➀ Intel appoints Lip-Bu Tan as its new CEO, raising concerns about potential layoffs and the future of Intel Foundry.
➁ China's chip smuggling continues with individuals and companies importing restricted AI servers, while Huawei is accused of tricking TSMC into manufacturing banned processors.
➂ AMD releases the Ryzen 9 9950X3D, dominating Intel's chips in gaming performance with its 3D V-Cache technology.
➀ A research team led by Professor Kyu-Young Park from POSTECH has developed technology to significantly increase the lifespan and energy density of electric vehicle (EV) batteries;
➁ The technology involves a 'nano-spring coating' technique that improves battery stability and performance;
➂ The research is published in ACS Nano and has the potential to revolutionize EV battery technology.
➀ Intel has achieved an exciting milestone with the first run of 18A (1.8nm-class) wafers at its Arizona fab;
➁ The milestone involves transferring the new fabrication process to a brand-new facility in Arizona;
➂ Intel plans to mass produce compute chiplets for Panther Lake processors and Xeon 7 processors for datacenters using the 18A technology.
➀ TSMC正在与Nvidia、Broadcom、Qualcomm和AMD讨论收购英特尔晶圆厂的合资企业；
➁ Sanan Optoelectronics和STMicroelectronics在重庆合资建立了32亿美元的碳化硅晶圆厂；
➂ 本周嵌入式世界2025展会的最新电子新闻综述；
➃ 德州仪器宣布其最新的微控制器是“世界上最小”的，尺寸为1.6 x 0.86mm；
➄ 美国总统特朗普对格罗夫之后英特尔CEO的表现持批评态度。
➀ Rapidus faces funding issues as it prepares to produce its first prototype chips next month.
➁ The company requires $32 billion for 2nm chip production by 2027, but has only secured $9.6 billion.
➂ The Japanese government plans to contribute an additional $674 million this year and is facing pressure to explain how the remaining $27 billion will be raised.
➀ Researchers at the Cavendish Laboratory and other institutions have discovered macroscopic magnetic behavior in phosphorene nanoribbons at room temperature;
➁ The nanoribbons, made of black phosphorus, have unique magnetic and semiconducting properties;
➂ The discovery could lead to the development of spintronic devices and advancements in computing technologies.
➀ ATLANT 3D announced a $15M Series A+ funding round led by West Hill Capital;
➁ The company's atomic-scale manufacturing technology enables precise development of advanced materials and devices for optics, photonics, microelectronics, quantum computing, sensors, and space applications;
➂ ATLANT 3D has successfully launched NANOFABRICATORTM LITE and has established partnerships with over 50 industrial and research organizations.
➀ CAST, a leading provider of silicon IP solutions, and Shikino High-Tech Co., Ltd., a Japanese company specializing in semiconductor design, imaging, sensing, and testing technologies, have announced a strategic partnership.
➁ The partnership aims to expand both companies’ reach and offerings in the global semiconductor market.
➂ The collaboration is focused on enhancing the availability of silicon IP offerings.
➀ ASML and imec have signed a new strategic partnership agreement, focusing on research and sustainability.
➁ The agreement aims to deliver valuable solutions in two areas: advancing the semiconductor industry and developing sustainable innovation initiatives.
➂ The collaboration includes ASML's full product portfolio, focusing on high-end nodes and advanced technologies.
➀ Everspin Technologies has announced new MRAM products designed for aerospace, automotive, and industrial applications. These products, part of the PERSYST EMxxLX series, meet the AEC-Q100 Grade 1 standard.
➁ The introduction of these MRAMs addresses the need for persistent, high-speed memory in challenging environments, especially in Low Earth Orbit (LEO) satellite deployments.
➂ The new MRAMs offer features like a temperature range of -40°C to +125°C, capacities of 64Mb and 128Mb, and a Quad SPI interface, making them suitable for mission-critical systems.
➀ TSMC and Intel are reportedly still working on a potential joint venture to run Intel's manufacturing capacity;
➁ The joint venture would involve leading American fabless chip designers such as AMD, Broadcom, Nvidia, and Qualcomm;
➂ The initiative is in response to a request from President Trump's administration to strengthen Intel and ensure continued American control.
➀ A new type of miniaturized pumps and valves using ultra-thin silicon films is presented at the Hannover Messe, developed by researchers at Saarland University. These pumps and valves operate without air pressure, motors, and lubricants, and can be operated in clean rooms. The team demonstrates a prototype of a new vacuum pump that can draw a vacuum up to 300 millibars.
➁ The technology is cost-effective, lightweight, and energy-efficient compared to current methods, with a 400 times lower energy consumption compared to conventional air-driven valves.
➂ The researchers have developed a novel actuator and pump technology that can be used in various applications, including robotic grippers, speakers, smart textiles, and haptic feedback.
➀ The CHIPS and Science Act, aimed at strengthening U.S. semiconductor manufacturing, is under threat of repeal by the Trump administration.
➁ The Act has already attracted nearly $450 billion in private investment from leading companies, raising concerns about the impact of its repeal on the U.S. chip market.
➂ Political hurdles and legal obligations make the repeal process complex and challenging.
➀ TSMC is in talks with Intel, Nvidia, Broadcom, Qualcomm, and AMD about a joint venture to acquire Intel Foundry;
➁ TSMC plans to take a stake of no more than 50% in Intel Foundry to maintain US ownership, as required by the White House;
➂ The deal requires approval from the White House.
➀ The power module packaging materials market is expected to reach nearly $6.1 billion by 2030, with a CAGR of nearly 11% between 2024 and 2030;
➁ Packaging materials costs accounted for approximately 32% of the total cost of power modules in 2024;
➂ The market is being reshaped with new entrants, M&As, and strategic shifts.
➀ Rajasekar Elavarasan, founder of Raana Semiconductors, discusses the company's specialization in manufacturing crystal growth machines for semiconductor-grade silicon wafers and advanced crystals used in defense applications.
➁ The Czochralski technique is highlighted as the dominant method for producing silicon wafers larger than 200mm, emphasizing its importance in reducing impurities and ensuring crystal quality.
➂ Raana Semiconductors aims to become the first company in India to manufacture solar-grade silicon wafers domestically, with plans to produce both solar and semiconductor-grade wafers within the next 36 months.
