marginally functional chips, causing waste.
➁ Traditional testing methods like PAT have limitations in detecting subtle defects.
➂ proteanTecs' outlier detection solution uses machine learning to enhance chip reliability and performance.
- 2025 Outlook with James Cannings QPT Limited
➀ QPT Limited致力于通过高频GaN电机驱动创新降低全球电力消耗5%；
➁ 2024年，与ABB合作开发了世界上首个1MHz GaN基7.5KW电机驱动；
➂ 预计2025年通过与ABB项目成果的战略合作伙伴关系，推动公司增长。
March 19
- Compute and Communications Perspectives on Automotive Trends
➀ Automotive electronics is advancing rapidly, focusing on autonomy, electrification, and car cockpit improvements.
➁ The need for advanced functionality is high, but OEMs aim to minimize costs and maximize software-driven features.
➂ Modern cars are equipped with multiple sensors, including cameras, radar, and lidar, requiring advanced fusion and processing techniques.
March 17
- How FD-SOI Powers the Future of AI in Automobiles
➀ The automotive industry is experiencing a revolution with the rise of software-defined vehicles and AI integration.
➁ Traditional ECU architectures are shifting towards centralized and zonal designs for efficiency and data handling.
➂ Soitec's FD-SOI technology is crucial for enhancing performance, energy efficiency, and reliability in next-generation automotive applications.
March 14
- CEO Interview with Fabrizio Del Maffeo of Axelera AI
➀ Axelera AI, founded in 2021, aims to provide scalable edge AI hardware and software solutions.
➁ The company has raised USD 120 million and has a world-class team of over 190 employees.
➂ Axelera AI's Metis platform offers high performance with low power consumption, targeting applications like computer vision, automotive, and healthcare.
- A Realistic Electron Blur Function Shape for EUV Resist Modeling
➀ The resolution in lithography is influenced by image blur in addition to wavelength and numerical aperture, which impacts image contrast and sensitivity to stochastic effects.
➁ Blur originates from various factors including flare, image fading, stage desynchronization, and electron behavior.
➂ Incorporating electron blur into lithography models is crucial for improving image resolution and reducing defectivity in advanced semiconductor manufacturing.
March 13
- Siemens Fleshes out More of their AI in Verification Story
➀ Siemens EDA在AI方面的深度，包括1400名AI专家和近4000项专利；
➁ 随着芯片复杂性的增加，行业预计到本世纪末将短缺27,000名专家设计师；
➂ Siemens利用三种类型的AI在验证领域：基于无监督学习的分析型AI、基于机器学习和统计分析的预测型AI，以及基于大型语言模型的生成/代理支持型AI。
- CEO Interview with Dinesh Bettadapur of Irresistible Materials
➀ Dinesh Bettadapur is the CEO of Irresistible Materials, a company specializing in EUV resist materials for semiconductor manufacturing.
➁ The company's MTR™ platform addresses limitations of traditional resist materials and offers significant cost savings.
➂ Irresistible Materials focuses on collaboration with leading semiconductor manufacturers and developing innovative solutions for EUV lithography.
March 12
- CEO Interview with Pierre-Yves Lesaicherre of Finwave CEO
➀ Finwave Semiconductor CEO Pierre-Yves Lesaicherre discusses his extensive experience in the semiconductor industry and his leadership at Finwave.
➁ The company's strategic partnership with GlobalFoundries for GaN-on-Si technology development and licensing is highlighted.
➂ Lesaicherre addresses the challenges of introducing new technology and the company's solutions for high-frequency RF communications.